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71. 发明授权

US07595223B2 Process for bonding and electrically connecting microsystems integrated in several distinct substrates 有权
标题翻译：用于结合和电连接集成在几个不同基板中的微系统的工艺
公开(公告)号：US07595223B2
公开(公告)日：2009-09-29
申请号：US11766654
申请日：2007-06-21
申请人： Ubaldo Mastromatteo , Mauro Bombonati , Daniela Morin , Marta Mottura , Mauro Marchi
发明人： Ubaldo Mastromatteo , Mauro Bombonati , Daniela Morin , Marta Mottura , Mauro Marchi
IPC分类号： H01L21/20 , H01L21/00 , H01L21/46
CPC分类号： B81C1/00269 , H01L21/185 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L24/94 , H01L2224/0231 , H01L2224/02313 , H01L2224/0401 , H01L2224/05124 , H01L2224/05181 , H01L2224/05624 , H01L2224/10126 , H01L2224/10135 , H01L2224/13021 , H01L2224/1308 , H01L2224/13082 , H01L2224/13124 , H01L2224/13164 , H01L2224/81136 , H01L2224/81139 , H01L2224/812 , H01L2224/81201 , H01L2224/81385 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01073 , H01L2924/01078 , H01L2924/01322 , H01L2924/14 , H01L2924/00014 , H01L2224/13099 , H01L2224/29099 , H01L2924/013
摘要： A process for bonding two distinct substrates that integrate microsystems, including the steps of forming micro-integrated devices in at least one of two substrates using micro-electronic processing techniques and bonding the substrates. Bonding is performed by forming on a first substrate bonding regions of deformable material and pressing the substrates one against another so as to deform the bonding regions and to cause them to react chemically with the second substrate. The bonding regions are preferably formed by a thick layer of a material chosen from among aluminum, copper and nickel, covered by a thin layer of a material chosen from between palladium and platinum. Spacing regions ensure exact spacing between the two wafers.
摘要翻译：一种用于结合集成微系统的两个不同基板的方法，包括使用微电子处理技术和粘合基板在两个基板中的至少一个中形成微集成器件的步骤。通过在第一基板上形成接合可变形材料的区域并将基板压在另一个上以使接合区域变形并使其与第二基板发生化学反应来进行接合。接合区域优选由选自铝，铜和镍的材料的厚层形成，被选自钯和铂之间的材料的薄层覆盖。间隔区确保两个晶片之间的精确间距。

72. 发明授权

US07578196B2 Integrated pressure sensor with double measuring scale and a high full-scale value 有权
标题翻译：集成式压力传感器，具有双重量程和高满量程
公开(公告)号：US07578196B2
公开(公告)日：2009-08-25
申请号：US12018068
申请日：2008-01-22
申请人： Giulio Riccoti , Marco Morelli , Luigi Della Torre , Andrea Lorenzo Vitali , Ubaldo Mastromatteo
发明人： Giulio Riccoti , Marco Morelli , Luigi Della Torre , Andrea Lorenzo Vitali , Ubaldo Mastromatteo
IPC分类号： G01L9/00
CPC分类号： G01L9/0054 , G01L9/0045 , G01L15/00
摘要： In a pressure sensor with double measuring scale: a monolithic body of semiconductor material has a first main surface, a bulk region and a sensitive portion upon which pressure acts; a cavity is formed in the monolithic body and is separated from the first main surface by a membrane, which is flexible and deformable as a function of the pressure, and is arranged inside the sensitive portion and is surrounded by the bulk region; a low-pressure detecting element of the piezoresistive type, sensitive to first values of pressure, is integrated in the membrane and has a variable resistance as a function of the deformation of the membrane; in addition, a high-pressure detecting element, also of a piezoresistive type, is formed in the bulk region inside the sensitive portion and has a variable resistance as a function of the pressure. The high-pressure detecting element is sensitive to second values of pressure.
摘要翻译：在具有双重测量尺的压力传感器中：半导体材料的整体主体具有第一主表面，主体区域和压力作用在其上的敏感部分; 在整体式主体中形成空腔，并通过作为压力的函数而变形的柔性且可变形的膜与第一主表面分离，并且布置在敏感部分的内部并被体区域包围; 对第一压力值敏感的压阻型低压检测元件集成在膜中，并具有作为膜的变形的函数的可变电阻; 此外，在敏感部分内部的本体区域中形成压阻型高压检测元件，并且具有作为压力的函数的可变电阻。高压检测元件对第二压力值敏感。

