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71. 发明申请

US20090205808A1 LIQUID COOLING DEVICE FOR MULTIPLE ELECTRONIC COMPONENTS 审中-公开
标题翻译：用于多个电子元件的液体冷却装置
公开(公告)号：US20090205808A1
公开(公告)日：2009-08-20
申请号：US12033234
申请日：2008-02-19
申请人： Cheng-Feng WAN , Hao-Hui Lin , Su-Chen Hu
发明人： Cheng-Feng WAN , Hao-Hui Lin , Su-Chen Hu
IPC分类号： F28F7/00
CPC分类号： H01L23/473 , G06F1/20 , G06F2200/201 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling device for multiple electronic components has two liquid blocks, a heat-dissipating plate, a pump and a heat sink. The two liquid blocks and the heat sink are connected and communicated with other via tubing. The pump operates to make a coolant circulate among the two liquid blocks and the heat sink. The heat-dissipating plate is integrally formed with one liquid block. The heat-dissipating plate is disposed on another separate electronic component for absorbing heat. Therefore, the liquid cooling device has only two liquid blocks, but can dissipate heat generated by three electronic components.
摘要翻译：用于多个电子部件的液体冷却装置具有两个液体块，散热板，泵和散热器。两个液体块和散热器连接并与其他通孔管连通。泵用于使冷却剂在两个液体块和散热器之间循环。散热板与一个液体块一体形成。散热板设置在另一个单独的电子部件上以吸收热量。因此，液体冷却装置仅具有两个液体块，但是可以消散由三个电子部件产生的热量。

72. 发明申请

US20090135620A1 VEHICLE LAMP 失效
标题翻译：车灯
公开(公告)号：US20090135620A1
公开(公告)日：2009-05-28
申请号：US12271985
申请日：2008-11-17
申请人： Cheng-Feng Wan , Hao-Hui Lin , Su-Chen Hu
发明人： Cheng-Feng Wan , Hao-Hui Lin , Su-Chen Hu
IPC分类号： F21S8/10 , F21V7/00
CPC分类号： B60Q1/0017 , F21S41/141 , F21S41/143 , F21S45/43 , F21S45/46 , F21V29/51 , F21V29/56 , F21V29/763
摘要： A vehicle lamp has a lamp holder, an LED array, an interior heat sink and a heat exchanger. The lamp holder is hollow and has a heat conductive portion. The LED array is mounted in the lamp holder. The interior heat sink is mounted on the LED array and has an inner conductor being attached between the LED array and the heat conductive portion. The heat exchanger is mounted on an outer side of the heat conductive portion. Therefore, the vehicle lamp can efficiently dissipate heat generated by the LED array by the interior heat sink and the heat exchanger with little or no dust entering the lamp holder and accumulating on the LED array for improved lifespan and constant heat dissipating performance.
摘要翻译：车灯具有灯座，LED阵列，内部散热器和热交换器。灯座是中空的并且具有导热部分。 LED阵列安装在灯座中。内部散热器安装在LED阵列上，并且在LED阵列和导热部分之间具有内部导体。热交换器安装在导热部分的外侧。因此，车灯可以通过内部散热器和热交换器有效地散发由LED阵列产生的热量，很少或没有灰尘进入灯座并积聚在LED阵列上，从而提高寿命和恒定的散热性能。

73. 发明申请

US20080308920A1 SYSTEM AND METHOD OF FABRICATING MICRO CAVITIES 失效
标题翻译：制作微孔子的系统和方法
公开(公告)号：US20080308920A1
公开(公告)日：2008-12-18
申请号：US12028841
申请日：2008-02-11
申请人： Chang-Feng Wan
发明人： Chang-Feng Wan
IPC分类号： H01L23/02
CPC分类号： G01L9/0042 , B81B2201/0264 , B81B2203/0118 , B81B2203/0307 , B81B2203/0384 , B81B2207/07 , B81C1/00095 , B81C1/00285 , B81C1/00333 , B81C2201/019 , H01G5/16 , H01G5/40 , H01L29/82
摘要： A system and method for manufacturing micro cavity packaging enclosure at the wafer level using MEMS (MicroElectroMechanical Systems) process, wherein micro cavities are formed from epoxy-bonded single-crystalline silicon wafer as its cap, epoxy and deposited metal or insulator as at least part of its sidewall, on substrate wafers.
摘要翻译：一种用于使用MEMS（微电子机械系统）工艺在晶片级制造微腔封装外壳的系统和方法，其中微腔由环氧键合单晶硅晶片作为其盖，环氧树脂和沉积的金属或绝缘体形成为至少部分的侧壁。

74. 发明授权

US07410391B2 Stacked electrical connector assembly with stable mating characteristic 失效
标题翻译：具有稳定配合特性的堆叠电连接器组件
公开(公告)号：US07410391B2
公开(公告)日：2008-08-12
申请号：US11786227
申请日：2007-04-11
申请人： Feng Wan , Jin-Kui Hu , Guo-Hua Zhang
发明人： Feng Wan , Jin-Kui Hu , Guo-Hua Zhang
IPC分类号： H01R13/648
CPC分类号： H01R27/02 , H01R12/716
摘要： An electrical connector assembly (100) mounted on a printed circuit board (PCB) includes an insulative housing (1) defining a pair of stacked receiving cavities (15, 16) for receiving a first and a second connector components (2, 3) therein, a holder (4) attached to the insulative housing and a metal shield enclosing the insulative housing. The holder (4) is fixed to a rear wall (14) of the insulative housing (1) and includes a vertical mating portion (41) and a pair of top and bottom portions (42, 43) extending backwardly from the mating portion. The top and bottom portions (42, 43) are parallel to each other wherein the top portion (42) is shorter than the bottom portion (43). An area of the top portion is smaller than that of the bottom portion.
摘要翻译：安装在印刷电路板（PCB）上的电连接器组件（100）包括限定一对堆叠的容纳空腔（15,16）的绝缘壳体（1），用于在其中容纳第一和第二连接器部件（2,3），附接到绝缘壳体的保持器（4）和包围绝缘壳体的金属屏蔽件。保持器（4）固定在绝缘壳体（1）的后壁（14）上并且包括垂直配合部分（41）和从配合部分向后延伸的一对顶部和底部部分（42,43）。顶部和底部部分（42,43）彼此平行，其中顶部部分（42）比底部部分（43）短。顶部的面积小于底部的面积。

