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    • 72. 发明授权
    • Vertical channels in split-gate flash memory cell
    • 分闸式闪存单元中的垂直通道
    • US6078076A
    • 2000-06-20
    • US317645
    • 1999-05-24
    • Chrong-Jung LinChia-Ta HsiehJong ChenDi-Son Kuo
    • Chrong-Jung LinChia-Ta HsiehJong ChenDi-Son Kuo
    • H01L21/28H01L21/336H01L21/8247H01L29/423H01L29/788
    • H01L27/11521H01L21/28273H01L29/42336H01L29/66825H01L29/7883
    • A method of forming a vertical memory split gate flash memory device on a silicon semiconductor substrate is provided by the following steps. Form a floating gate trench hole in the silicon semiconductor substrate, the trench hole having trench surfaces. Form a tunnel oxide layer on the trench surfaces, the tunnel oxide layer having outer surfaces. Form a floating gate electrode layer filling the trench hole on the outer surfaces of the tunnel oxide layer. Form source/drain regions in the substrate self-aligned with the floating gate electrode layer. Pattern the floating gate electrode layer by removing the gate electrode layer from the drain region side of the trench hole Form a control gate hole therein. Form an interelectrode dielectric layer over the top surface of the floating gate electrode, and over the tunnel oxide layer. Form a control gate electrode over the interelectrode dielectric layer over the top surface of the floating gate electrode and extending down into the control gate hole in the trench hole.
    • 通过以下步骤提供在硅半导体衬底上形成垂直存储器分离栅极闪存器件的方法。 在硅半导体衬底中形成浮栅沟槽,沟槽具有沟槽表面。 在沟槽表面上形成隧道氧化物层,隧道氧化物层具有外表面。 形成填充隧道氧化物层的外表面上的沟槽的浮栅电极层。 衬底中的源极/漏极区域与浮栅电极层自对准。 通过从沟槽的漏极区域侧去除栅极电极层来对浮栅电极层进行构图在其中形成控制栅极孔。 在浮栅电极的顶表面上方,并在隧道氧化物层之上形成电极间电介质层。 在浮栅电极的顶表面上方的电极间电介质层上形成控制栅电极,并向下延伸到沟槽孔中的控制栅极孔。
    • 74. 发明授权
    • Method for forming vertical channels in split-gate flash memory cell
    • 分闸式闪存单元形成垂直通道的方法
    • US5970341A
    • 1999-10-19
    • US988772
    • 1997-12-11
    • Chrong-Jung LinChia-Ta HsiehJong ChenDi-Son Kuo
    • Chrong-Jung LinChia-Ta HsiehJong ChenDi-Son Kuo
    • H01L21/28H01L21/336H01L21/8247H01L29/423H01L29/788
    • H01L27/11521H01L21/28273H01L29/42336H01L29/66825H01L29/7883
    • A method of forming a vertical memory split gate flash memory device on a silicon semiconductor substrate is provided by the following steps. Form a floating gate trench hole in the silicon semiconductor substrate, the trench hole having trench surfaces. Form a tunnel oxide layer on the trench surfaces, the tunnel oxide layer having outer surfaces. Form a floating gate electrode layer filling the trench hole on the outer surfaces of the tunnel oxide layer. Form source/drain regions in the substrate self-aligned with the floating gate electrode layer. Pattern the floating gate electrode layer by removing the gate electrode layer from the drain region side of the trench hole. Form a control gate hole therein. Form an interelectrode dielectric layer over the top surface of the floating gate electrode, and over the tunnel oxide layer. Form a control gate electrode over the interelectrode dielectric layer over the top surface of the floating gate electrode and extending down into the control gate hole in the trench hole.