73. 发明授权

US07479659B2 Process for manufacturing encapsulated optical sensors, and an encapsulated optical sensor manufactured using this process 有权
标题翻译：用于制造封装光学传感器的方法，以及使用该方法制造的封装光学传感器
公开(公告)号：US07479659B2
公开(公告)日：2009-01-20
申请号：US10446589
申请日：2003-05-27
申请人： Carlo Cognetti , Ubaldo Mastromatteo
发明人： Carlo Cognetti , Ubaldo Mastromatteo
IPC分类号： H01L27/15
CPC分类号： H01L31/18 , H01L31/0203 , H01L31/02325 , H01L2224/05001 , H01L2224/05009 , H01L2224/05568 , H01L2224/056 , H01L2224/11 , H01L2224/29011 , H01L2224/32225 , H01L2224/73253 , H01L2224/83191 , H01L2224/83192 , H01L2224/94 , H01L2924/00014 , H01L2924/14 , H01L2224/83 , H01L2224/05099
摘要： A process for manufacturing encapsulated optical sensors, including the steps of: forming a plurality of mutually spaced optical sensors in a wafer of semiconductor material; bonding a plate of transparent material to the wafer so as to seal the optical sensors; and dividing the wafer into a plurality of dies, each comprising an optical sensor and a respective portion of the plate.
摘要翻译：一种用于制造封装的光学传感器的方法，包括以下步骤：在半导体材料的晶片中形成多个相互间隔的光学传感器; 将透明材料板粘合到晶片上以便密封光学传感器; 并将晶片分成多个模具，每个模具包括光学传感器和板的相应部分。

74. 发明申请

US20050093013A1 Method for manufacturing encapsulated opto-electronic devices and encapsulated device thus obtained 有权
标题翻译：制造如此获得的封装光电器件和封装器件的方法
公开(公告)号：US20050093013A1
公开(公告)日：2005-05-05
申请号：US10924014
申请日：2004-08-23
申请人： Ubaldo Mastromatteo , Andrea Pallotta , Pietro Montanini , Francesco Martini
发明人： Ubaldo Mastromatteo , Andrea Pallotta , Pietro Montanini , Francesco Martini
IPC分类号： G02B6/42 , H01L33/00 , H01S5/02 , H01S5/022 , H01S5/024
CPC分类号： G02B6/4228 , H01S5/02252 , H01S5/02272 , H01S5/02276 , H01S5/02284 , H01S5/02415 , H01S5/0683
摘要： A packaging structure for optoelectronic components is formed by a first body, of semiconductor material, and a second body, of semiconductor material, fixed to a first face of said first body. A through window is formed in the second body and exposes a portion of the first face of the first body, whereon at least one optoelectronic component is fixed. Through connection regions extend through the first body and are in electrical contact with the optoelectronic component. The through connection regions are insulated from the rest of the first body via through insulation regions. Contact regions are arranged on the bottom face of the first body and are connected to said optoelectronic component via the through connection regions.
摘要翻译：用于光电子部件的封装结构由半导体材料的第一主体和半导体材料的第二主体形成，固定到所述第一主体的第一面。在第二主体中形成通孔，并暴露出第一主体的第一面的一部分，其中固定有至少一个光电子部件。通过连接区域延伸穿过第一主体并且与光电子部件电接触。通过连接区域经由绝缘区域与第一体的其余部分绝缘。接触区域布置在第一主体的底面上，并且经由贯穿连接区域连接到所述光电子部件。

75. 发明授权

US5629558A Semiconductor diode integrated with bipolar/CMOS/DMOS technology 失效
标题翻译：集成了双极/ CMOS / DMOS技术的半导体二极管
公开(公告)号：US5629558A
公开(公告)日：1997-05-13
申请号：US454647
申请日：1995-05-31
申请人： Paola Galbiati , Ubaldo Mastromatteo
发明人： Paola Galbiati , Ubaldo Mastromatteo
IPC分类号： H01L21/329 , H01L29/861 , H01L27/06 , H01L29/00 , H01L31/0352
CPC分类号： H01L29/66128 , H01L29/8611
摘要： A diode integrated on semiconductor material with BCD technology and of the type provided on a substrate having a first type of conductivity inside an isolation region having a second type of conductivity. The diode comprises also a buried anode region having a first type of conductivity and a cathode region having a second type of conductivity. The cathode region comprises an epitaxial layer located above the buried anode region and a highly doped region provided inside the epitaxial layer. The buried anode region comprises depressions opposite which is located the highly doped region with the depressions being achieved by the intersection of lateral diffusions of distinct and adjacent portions of the buried anode region.
摘要翻译：集成在具有BCD技术的半导体材料上的二极管，并且具有在具有第二类导电性的隔离区域内具有第一类型导电性的基板上提供的类型的二极管。二极管还包括具有第一类导电性的掩埋阳极区域和具有第二类导电性的阴极区域。阴极区域包括位于掩埋阳极区域上方的外延层和设置在外延层内部的高掺杂区域。掩埋阳极区域包括相对的凹陷，其位于高掺杂区域，凹陷通过掩埋阳极区域的不同相邻部分的横向扩散的交叉来实现。

