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71. 发明申请

US20090060604A1 Home-position detecting method, sheet processing device, and image forming apparatus 有权
标题翻译：原位检测方法，片处理装置和图像形成装置
公开(公告)号：US20090060604A1
公开(公告)日：2009-03-05
申请号：US12230097
申请日：2008-08-22
申请人： Hitoshi Hattori , Masahiro Tamura , Nobuyoshi Suzuki , Shuuya Nagasako , Kazuhiro Kobayashi , Hiroshi Maeda , Tomoichi Nomura , Ichiro Ichihashi , Akira Kunieda , Makoto Hidaka , Naohiro Kikkawa , Junichi Tokita
发明人： Hitoshi Hattori , Masahiro Tamura , Nobuyoshi Suzuki , Shuuya Nagasako , Kazuhiro Kobayashi , Hiroshi Maeda , Tomoichi Nomura , Ichiro Ichihashi , Akira Kunieda , Makoto Hidaka , Naohiro Kikkawa , Junichi Tokita
IPC分类号： G03G15/00 , B65H7/02 , B41F13/00
CPC分类号： B65H31/3081 , B65H31/34 , B65H2301/3621 , B65H2301/42266 , B65H2404/232 , B65H2405/20 , B65H2511/20 , B65H2511/52 , B65H2551/20 , B65H2801/27 , B65H2220/01 , B65H2220/11 , B65H2220/09 , B65H2220/02
摘要： A processing unit performs a predetermined processing on a sheet in a process of carrying the sheet. A home-position detecting unit detects a home position of a moving member of the processing unit by detecting a part of the moving member using a detecting unit. The home-position detecting unit sets in advance a detection range for recognizing the home position, and when a part to detect the home position is detected in a state in which the moving member is stopped, sets a detection position as the home position by assuming that the detection position is in the detection range without moving the moving member once out of a detection range of the detecting unit.
摘要翻译：处理单元在承载纸张的过程中对纸张执行预定处理。原点位置检测单元通过使用检测单元检测移动构件的一部分来检测处理单元的移动构件的原始位置。原点位置检测单元预先设定用于识别起始位置的检测范围，当在移动构件停止的状态下检测到原点位置的部分时，通过假定设定检测位置作为原始位置检测位置处于检测范围，而不移动移动构件一次超出检测单元的检测范围。

72. 发明申请

US20090057978A1 Sheet processing device, image forming apparatus, and image forming system 有权
标题翻译：片材处理装置，成像装置和成像系统
公开(公告)号：US20090057978A1
公开(公告)日：2009-03-05
申请号：US12222443
申请日：2008-08-08
申请人： Hiroshi Maeda , Masahiro Tamura , Nobuyoshi Suzuki , Shuuya Nagasako , Naohiro Kikkawa , Kazuhiro Kobayashi , Tomohiro Furuhashi , Tomoichi Nomura , Makoto Hidaka , Hitoshi Hattori , Junichi Tokita , Akira Kunieda , Ichiro Ichihashi
发明人： Hiroshi Maeda , Masahiro Tamura , Nobuyoshi Suzuki , Shuuya Nagasako , Naohiro Kikkawa , Kazuhiro Kobayashi , Tomohiro Furuhashi , Tomoichi Nomura , Makoto Hidaka , Hitoshi Hattori , Junichi Tokita , Akira Kunieda , Ichiro Ichihashi
IPC分类号： B65H39/00
CPC分类号： B65H31/34 , B65H31/10 , B65H2301/3621
摘要： A sheet processing device includes a sheet aligning unit that aligns a sheet recording medium. The sheet aligning unit is configured to be pulled out from a main body of the sheet processing device, and includes a sheet conveying member for conveying the sheet recording medium.
摘要翻译：片材处理装置包括对准片材记录介质的片材对齐单元。片材对齐单元被构造成从片材处理装置的主体被拉出，并且包括用于输送片材记录介质的片材传送构件。

