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71. 发明授权

US09344806B2 Component having a micro-mechanical microphone structure and method for producing the component 有权
标题翻译：具有微机械麦克风结构的部件及其制造方法
公开(公告)号：US09344806B2
公开(公告)日：2016-05-17
申请号：US13388014
申请日：2010-06-02
申请人： Jochen Reinmuth
发明人： Jochen Reinmuth
IPC分类号： H04R25/00 , H04R19/00 , H04R31/00 , H04R19/04
CPC分类号： H04R19/005 , H04R19/04 , H04R31/00 , Y10T29/49005
摘要： Measures are provided for improving the acoustic properties of a component (10) having a micromechanical microphone structure realized in a layer construction (20) over a substrate (1), and for simplifying the production method. The microphone structure of such a component (10) includes a diaphragm (11) deflectable by acoustic pressure, spanning a cavity (13) that acts as a rear-side volume in the rear side of the component, and includes a stationary, acoustically permeable counter-element (12) situated over the diaphragm (11). According to the invention, the layer construction (20) has, between the diaphragm (11) and the substrate (1), an enclosing layer (3) in which there is fashioned an acoustically transparent aperture (4). The diaphragm (11) is connected to the rear-side volume (13) via this aperture in the enclosing layer (3). Under the enclosing layer (3), the rear-side volume (13) extends laterally beyond this aperture (4).
摘要翻译：提供了用于改善在衬底（1）上的层结构（20）中实现的具有微机械麦克风结构的部件（10）的声学特性的措施，并且用于简化生产方法。这种部件（10）的麦克风结构包括通过声压可偏转的隔膜（11），跨过构件后侧的作为后侧容积的空腔（13），并且包括静止的，声透过的位于隔膜（11）上方的相对元件（12）。根据本发明，层结构（20）在隔膜（11）和基板（1）之间具有封闭层（3），其中形成有声透明的孔（4）。隔膜（11）通过封闭层（3）中的该孔连接到后侧容积（13）。在封闭层（3）下方，后侧容积（13）横向延伸越过该孔（4）。

72. 发明授权

US09309107B2 Micromechanical system and corresponding manufacturing method 有权
标题翻译：微机械系统及相应的制造方法
公开(公告)号：US09309107B2
公开(公告)日：2016-04-12
申请号：US13434486
申请日：2012-03-29
申请人： Jochen Reinmuth , Andreas Scheurle , Christian Bierhoff
发明人： Jochen Reinmuth , Andreas Scheurle , Christian Bierhoff
IPC分类号： B32B7/14 , B81C1/00 , G01P15/08
CPC分类号： B81C1/00039 , B81B2207/07 , G01P15/0802 , Y10T428/24851
摘要： A micromechanical system is described having a substrate; a first micromechanical functional area, which is situated above the substrate; a second micromechanical functional area, which is situated above the first micromechanical functional area and is connected via a first weblike anchoring structure to the first micromechanical functional area; a third micromechanical functional area, which is situated above the second micromechanical functional area, and which has a first subarea and a second subarea; the first subarea being connected via a second weblike anchoring structure to the second micromechanical functional area; and the second subarea being mounted floating over the substrate by the first subarea. The invention also provides a method for manufacturing such a micromechanical system.
摘要翻译：具有基板的微机械系统被描述; 位于基板上方的第一微机械功能区域; 第二微机械功能区域，其位于第一微机械功能区域上方，并且经由第一网状锚定结构连接到第一微机械功能区域; 第三微机械功能区域，其位于第二微机械功能区域上方，并且具有第一子区域和第二子区域; 所述第一子区域经由第二网状锚定结构连接到所述第二微机械功能区域; 并且第二子区域通过第一子区域浮动在衬底上。本发明还提供了一种用于制造这种微机械系统的方法。