76. 发明授权

US09180451B2 Fluidic cartridge for detecting chemicals in samples, in particular for performing biochemical analyses 有权
标题翻译：用于检测样品中化学物质的流体柱，特别用于进行生化分析
公开(公告)号：US09180451B2
公开(公告)日：2015-11-10
申请号：US13170058
申请日：2011-06-27
申请人： Federico Giovanni Ziglioli , Amedeo Maierna , Ubaldo Mastromatteo , Gabriele Barlocchi , Flavio Francesco Villa
发明人： Federico Giovanni Ziglioli , Amedeo Maierna , Ubaldo Mastromatteo , Gabriele Barlocchi , Flavio Francesco Villa
IPC分类号： B01L3/00
CPC分类号： B01L3/502715 , B01L2200/027 , B01L2300/044 , B01L2300/0636 , B01L2300/0645 , B01L2300/0672 , B01L2300/0816 , B01L2300/0867 , B01L2300/1827 , B01L2400/0439 , Y10T436/11
摘要： A fluidic cartridge for detecting chemicals, formed by a casing, hermetically housing an integrated device having a plurality of detecting regions to bind with target chemicals; part of a supporting element, bearing the integrated device; a reaction chamber, facing the detecting regions; a sample feeding hole and a washing feeding hole, self-sealingly closed; fluidic paths, which connect the sample feeding and washing feeding holes to the reaction chamber; and a waste reservoir, which may be fluidically connected to the reaction chamber by valve elements that may be controlled from outside. The integrated device is moreover connected to an interface unit carried by the supporting element, electrically connected to the integrated device and including at least one signal processing stage and external contact regions.
摘要翻译：一种用于检测由壳体形成的化学品的流体盒，其气密地容纳具有多个检测区域以与目标化学品结合的集成装置; 支撑元件的一部分，承载集成装置; 反应室，面对检测区域; 一个样品进料孔和一个洗涤进料孔，自密封; 流体路径，其将样品进料和洗涤进料孔连接到反应室; 以及可以通过可从外部控制的阀元件流体地连接到反应室的废物储存器。此外，集成装置还连接到由支撑元件承载的接口单元，电连接到集成装置并且包括至少一个信号处理级和外部接触区域。

77. 发明申请

US20100163410A1 ELECTRONIC DETECTION OF BIOLOGICAL MATERIALS 有权
标题翻译：电子检测生物材料
公开(公告)号：US20100163410A1
公开(公告)日：2010-07-01
申请号：US12649019
申请日：2009-12-29
申请人： Ubaldo Mastromatteo , Flavio Francesco Villa , Gabriele Barlocchi
发明人： Ubaldo Mastromatteo , Flavio Francesco Villa , Gabriele Barlocchi
IPC分类号： G01N27/26 , B32B37/00 , B32B38/10
CPC分类号： G01N29/022 , C12Q1/6825 , G01N2291/02466 , G01N2291/0426 , C12Q2565/629 , C12Q2563/131
摘要： A hybridization detecting device, wherein a probe cell has a body of semiconductor material forming a diaphragm, a first electrode on the diaphragm, a piezoelectric region on the first electrode, a second electrode on the piezoelectric region and a detection layer on the second electrode. The body accommodates a buried cavity downwardly delimiting the diaphragm.
摘要翻译：一种杂交检测装置，其中探针单元具有形成隔膜的半导体材料体，隔膜上的第一电极，第一电极上的压电区域，压电区域上的第二电极和第二电极上的检测层。主体容纳向下限定隔膜的掩埋腔。

78. 发明授权

US07590326B2 Optical integrated device manufacturing process and device manufactured by the process thereof 有权
标题翻译：光学集成器件制造工艺及其制造方法
公开(公告)号：US07590326B2
公开(公告)日：2009-09-15
申请号：US12015199
申请日：2008-01-16
申请人： Antonio Fincato , Ubaldo Mastromatteo
发明人： Antonio Fincato , Ubaldo Mastromatteo
IPC分类号： G02B6/10 , H01L21/00 , B29D11/00
CPC分类号： G02B6/4214 , G02B6/12002 , G02B6/12004 , G02B6/136 , G02B2006/12104
摘要： The invention relates to a process for manufacturing an integrated optical device comprising the deposition on a support substrate of a multilayer being formed by first and second cladding layers in order to hold in a multilayer first region a waveguide core layer. The core is provided with an electromagnetic radiation (L) inlet/outlet port. Furthermore, the process provides for the formation of a regulation layer having a first etching speed associated therewith, which is distinguished from the etching speeds of the cladding layers. Subsequently to an etching of a multilayer second region, a cavity is obtained having a first wall which is inclined relative to the substrate at least partially extending in said first region and which is near said inlet/outlet port. Such etching removes portions of the regulation layer and the cladding layers at different speeds in order to result in the formation of the inclined wall.
摘要翻译：本发明涉及一种用于制造集成光学器件的方法，其包括在第一和第二覆层形成的多层的支撑衬底上的沉积，以便在多层第一区域中保持波导芯层。核心设有电磁辐射（L）入口/出口。此外，该方法提供形成具有与其相关联的第一蚀刻速度的调节层，其与包覆层的蚀刻速度不同。随后对多层第二区域的蚀刻，获得具有第一壁的空腔，所述第一壁相对于基板倾斜，所述第一壁在所述第一区域中至少部分地延伸并且在所述入口/出口附近。这种蚀刻以不同的速度去除调节层和包覆层的部分，以便形成倾斜壁。