73. 发明申请

US20090014939A1 Sheet post-processing apparatus, image forming apparatus, and image forming system 有权
标题翻译：片材后处理装置，图像形成装置和图像形成系统
公开(公告)号：US20090014939A1
公开(公告)日：2009-01-15
申请号：US12213655
申请日：2008-06-23
申请人： Ichiro Ichihashi , Masahiro Tamura , Nobuyoshi Suzuki , Shuuya Nagasako , Naohiro Kikkawa , Kazuhiro Kobayashi , Tomohiro Furuhashi , Makoto Hidaka , Hitoshi Hattori , Junichi Tokita , Akira Kunieda , Hiroshi Maeda , Tomoichi Nomura
发明人： Ichiro Ichihashi , Masahiro Tamura , Nobuyoshi Suzuki , Shuuya Nagasako , Naohiro Kikkawa , Kazuhiro Kobayashi , Tomohiro Furuhashi , Makoto Hidaka , Hitoshi Hattori , Junichi Tokita , Akira Kunieda , Hiroshi Maeda , Tomoichi Nomura
IPC分类号： B65H5/00 , B41F13/00
CPC分类号： B65H31/3027 , B65H31/3081 , B65H2301/3621 , B65H2301/4222 , B65H2301/42262 , B65H2301/42266 , B65H2404/23 , B65H2405/22 , B65H2513/10 , B65H2557/242 , B65H2801/27 , B65H2220/02 , B65H2220/11
摘要： A sheet post-processing apparatus includes a sheet stacking unit, an aligning unit, a moving member, a discharging member, and a discharging motor. The discharging motor drives the discharging member for discharging a pile of sheets in an operation pattern that is selected, depending on a predetermined condition, from among a plurality of operation patterns.
摘要翻译：片材后处理装置包括片材堆积单元，对准单元，移动构件，排出构件和排出马达。排出马达根据预定条件从多个操作模式中驱动按照选择的操作模式排出一堆纸张的排出构件。

74. 发明申请

US20080258300A1 WIRING BOARD MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WIRING BOARD 有权
标题翻译：接线板制造方法，半导体器件制造方法及接线板
公开(公告)号：US20080258300A1
公开(公告)日：2008-10-23
申请号：US12099322
申请日：2008-04-08
申请人： Kazuhiro Kobayashi , Junichi Nakamura , Kentaro Kaneko
发明人： Kazuhiro Kobayashi , Junichi Nakamura , Kentaro Kaneko
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H01L21/6835 , H01L21/4853 , H01L21/4857 , H01L23/49816 , H01L23/49827 , H01L24/16 , H01L24/48 , H01L24/81 , H01L24/85 , H01L2221/68345 , H01L2224/13099 , H01L2224/16225 , H01L2224/16235 , H01L2224/16237 , H01L2224/48227 , H01L2224/8121 , H01L2224/81815 , H01L2224/85444 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01088 , H01L2924/014 , H01L2924/15174 , H01L2924/15311 , H01L2924/351 , H05K1/113 , H05K3/205 , H05K3/28 , H05K3/4007 , H05K3/4644 , H05K2201/0367 , H05K2201/0376 , H05K2201/09563 , H05K2201/2072 , Y10T29/49156 , Y10T29/49165 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device 100 has such a structure that a semiconductor chip 110 is flip-chip mounted on a wiring board 120. The wiring board 120 has a multilayer structure in which a plurality of wiring layers and a plurality of insulating layers are arranged, and has a structure in which insulating layers of a first layer 122, a second layer 124, a third layer 126 and a fourth layer 128 are provided. The first layer 122 has a first insulating layer 121 and a second insulating layer 123. A protruded portion 132 which is protruded in a radial direction (a circumferential direction) from an outer periphery at one surface side of a first electrode pad 130 is formed on a whole periphery over a boundary surface between the first insulating layer 121 and the second insulating layer 123.
摘要翻译：半导体器件100具有半导体芯片110被倒装安装在布线板120上的结构。布线基板120具有多层布线层和多层绝缘层的多层结构，并且具有第一层122，第二层124，第三层126和第四层的绝缘层的结构提供了层128。第一层122具有第一绝缘层121和第二绝缘层123。在第一绝缘层121和第二绝缘层121之间的边界面上的整个周边上形成有从第一电极焊盘130的一个表面侧的外周沿径向（周向）突出的突出部132。层123。