73. 发明授权

US09136169B2 Method for producing an electrical feedthrough in a substrate, and substrate having an electrical feedthrough 有权
标题翻译：在基板中制造电馈通的方法，以及具有电馈通的基板
公开(公告)号：US09136169B2
公开(公告)日：2015-09-15
申请号：US13195470
申请日：2011-08-01
申请人： Jochen Reinmuth
发明人： Jochen Reinmuth
IPC分类号： H01K3/10 , H01L21/768 , B81B3/00 , G01L9/00 , G01L19/00 , H01L23/48
CPC分类号： H01L21/76898 , B81B3/0086 , B81B2201/0264 , B81B2207/096 , G01L9/0042 , G01L19/0076 , H01L21/7682 , H01L23/481 , H01L2924/0002 , Y10T29/49165 , H01L2924/00
摘要： A method is described for producing an electrical feedthrough in a substrate, and a substrate having an electrical feedthrough. The method has the following operations of forming the electrical feedthrough so that it extends through the substrate from the front side to the back side of the substrate, forming a first closing layer on a front side of the substrate, forming an annular isolation trench in the substrate which encloses the electrical feedthrough, using an etching process starting from the back side of the substrate, the etching process terminating at the first closing layer, and closing off the annular isolation trench in the substrate by forming a second closing layer on the back side of the substrate.
摘要翻译：描述了一种用于在基板中制造电馈通的方法，以及具有电馈通的基板。该方法具有形成电馈通的以下操作，使得其从衬底的前侧延伸到后侧，在衬底的前侧形成第一闭合层，在衬底的前侧形成环形隔离沟槽衬底，其包围电馈通，使用从衬底的背面开始的蚀刻工艺，蚀刻工艺终止于第一封闭层，并且通过在背面形成第二封闭层来封闭衬底中的环形隔离沟槽的基底。

74. 发明授权

US09114978B2 Method for manufacturing a component having an electrical through-connection 有权
标题翻译：用于制造具有电贯通连接的部件的方法
公开(公告)号：US09114978B2
公开(公告)日：2015-08-25
申请号：US13921419
申请日：2013-06-19
申请人： Jochen Reinmuth , Jens Frey , Yvonne Bergmann
发明人： Jochen Reinmuth , Jens Frey , Yvonne Bergmann
IPC分类号： H01L29/84 , B81C1/00 , B81B3/00 , B81B7/00
CPC分类号： B81C1/00134 , B81B3/0018 , B81B7/007 , B81B2207/095
摘要： A method for manufacturing a component having an electrical through-connection includes: providing a semiconductor substrate having a front side and a back side opposite from the front side; producing, on the front side of the semiconductor substrate, an insulating trench which annularly surrounds a contact area; introducing an insulating material into the insulating trench; producing a contact hole on the front side of the semiconductor substrate by removing the semiconductor material surrounded by the insulating trench in the contact area; and depositing a metallic material in the contact hole.
摘要翻译：一种用于制造具有电穿通连接的部件的方法包括：提供具有前侧和与前侧相对的后侧的半导体衬底; 在所述半导体衬底的前侧产生环形地围绕接触区域的绝缘沟槽; 将绝缘材料引入绝缘沟槽中; 通过去除由接触区域中的绝缘沟槽围绕的半导体材料，在半导体衬底的正面上产生接触孔; 以及在所述接触孔中沉积金属材料。

75. 发明申请

US20150001653A1 MEMS structural component including a deflectable diaphragm and a fixed counter-element as well as a method for manufacturing it 有权
标题翻译： MEMS结构部件包括可偏转的膜片和固定的相对元件以及其制造方法
公开(公告)号：US20150001653A1
公开(公告)日：2015-01-01
申请号：US14314624
申请日：2014-06-25
申请人： Christoph SCHELLING , Yvonne BERGMANN , Jochen REINMUTH
发明人： Christoph SCHELLING , Yvonne BERGMANN , Jochen REINMUTH
IPC分类号： B81C1/00 , B81B3/00
CPC分类号： B81C1/00158 , B81B3/0021 , B81B2201/0257
摘要： For simplifying the manufacture of a MEMS structural component including a deflectable diaphragm which spans an opening in the rear side of the structural component, and including a fixed counter-element, which is provided with passage openings, the counter-element from the base substrate of the MEMS structural component is patterned and the deflectable diaphragm is implemented in a layered structure on the base substrate. These measures are intended to improve the diaphragm properties and reduce the overall height of the MEMS structural component.
摘要翻译：为了简化MEMS结构部件的制造，该MEMS结构部件包括跨越结构部件的后侧的开口的可偏转隔膜，并且包括设置有通道开口的固定的相对元件，来自基底基板的相对元件 MEMS结构部件被图案化，并且可偏转膜片以基底衬底上的分层结构实现。这些措施旨在改善隔膜性能并降低MEMS结构部件的整体高度。