    • 通过以下步骤提供在硅半导体衬底上形成垂直存储器分离栅极闪存器件的方法。 在硅半导体衬底中形成浮栅沟槽,沟槽具有沟槽表面。 在沟槽表面上形成隧道氧化物层,隧道氧化物层具有外表面。 形成填充隧道氧化物层的外表面上的沟槽的浮栅电极层。 衬底中的源极/漏极区域与浮栅电极层自对准。 通过从沟槽的漏极区域侧去除栅极电极层来对浮栅电极层进行构图。 在其中形成控制门孔。 在浮栅电极的顶表面上方,并在隧道氧化物层之上形成电极间电介质层。 在浮栅电极的顶表面上方的电极间电介质层上形成控制栅电极,并向下延伸到沟槽孔中的控制栅极孔。
    • 78. 发明授权
    • Split gate flash memory device with source line
    • 分流闸闪存器件与源极线
    • US06326662B1
    • 2001-12-04
    • US09633643
    • 2000-08-07
    • Chia-Ta HsiehChrong Jung LinShui-Hung ChenDi-Son Kuo
    • Chia-Ta HsiehChrong Jung LinShui-Hung ChenDi-Son Kuo
    • H01L29788
    • H01L27/11519H01L27/115H01L27/11521
    • A method of forming split gate electrode MOSFET devices comprises the following steps. Form a tunnel oxide layer over a semiconductor substrate. Form a floating gate electrode layer over the tunnel oxide layer. Form a masking cap over the floating gate electrode layer. Pattern gate electrode stacks formed by the tunnel oxide layer and the floating gate electrode layer in the pattern of the masking cap. Pattern source line slots in the center of the gate electrode stacks down to the substrate. Form source regions at the base of the source lines slots. Form intermetal dielectric and control gate layers over the substrate covering the stacks. Pattern the intermetal dielectric and control gate layers into adjacent mirror image split gate electrode pairs. Form self-aligned drain regions.
    • 形成分离栅电极MOSFET器件的方法包括以下步骤。 在半导体衬底上形成隧道氧化层。 在隧道氧化物层上形成浮栅电极层。 在浮栅电极层上形成掩蔽帽。 掩模盖的图案中的隧道氧化物层和浮栅电极层形成的栅极电极堆叠。 栅电极中心的图案源极线槽向下堆叠到衬底。 在源线插槽的底部形成源区。 在覆盖堆叠的衬底上形成金属间电介质和控制栅极层。 将金属间电介质和控制栅极层图案化成相邻的镜像分离栅电极对。 形成自对准漏极区。
    • 79. 发明授权
    • Method to free control tunneling oxide thickness on poly tip of flash
    • 自由控制闪光多头尖端的隧道氧化物厚度的方法
    • US06297099B1
    • 2001-10-02
    • US09765045
    • 2001-01-19
    • Chia-Ta HsiehDi-Son KuoJack YehChrong Jung LinWen-Ting ChuChung-Li Chang
    • Chia-Ta HsiehDi-Son KuoJack YehChrong Jung LinWen-Ting ChuChung-Li Chang
    • H01L218247
    • H01L21/28273H01L29/42324Y10S438/981
    • A method of fabricating a floating gate/word line device, comprising the following steps. A semiconductor structure is provided. A floating gate portion is formed over the semiconductor structure. The floating gate portion having side walls and a top surface. A poly-oxide portion is formed over the top surface of the floating gate. An interpoly oxide layer is formed over the semiconductor structure, the poly-oxide portion and the poly-oxide portion. The interpoly oxide layer having an initial thickness and includes: a word line region portion over at least a portion of the semiconductor structure adjacent the floating gate portion; side wall area portions over the floating gate portion side walls; and a top portion over the poly-oxide portion. The initial thickness of the top portion of the interpoly oxide layer is reduced to a second thickness without reducing the initial thickness of the interpoly oxide word line region portion or an appreciable portion of the interpoly oxide side wall area portion. A polysilicon layer is formed over the interpoly oxide layer. The structure is patterned to form a floating gate/word line device.
    • 一种制造浮栅/字线装置的方法,包括以下步骤。 提供半导体结构。 在半导体结构上方形成浮栅部分。 浮动门部分具有侧壁和顶面。 多晶氧化物部分形成在浮动栅极的顶表面上。 在半导体结构,多晶氧化物部分和多晶氧化物部分之上形成多层氧化物层。 所述多晶硅氧化物层具有初始厚度,并且包括:与所述浮动栅极部分相邻的所述半导体结构的至少一部分上的字线区域部分; 浮动部分侧壁上的侧壁区域部分; 以及多个氧化物部分上方的顶部。 互折层氧化物层的顶部的初始厚度减小到第二厚度,而不会减小多晶氧化物字线区域部分的初始厚度或多余氧化物侧壁区域部分的明显部分。 在多晶硅层上形成多晶硅层。 将结构图案化以形成浮动栅/字线装置。