75. 发明申请

US20080246146A1 WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTURING METHOD 有权
标题翻译：接线基板和接线基板制造方法
公开(公告)号：US20080246146A1
公开(公告)日：2008-10-09
申请号：US12062018
申请日：2008-04-03
申请人： Kotaro Kodani , Kentaro Kaneko , Kazuhiro Kobayashi
发明人： Kotaro Kodani , Kentaro Kaneko , Kazuhiro Kobayashi
IPC分类号： H01L23/52 , H01L21/44
CPC分类号： H05K3/4007 , H01L21/4846 , H01L21/4853 , H01L21/6835 , H01L2224/13 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/15174 , H05K1/113 , H05K3/205 , H05K3/28 , H05K3/423 , H05K3/4682 , H05K2201/09436 , H05K2201/09472 , H05K2203/0369 , H05K2203/0376 , H05K2203/0733 , H01L2224/0401
摘要： A method of manufacturing a wiring substrate comprises: a first step of forming, on a support plate, an electrode pad made of metal; a second step of etching the support plate in such a manner that the support plate has a shape which includes a projection portion to be contacted with the electrode pad; a third step of forming, on the surface of the support plate, an insulating layer for covering the electrode pad; a fourth step of forming, on the surface of the insulating layer, a conductive pattern to be connected to the electrode pad; and, a fifth step of removing the support plate.
摘要翻译：一种制造布线基板的方法包括：在支撑板上形成由金属制成的电极垫的第一步骤; 以支撑板具有包括与电极焊盘接触的突出部分的形状的方式蚀刻支撑板的第二步骤; 在支撑板的表面上形成用于覆盖电极焊盘的绝缘层的第三步骤; 在绝缘层的表面上形成要连接到电极焊盘的导电图案的第四步骤; 以及移除支撑板的第五步骤。

76. 发明申请

US20080217837A1 Sheet conveying device, sheet processing apparatus, and image forming apparatus 有权
标题翻译：片材输送装置，片材处理装置和成像装置
公开(公告)号：US20080217837A1
公开(公告)日：2008-09-11
申请号：US12073371
申请日：2008-03-05
申请人： Shuuya Nagasako , Masahiro Tamura , Nobuyoshi Suzuki , Hiroshi Maeda , Tomoichi Nomura , Kazuhiro Kobayashi , Tomohiro Furuhashi , Makoto Hidaka , Hitoshi Hattori , Ichiro Ichihashi , Junichi Tokita , Akira Kunieda , Naohiro Kikkawa
发明人： Shuuya Nagasako , Masahiro Tamura , Nobuyoshi Suzuki , Hiroshi Maeda , Tomoichi Nomura , Kazuhiro Kobayashi , Tomohiro Furuhashi , Makoto Hidaka , Hitoshi Hattori , Ichiro Ichihashi , Junichi Tokita , Akira Kunieda , Naohiro Kikkawa
IPC分类号： B41F21/00 , B41F13/00
CPC分类号： G03G15/6552 , B65H29/58 , B65H2404/612 , B65H2404/63 , B65H2801/27 , G03G15/6547 , G03G2215/00675 , G03G2215/00877
摘要： A sheet conveying device in which at least a sheet is guided and conveyed by a guiding member includes a discharging roller that conveys the sheet, a first guiding member and a second guiding member that are arranged along an outer periphery of the discharging roller, and a supporting shaft that rotatably supports both the first guiding member and the second guiding member. When the first guiding member is located at a first position in which a path between the first guiding member and the discharging roller is closed, the sheet is guided to a shift conveying path, and when the first guiding member is located at a second position in which the path is opened, the sheet is guided to a folding processing tray.
摘要翻译：一种片材输送装置，其中至少一个片材被引导构件引导和传送，包括沿着排出辊的外周布置的片材的排出辊，第一引导构件和第二引导构件，以及支撑轴，其可旋转地支撑第一引导构件和第二引导构件。当第一引导构件位于第一引导构件和排出辊之间的路径关闭的第一位置时，片材被引导到换档输送路径，并且当第一引导构件位于第二引导构件的第二位置时路径被打开时，片材被引导到折叠处理托盘。