76. 发明申请

US20140374853A1 COMPONENT INCLUDING MEANS FOR REDUCING ASSEMBLY-RELATED MECHANICAL STRESSES AND METHODS FOR MANUFACTURING SAME 审中-公开
标题翻译：组件包括减少组装相关机械应力的方法及其制造方法
公开(公告)号：US20140374853A1
公开(公告)日：2014-12-25
申请号：US14307662
申请日：2014-06-18
申请人： Heribert WEBER , Hartmut KUEPPERS , Jens FREY , Jochen REINMUTH , Neil DAVIES
发明人： Heribert WEBER , Hartmut KUEPPERS , Jens FREY , Jochen REINMUTH , Neil DAVIES
IPC分类号： B81C1/00 , B81B3/00
CPC分类号： B81B7/0048 , H01L2224/16225
摘要： Measures are provided for stress decoupling between a semiconductor component and its mounting support, these measures being implementable very easily, inexpensively and in a space-saving manner, regardless of the substrate thickness of the component, and not being limited to soldered connections but instead also being usable in conjunction with other mounting and joining techniques. These measures relate to components, which include at least one electrical and/or micromechanical functionality and at least one wiring level, which is formed in a layer structure on a main surface of the component substrate, at least one mounting surface being implemented in the wiring level to establish a mechanical and/or electrical connection of the component to a support. The at least one mounting surface is spring mounted and is separated from the layer structure in at least some areas for this purpose.
摘要翻译：提供了用于半导体部件与其安装支撑件之间的应力解耦的措施，这些措施可以非常容易地，低成本地且以节省空间的方式实现，而不管部件的基板厚度如何，而不仅限于焊接连接，而且还包括可与其他安装和连接技术结合使用。这些措施涉及组件，其包括至少一个电和/或微机械功能和至少一个布线层，其形成在部件基板的主表面上的层结构中，至少一个安装表面被实施在布线以建立部件与支撑件的机械和/或电连接。为此，至少一个安装表面是弹簧安装的，并且在至少一些区域中与层结构分离。

77. 发明授权

US08756996B2 Micromechanical system 有权
标题翻译：微机械系统
公开(公告)号：US08756996B2
公开(公告)日：2014-06-24
申请号：US13134020
申请日：2011-05-25
申请人： Jochen Reinmuth
发明人： Jochen Reinmuth
IPC分类号： G01P15/125 , H01L21/28
CPC分类号： G01P15/125 , B81B3/007 , B81B2201/0235 , B81B2203/0118 , B81B2203/0307 , G01P15/0802 , G01P2015/0811 , G01P2015/0871
摘要： In a micromechanical system having a substrate and an electrode situated over the substrate, the electrode is connected to the substrate via a vertical spring. The vertical spring is sectionally provided in a first conductive layer and sectionally provided in a second conductive layer, the second conductive layer being situated over the first conductive layer and the first conductive layer being situated over the substrate. The electrode is provided in a third conductive layer, which is situated over the second conductive layer.
摘要翻译：在具有衬底和位于衬底上方的电极的微机械系统中，电极通过垂直弹簧连接到衬底。垂直弹簧被剖面地设置在第一导电层中并且分段地设置在第二导电层中，第二导电层位于第一导电层之上，第一导电层位于衬底之上。电极设置在位于第二导电层上方的第三导电层中。

78. 发明授权

US08741774B2 Method for producing an electrical feedthrough in a substrate, and a substrate having an electrical feedthrough 有权
标题翻译：在基板中制造电馈通的方法，以及具有电馈通的基板
公开(公告)号：US08741774B2
公开(公告)日：2014-06-03
申请号：US13659030
申请日：2012-10-24
申请人： Jochen Reinmuth , Yvonne Bergmann
发明人： Jochen Reinmuth , Yvonne Bergmann
IPC分类号： H01L21/44 , H01L21/768 , H01L23/48
CPC分类号： H01L21/76898 , B81B2207/096 , B81C1/00301 , G01L9/0045 , G01L9/0054 , G01L19/0076 , H01L21/7682 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： A method for producing an electrical feedthrough in a substrate includes: forming a first printed conductor on a first side of a substrate which electrically connects a first contact area of the substrate on the first side; forming a second printed conductor on a second side of a substrate which electrically connects a second contact area of the substrate on the second side; forming an annular trench in the substrate, a substrate punch being formed which extends from the first contact area to the second contact area; and selectively depositing an electrically conductive layer on an inner surface of the annular trench, the substrate punch being coated with an electrically conductive layer and remaining electrically insulated from the surrounding substrate due to the annular trench.
摘要翻译：一种用于在基板中制造电馈通的方法包括：在基板的第一侧上形成第一印刷导体，该第一印刷导体电连接第一侧上的基板的第一接触区域; 在基板的第二侧上形成第二印刷导体，所述第二印刷导体电连接所述第二侧上的所述基板的第二接触区域; 在所述衬底中形成环形沟槽，形成从所述第一接触区域延伸到所述第二接触区域的衬底冲头; 以及在所述环形沟槽的内表面上选择性地沉积导电层，所述衬底冲头涂覆有导电层，并且由于所述环形沟槽而与所述周围衬底保持电绝缘。

