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    • 74. 发明申请
    • MEMORY CELL OF NONVOLATILE SEMICONDUCTOR MEMORY
    • 非易失性半导体存储器的存储单元
    • US20080237688A1
    • 2008-10-02
    • US12044645
    • 2008-03-07
    • Naoki Yasuda
    • Naoki Yasuda
    • H01L29/788
    • H01L27/11568H01L21/28282H01L29/513H01L29/792
    • A memory cell of a nonvolatile semiconductor memory includes a first insulating film whose principal constituent elements are Si, O and N, a charge storage layer whose principal constituent elements are Hf, O and N, formed on the first insulating film, a second insulating film having dielectric constant higher than that of the first insulating film and formed on the charge storage layer, and a control gate electrode formed on the second insulating film. Relation between a composition of the first insulating film and a composition of the charge storage layer is determined under the conditions that (A) a valence band offset of the first insulating film is larger than a valence band offset of the charge storage layer, and (B) a trap energy level of electrons due to oxygen vacancies in the charge storage layer exists within a band gap of the charge storage layer.
    • 非易失性半导体存储器的存储单元包括主要组成元素为Si,O和N的第一绝缘膜,主要组成元素为Hf,O和N的电荷存储层,形成在第一绝缘膜上,第二绝缘膜 其电介质常数高于第一绝缘膜并且形成在电荷存储层上,以及形成在第二绝缘膜上的控制栅电极。 在(A)第一绝缘膜的价带偏移大于电荷存储层的价带偏移的条件下,确定第一绝缘膜的组成与电荷存储层的组成之间的关系,以及( B)在电荷存储层的带隙内存在由于电荷存储层中的氧空位引起的电子的陷阱能级。
    • 76. 发明申请
    • Nonvolatile semiconductor memory device
    • 非易失性半导体存储器件
    • US20080073704A1
    • 2008-03-27
    • US11822579
    • 2007-07-09
    • Naoki Yasuda
    • Naoki Yasuda
    • H01L29/792
    • H01L21/28282H01L21/28088H01L27/115H01L27/11568H01L29/4234H01L29/513H01L29/517H01L29/518
    • The present invention provides a nonvolatile semiconductor memory device including memory cells capable of electrically writing information, and each of the memory cells includes a first insulating film formed on the channel provided between source/drain diffusion layers, an electric charge accumulation layer formed on the first insulating film and is made of nitride or oxynitride containing at least one selected from Si, Ge, Ga, and Al, a donor layer containing n-type dopant impurity formed on the electric charge accumulation layer and is made of nitride or oxynitride containing at least one selected from among Si, Ge, Ga, and Al, a second insulating film formed on the donor layer, and a control gate electrode formed on the second insulating film.
    • 本发明提供了一种包括能够电气写入信息的存储单元的非易失性半导体存储器件,并且每个存储单元包括形成在源/漏扩散层之间的沟道上的第一绝缘膜,形成在第一 绝缘膜,并且由含有选自Si,Ge,Ga和Al中的至少一种的氮化物或氮氧化物制成,包含形成在电荷蓄积层上的n型掺杂杂质的施主层,并且由至少包含氮化物或氧氮化物 选自Si,Ge,Ga和Al中的一种,在施主层上形成的第二绝缘膜,以及形成在第二绝缘膜上的控制栅电极。
    • 77. 发明申请
    • Process for Film Production and Semiconductor Device Utilizing Film Produced by the Process
    • 薄膜生产工艺及利用该工艺生产的薄膜的半导体器件
    • US20080038585A1
    • 2008-02-14
    • US11575874
    • 2005-10-07
    • Teruhiko KumadaNaoki YasudaHideharu NobutokiNorihisa MatsumotoShigeru Matsuno
    • Teruhiko KumadaNaoki YasudaHideharu NobutokiNorihisa MatsumotoShigeru Matsuno
    • C23C8/00
    • C23C16/38H01L21/318H01L21/76801
    • The present invention provides a method of manufacturing a film including the steps of using a compound with borazine skeleton (preferably a compound expressed by a chemical formula (1) below (where R1-R6 may be identical with or different from each other, and are each independently selected from a group consisting of a hydrogen atom, and an alkyl group, an alkenyl group and an alkynyl group each having a carbon number of 1-4, on condition that at least one of R1-R6 is not the hydrogen atom)) as a raw material, and forming the film on a substrate by using a chemical vapor deposition method, characterized in that a negative charge is applied to a site for placing the substrate, and a semiconductor device utilizing a film manufactured by the method. With the present invention, it is possible to provide a method of manufacturing a film, which method stably provides a low dielectric constant and a high mechanical strength over a long period of time, reduces the amount of a gas component (outgas) emitted in heating the film, and avoids any trouble in the device manufacturing process.
    • 本发明提供一种膜的制造方法,其包括使用具有环硼氮烷骨架的化合物(优选以下述化学式(1)表示的化合物(其中R 1〜R 6) 并且各自独立地选自氢原子和烷基,链烯基和各自具有碳数为1-4的炔基, 条件是R 1 -R 6中的至少一个不是氢原子))作为原料,并且通过使用化学气相在基板上形成该膜 沉积方法,其特征在于将负电荷施加到用于放置所述衬底的位置,以及利用通过所述方法制造的膜的半导体器件。 通过本发明,可以提供一种膜的制造方法,该方法在长时间内稳定地提供低介电常数和高机械强度,减少了在加热中排出的气体成分(废气)的量 并避免了设备制造过程中的任何麻烦。
    • 78. 发明申请
    • Semiconductor device manufacturing apparatus, semiconductor device manufacturing method and semiconductor device
    • 半导体装置制造装置,半导体装置的制造方法以及半导体装置
    • US20070072394A1
    • 2007-03-29
    • US11412990
    • 2006-04-28
    • Kazuhiro ShimizuHajime AkiyamaNaoki Yasuda
    • Kazuhiro ShimizuHajime AkiyamaNaoki Yasuda
    • H01L21/00
    • H01L21/67271H01L21/67282H01L2924/0002H01L2924/00
    • A semiconductor device manufacturing apparatus is provided with a drawing pattern printing part having a print head which injects a conductive solvent, an insulative solvent and an interface treatment solution. The print head is formed in such a way that desired circuit drawing pattern can be printed on a wafer based on information on the drawing pattern from a wafer testing part, information on the wafer from a storage part and coordinate information from a chip coordinate recognition part. In a semiconductor device manufacturing method according to the present invention, a semiconductor device is manufactured by using the semiconductor device manufacturing apparatus in such a manner that desired circuits are formed through printing process. In the semiconductor device, pad electrodes and so on are formed in such a way that trimming process can be conducted by printing circuit drawing patterns.
    • 半导体器件制造装置具备:具有喷射导电性溶剂的印刷头,绝缘性溶剂和界面处理液的图形印刷部。 打印头形成为使得可以基于来自晶片测试部件的绘图图案的信息,从存储部分获得关于晶片的信息和来自芯片坐标识别部分的坐标信息,将期望的电路图形图案印刷在晶片上 。 在根据本发明的半导体器件制造方法中,通过使用半导体器件制造设备以通过印刷处理形成期望的电路的方式制造半导体器件。 在半导体器件中,焊盘电极等以能够通过打印电路图形进行修整处理的方式形成。