77. 发明申请

US20080202661A1 Method of manufacturing wiring substrate and method of manufacturing electronic component device 有权
标题翻译：制造布线基板的方法及其制造方法
公开(公告)号：US20080202661A1
公开(公告)日：2008-08-28
申请号：US12071008
申请日：2008-02-14
申请人： Kazuhiro Kobayashi
发明人： Kazuhiro Kobayashi
IPC分类号： H01B13/00
CPC分类号： H05K3/0097 , H01L21/4857 , H01L21/6835 , H01L23/49816 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H05K1/113 , H05K3/0058 , H05K3/025 , H05K3/4682 , H05K2203/0156 , H05K2203/0733 , H05K2203/1536 , Y10T29/49126 , Y10T29/49155 , H01L2224/0401
摘要： In a method of manufacturing a wiring substrate of the present invention, first, a structure in which an underlying layer is arranged in a wiring forming area of a temporary substrate and a peelable multi-layer metal foil that is larger in size than the underlying layer is arranged on the underlying layer and is adhered partially to an outer peripheral portion of the wiring forming area of the temporary substrate, and the peelable multi-layer metal foil is constructed by temporary adhering a first metal foil and a second metal foil with peelable. Then, a built-up wiring layer is formed on the peelable multi-layer metal foil, and the peelable multi-layer metal foil is separated from the temporary substrate by cutting a portion of such a structure that the underlying layer, the peelable multi-layer metal foil, and the built-up wiring layer are formed on the temporary substrate, the portion corresponding to a peripheral portion the underlying layer, whereby a wiring member in which the built-up wiring layer is formed on the peelable multi-layer metal foil is obtained.
摘要翻译：在本发明的布线基板的制造方法中，首先，将下层配置在临时基板的布线形成区域和尺寸大于下层的剥离性多层金属箔的结构被布置在下层上并部分地粘附到临时基板的布线形成区域的外周部分，并且可剥离多层金属箔通过临时粘附第一金属箔和具有可剥离的第二金属箔来构造。然后，在可剥离的多层金属箔上形成积层布线层，并通过切割下述层的可剥离多层金属箔的一部分，将剥离性多层金属箔与临时基板分离，层叠金属箔和积层布线层形成在临时基板上，该部分对应于下层的周边部分，由此在可剥离的多层金属上形成组合布线层的布线构件箔。

78. 发明申请

US20080149383A1 Wiring substrate and method for manufacturing the same 有权
标题翻译：接线基板及其制造方法
公开(公告)号：US20080149383A1
公开(公告)日：2008-06-26
申请号：US11987617
申请日：2007-12-03
申请人： Kentaro Kaneko , Kotaro Kodani , Junichi Nakamura , Kazuhiro Kobayashi
发明人： Kentaro Kaneko , Kotaro Kodani , Junichi Nakamura , Kazuhiro Kobayashi
IPC分类号： H05K1/09 , H05K3/10 , H05K1/11
CPC分类号： H05K1/113 , H01L21/4857 , H01L21/486 , H01L21/6835 , H01L23/49822 , H01L23/49827 , H01L2221/68345 , H01L2924/0002 , H05K3/108 , H05K3/205 , H05K3/4644 , H05K2201/0341 , H05K2201/09563 , H05K2201/096 , Y10T29/49155 , H01L2924/00
摘要： A wiring substrate has pads formed from a plurality of metal layers and vias connected to the pads. The plurality of metal layers have a metal layer exposed through the wiring substrate, and a first metal layer which is interposed between the metal layer and the vias and which prevents diffusion of metal included in the vias into the metal layer. A second metal layer which is less subject to oxidation than the first metal layer is provided between the vias and the first metal layer, and the vias are connected to the second metal layer.
摘要翻译：布线基板具有由多个金属层形成的焊盘和连接到焊盘的通孔。多个金属层具有通过布线基板露出的金属层，以及介于金属层和通孔之间的第一金属层，并且防止通孔中包含的金属扩散到金属层中。在通孔和第一金属层之间设置有比第一金属层更少受到氧化的第二金属层，并且通孔连接到第二金属层。