79. 发明申请

US20140131888A1 Method for producing an electrical feedthrough in a substrate, and substrate having an electrical feedthrough 有权
标题翻译：在基板中制造电馈通的方法，以及具有电馈通的基板
公开(公告)号：US20140131888A1
公开(公告)日：2014-05-15
申请号：US14065695
申请日：2013-10-29
申请人： Jochen REINMUTH , Matthias Neubauer , Martin Lindemann , Eduard Rije , Michael Baumann
发明人： Jochen REINMUTH , Matthias Neubauer , Martin Lindemann , Eduard Rije , Michael Baumann
IPC分类号： H01L21/768 , H01L23/48
CPC分类号： H01L21/76898 , B81C1/00095 , H01L21/7682 , H01L23/481 , H01L2224/13 , H01L2924/1461 , H01L2924/00
摘要： A method for producing an electrical feedthrough in a substrate having an electrical feedthrough, including: forming an etch stop layer on the front side of the substrate; forming a mask on the back side of the substrate; forming an annular trench in the substrate, which trench extends from the back to the front side, by an etching process that stops at the etch stop layer, using the mask, the trench surrounding a substrate punch; depositing a metal layer over the back side of the substrate using the mask, the metal layer penetrating into the annular trench and being deposited on the substrate punch; forming a metal silicide layer on the substrate punch by at least partially converting the metal layer into the metal silicide layer on the substrate punch; selectively removing a remainder of the metal layer; and closing off the annular trench at the back side of the substrate.
摘要翻译：一种用于在具有电馈通的基板中制造电馈通的方法，包括：在所述基板的正面上形成蚀刻停止层; 在基板的背面形成掩模; 在所述衬底中形成环形沟槽，所述沟槽通过使用所述掩模在所述蚀刻停止层处停止所述沟槽围绕衬底冲头的所述沟槽从所述背面延伸到所述前侧; 使用掩模在衬底的背面上沉积金属层，金属层穿透环形沟槽并沉积在衬底冲头上; 通过至少部分地将所述金属层转化为所述基板冲头上的金属硅化物层而在所述基板冲头上形成金属硅化物层; 选择性地除去金属层的剩余部分; 并且关闭衬底背面的环形沟槽。

80. 发明授权

US08695427B2 Micromechanical component having a test structure for determining the layer thickness of a spacer layer and method for manufacturing such a test structure 有权
标题翻译：具有用于确定间隔层的层厚度的测试结构的微机械部件和用于制造这种测试结构的方法
公开(公告)号：US08695427B2
公开(公告)日：2014-04-15
申请号：US13116759
申请日：2011-05-26
申请人： Jochen Reinmuth , Ralf Boessendoerfer , Axel Franke , Mirko Hattass
发明人： Jochen Reinmuth , Ralf Boessendoerfer , Axel Franke , Mirko Hattass
IPC分类号： G01P15/125
CPC分类号： G01B7/085 , B81B2201/0242 , B81C99/0045 , G01P15/125 , G01P2015/082 , G01P2015/0831
摘要： A micromechanical component is described including a substrate having a spacer layer and a test structure for ascertaining the thickness of the spacer layer. The test structure includes a seismic mass, which is elastically deflectable along a measuring axis parallel to the substrate, a first electrode system and a second electrode system for deflecting the seismic mass along the measuring axis, having a mass electrode, which is produced by a part of the seismic mass, and a substrate electrode, which is situated on the substrate in each case, the first electrode system being designed to be thicker than the second electrode system by the layer thickness of the spacer layer.
摘要翻译：描述了一种微机械部件，其包括具有间隔层的基板和用于确定间隔层的厚度的测试结构。测试结构包括沿着平行于基板的测量轴线可弹性偏转的地震质量块，用于沿着测量轴偏转地震质量块的第一电极系统和第二电极系统，具有质量电极，其由地震质量的一部分，以及基板电极，其位于每种情况下的基板上，第一电极系统被设计为比间隔层的层厚度厚于第二电极系统。

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