79. 发明申请

US20090186447A1 PROCESS FOR SEALING AND CONNECTING PARTS OF ELECTROMECHANICAL, FLUID AND OPTICAL MICROSYSTEMS AND DEVICE OBTAINED THEREBY 有权
标题翻译：密封和连接机电，流体和光学微观器件的部件及其获得的装置
公开(公告)号：US20090186447A1
公开(公告)日：2009-07-23
申请号：US12417461
申请日：2009-04-02
申请人： Ubaldo Mastromatteo
发明人： Ubaldo Mastromatteo
IPC分类号： H01L21/50
CPC分类号： B81C1/00269 , B81B2207/093 , B81C1/00301 , H01L21/50 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/10135 , H01L2224/10165 , H01L2224/8014 , H01L2224/81136 , H01L2224/81139 , H01L2224/8114 , H01L2224/81801 , H01L2924/01006 , H01L2924/01032 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01322 , H01L2924/12041 , H01L2224/05644 , H01L2924/00014 , H01L2224/05655 , H01L2224/05666
摘要： A process for connecting two bodies forming parts of an electromechanical, fluid and optical microsystem, wherein a welding region is formed on a first body; an electrically conductive region and a spacing region are formed on a second body; the spacing region extends near the electrically conductive region and has a height smaller than the electrically conductive region. One of the first and second bodies is turned upside down on the other, and the two bodies are welded together by causing the electrically conductive region to melt so that it adheres to the welding region and collapses until its height becomes equal to that of the spacing region. Thereby it is possible to seal active parts or micromechanical structures with respect to the outside world, self-align the two bodies during bonding, obtain an electrical connection between the two bodies, and optically align two optical structures formed on the two bodies.
摘要翻译：一种用于连接形成机电，流体和光学微系统的部件的两个主体的方法，其中在第一主体上形成焊接区域; 在第二主体上形成导电区域和间隔区域; 间隔区域在导电区域附近延伸并具有小于导电区域的高度。第一和第二主体中的一个被另一个上下颠倒，并且两个主体通过使导电区域熔化而被焊接在一起，使得它粘附到焊接区域并且塌陷，直到其高度等于间隔的高度地区。因此，可以相对于外界来密封活动部件或微机械结构，在接合期间自对准两个主体，获得两个主体之间的电连接，并且光学对准在两个主体上形成的两个光学结构。

80. 发明授权

US07531897B2 Process for sealing and connecting parts of electromechanical, fluid and optical microsystems and device obtained thereby 有权
公开(公告)号：US07531897B2
公开(公告)日：2009-05-12
申请号：US10060068
申请日：2002-01-29
申请人： Ubaldo Mastromatteo
发明人： Ubaldo Mastromatteo
IPC分类号： H01L23/48
CPC分类号： B81C1/00269 , B81B2207/093 , B81C1/00301 , H01L21/50 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/10135 , H01L2224/10165 , H01L2224/8014 , H01L2224/81136 , H01L2224/81139 , H01L2224/8114 , H01L2224/81801 , H01L2924/01006 , H01L2924/01032 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01322 , H01L2924/12041 , H01L2224/05644 , H01L2924/00014 , H01L2224/05655 , H01L2224/05666
摘要： A process for connecting two bodies forming parts of an electromechanical, fluid and optical microsystem, wherein a welding region is formed on a first body; an electrically conductive region and a spacing region are formed on a second body; the spacing region extends near the electrically conductive region and has a second height smaller than said first height. One of the first and second bodies is turned upside down on the other, and the two bodies are welded together by causing the electrically conductive region to melt so that it adheres to the welding region and collapses until its height becomes equal to that of the spacing region. Thereby it is possible to seal active parts or micromechanical structures with respect to the outside world, self-align the two bodies during bonding, obtain an electrical connection between the two bodies, and optically align two optical structures formed on the two bodies.

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