79. 发明申请

US20080067730A1 Sheet aligning device, sheet processing device, and image forming apparatus 有权
标题翻译：纸张对齐装置，纸张处理装置和图像形成装置
公开(公告)号：US20080067730A1
公开(公告)日：2008-03-20
申请号：US11896723
申请日：2007-09-05
申请人： Nobuyoshi Suzuki , Masahiro Tamura , Shuuya Nagasako , Kazuhiro Kobayashi , Makoto Hidaka , Hitoshi Hattori , Shohichi Satoh , Akira Kunieda , Hiroshi Maeda , Tomoichi Nomura , Ichiro Ichihashi
发明人： Nobuyoshi Suzuki , Masahiro Tamura , Shuuya Nagasako , Kazuhiro Kobayashi , Makoto Hidaka , Hitoshi Hattori , Shohichi Satoh , Akira Kunieda , Hiroshi Maeda , Tomoichi Nomura , Ichiro Ichihashi
IPC分类号： B65H9/00 , B41L43/12
CPC分类号： B65H9/101 , B65H31/34 , B65H2511/414 , B65H2801/27 , G03G15/6538 , G03G2215/00421 , B65H2220/01
摘要： A sheet aligning device includes a transport path, a movable fence, a tapping tab, and jogger fences. The transport path transports a sheet stack. The movable fence and the tapping tab align the sheet stack in a first direction in which the sheet stack is transported on the transport path. The jogger fences align the sheet stack in a direction perpendicular to the first direction on the transport path. The movable fence, the tapping tab, and the jogger fences align the sheet stack according to a plurality of aligning modes.
摘要翻译：片材对准装置包括传送路径，可移动围栏，敲击片和慢跑栏。传输路径传输纸张堆叠。可移动围栏和攻丝舌片沿纸张堆叠在传送路径上传送的第一方向对齐纸张堆叠。慢跑者围绕输送路径上与第一方向垂直的方向对齐纸叠。可移动围栏，攻丝片和慢跑者围栏根据多种对准模式对齐纸叠。

80. 发明申请

US20070177746A1 Panel type speaker 审中-公开
标题翻译：面板式扬声器
公开(公告)号：US20070177746A1
公开(公告)日：2007-08-02
申请号：US10563356
申请日：2004-07-01
申请人： Kazuhiro Kobayashi , Yoshiro Ohkawa
发明人： Kazuhiro Kobayashi , Yoshiro Ohkawa
IPC分类号： H04R25/00
CPC分类号： H04R7/045
摘要： A panel type speaker according to the present invention includes an exciter having bimorph type beams which are made of a piezoelectric material and in each of which a flexural oscillation is excited, and a beam holding part for holding the beams, and a diaphragm which is attached to the exciter to generate a flexural oscillation based on oscillation transmitted from the exciter and serves as a transparent protective plate for a display. A bottom surface of the beam holding part of the exciter has an area which is greater than or equal to one-fourth of an area of the largest beam of the beams, and is fixed to a surface of the diaphragm so that the exciter is held on the diaphragm. The panel type speaker has high excitation efficiency and a simple structure, making it easy to add an acoustic characteristic regulating mechanism.
摘要翻译：根据本发明的面板式扬声器包括具有由压电材料制成的双压电晶片型梁的激励器，并且其中每一个都被弯曲振荡激励，以及用于保持梁的梁保持部分和附接的隔膜到激励器产生基于从激励器传播的振荡的弯曲振荡，并且用作显示器的透明保护板。励磁机的梁保持部分的底面具有大于或等于梁的最大梁的面积的四分之一的面积，并被固定到振动膜的表面，使得激励器保持在隔膜上。面板型扬声器具有高的激发效率和简单的结构，使得容易添加声学特性调节机构。

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