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    • 71. 发明申请
    • Modular Apparatus for Magnetic Resonance Imaging
    • 用于磁共振成像的模块化装置
    • US20100315085A1
    • 2010-12-16
    • US12816879
    • 2010-06-16
    • Brian BrownSteven WolffKyle JohnsonGlenn Wells
    • Brian BrownSteven WolffKyle JohnsonGlenn Wells
    • G01R33/48
    • G01R33/3415A61B5/0555G01R33/34007G01R33/34084G01R33/3621
    • The present invention discloses a modular MRI imaging system. The imaging system includes MRI radio-frequency antenna arrays separate from the patient support structure. The antenna arrays are affixed to a thin, flexible film such that they may be located next to the anatomical region of interest. In addition, multiple antenna arrays may be configured in various planar or three-dimensional arrangements to optimize the FOV and SNR. Separate patient support structures are provided that enhance ergonomics and patient stabilization. By removing the antenna from the housing, the support structures may be designed without the constraints of supporting the antenna or the associated electronics. The MRI imaging system further employs a preamplifier module. The preamplifier module houses the preamplifier and much of the other associated circuitry for each of the antennae. The preamplifier module operates to combine the signals from the antenna arrays and pass the signals to the MRI system.
    • 本发明公开了一种模块化MRI成像系统。 成像系统包括与患者支撑结构分开的MRI射频天线阵列。 天线阵列被固定到薄的柔性膜,使得它们可以位于感兴趣的解剖区域旁边。 此外,多个天线阵列可以被配置成各种平面或三维布置以优化FOV和SNR。 提供单独的患者支撑结构,其增强人体工程学和患者稳定性。 通过从壳体移除天线,可以设计支撑结构而不受支撑天线或相关电子装置的限制。 MRI成像系统还采用前置放大器模块。 前置放大器模块容纳前置放大器和大部分用于每个天线的其它相关电路。 前置放大器模块用于组合来自天线阵列的信号,并将信号传递到MRI系统。
    • 73. 发明申请
    • SEMICONDUCTOR SUBSTRATE CLEANING SYSTEM
    • 半导体衬底清洗系统
    • US20080041422A1
    • 2008-02-21
    • US11877648
    • 2007-10-23
    • Brian BrownAnwar HusainFred Redeker
    • Brian BrownAnwar HusainFred Redeker
    • B08B7/04B08B3/00
    • H01L21/67057B08B1/04B08B3/08B08B3/12H01L21/02052H01L21/67028H01L21/67046H01L21/67051H01L21/67751H01L21/67757H01L21/68Y10S134/902
    • A modular semiconductor substrate cleaning system is provided that processes vertically oriented semiconductor substrates. The system features a plurality of cleaning modules that may include a megasonic tank-type cleaner followed by a scrubber. An input module may receive a horizontally oriented substrate and rotate the substrate to a vertical orientation, and an output module may receive a vertically oriented substrate and rotate the substrate to a horizontal orientation. Each of the modules (input, cleaning and output) has a substrate support and may be positioned such that the substrate supports of adjacent modules are equally spaced. The modules are coupled by an overhead transfer mechanism having a plurality of substrate handlers spaced the same distance (X) as the substrate supports of the modules therebelow. The transfer mechanism indexes forward and backward the distance X to simultaneously transport semiconductor substrates through the cleaning system, lifting and lowering substrates from the desired modules wafer rotation/orientation sensors, an input module cart for transporting wafers between a substrate handler of a previous tool (such as a semiconductor substrate polisher) and a substrate handler of the cleaning system are also included.
    • 提供了一种处理垂直取向的半导体衬底的模块化半导体衬底清洁系统。 该系统具有多个清洁模块,其可以包括紧随着洗涤器的兆声波槽式清洁器。 输入模块可以接收水平定向的基板并将基板旋转到垂直取向,并且输出模块可以接收垂直取向的基板并将基板旋转到水平取向。 每个模块(输入,清洁和输出)具有基板支撑件并且可以被定位成使得相邻模块的基板支撑件相等间隔。 模块通过具有多个衬底处理器的架空传送机构耦合,所述多个衬底处理器与其下面的模块的衬底支撑件间隔开相同的距离(X)。 传送机构向前和向后指示距离X,以同时传送半导体衬底通过清洁系统,从期望的模块提升和降低衬底晶片旋转/取向传感器,用于在先前工具的衬底处理器之间传送晶片的输入模块推车( 例如半导体衬底抛光机)和清洁系统的衬底处理器也被包括在内。