75. 发明申请

US20070243757A1 Stacked electrical connector assembly with stable mating characteristic 失效
标题翻译：具有稳定配合特性的堆叠电连接器组件
公开(公告)号：US20070243757A1
公开(公告)日：2007-10-18
申请号：US11786227
申请日：2007-04-11
申请人： Feng Wan , Jin-Kui Hu , Guo-Hua Zhang
发明人： Feng Wan , Jin-Kui Hu , Guo-Hua Zhang
IPC分类号： H01R13/66
CPC分类号： H01R27/02 , H01R12/716
摘要： An electrical connector assembly (100) mounted on a printed circuit board (PCB) includes an insulative housing (1) defining a pair of stacked receiving cavities (15, 16) for receiving a first and a second connector components (2, 3) therein, a holder (4) attached to the insulative housing and a metal shield enclosing the insulative housing. The holder (4) is fixed to a rear wall (14) of the insulative housing (1) and includes a vertical mating portion (41) and a pair of top and bottom portions (42, 43) extending backwardly from the mating portion. The top and bottom portions (42, 43) are parallel to each other wherein the top portion (42) is shorter than the bottom portion (43). An area of the top portion is smaller than that of the bottom portion.
摘要翻译：安装在印刷电路板（PCB）上的电连接器组件（100）包括限定一对堆叠的容纳空腔（15,16）的绝缘壳体（1），用于在其中容纳第一和第二连接器部件（2,3），附接到绝缘壳体的保持器（4）和包围绝缘壳体的金属屏蔽件。保持器（4）固定在绝缘壳体（1）的后壁（14）上并且包括垂直配合部分（41）和从配合部分向后延伸的一对顶部和底部部分（42,43）。顶部和底部部分（42,43）彼此平行，其中顶部部分（42）比底部部分（43）短。顶部的面积小于底部的面积。

76. 发明授权

US07265477B2 Stepping actuator and method of manufacture therefore 失效
标题翻译：因此，步进式致动器及其制造方法
公开(公告)号：US07265477B2
公开(公告)日：2007-09-04
申请号：US11028409
申请日：2005-01-03
申请人： Chang-Feng Wan
发明人： Chang-Feng Wan
IPC分类号： H02N1/00 , H01H59/00 , G02B26/00
CPC分类号： H02N1/006 , H01G5/16 , H01G5/38
摘要： An embodiment of the present invention provides a stepping actuator, comprising a suspended membrane comprising a plurality of movable electrodes connected by plurality of spring hinges to a payload platform; and anchors connecting said membrane to a substrate, said substrate comprising a plurality of fixed electrodes; wherein said movable electrodes of said suspended membrane and said fixed electrodes from said substrate form parallel-plate electrostatic sub-actuators.
摘要翻译：本发明的一个实施例提供了一种步进致动器，其包括悬挂膜，该悬浮膜包括由多个弹簧铰链连接到有效载荷平台的多个可移动电极; 以及将所述膜连接到基底上，所述基底包括多个固定电极; 其中所述悬浮膜的所述可移动电极和所述固定电极从所述衬底形成平行板静电副致动器。

77. 发明授权

US07005775B2 Microfabricated torsional drive utilizing lateral electrostatic force 失效
标题翻译：使用横向静电力的微型扭转驱动
公开(公告)号：US07005775B2
公开(公告)日：2006-02-28
申请号：US10142821
申请日：2002-05-09
申请人： Chang Feng Wan
发明人： Chang Feng Wan
IPC分类号： H02N1/00 , G02B26/08
CPC分类号： G02B26/0841 , B81B3/0035 , B81B2201/033 , B81B2201/045 , B81B2203/058
摘要： The present invention is related to a novel micro-electro-mechanical systems (MEMS) torsional drive that is capable of tilting suspended structure such as a micro-mirror for steering light beams in three-dimensional analog fashion, which is suitable for high port count optical switches. The torsional drive has the advantages of allowing large tilt angle, having low drive voltage, and capable of providing a feedback signal for closed-loop control.
摘要翻译：本发明涉及一种新颖的微电机械系统（MEMS）扭转驱动器，其能够倾斜诸如用于以三维模拟方式转向光束的微镜等悬置结构，适用于高端口数光开关。扭转驱动器具有允许具有低驱动电压的大倾斜角度并且能够提供用于闭环控制的反馈信号的优点。

78. 发明授权

US5959340A Thermoplastic mounting of a semiconductor die to a substrate having a mismatched coefficient of thermal expansion 失效
公开(公告)号：US5959340A
公开(公告)日：1999-09-28
申请号：US707815
申请日：1996-08-30
申请人： Chang-Feng Wan , Richard Scott List , Curtis Gene Garrett , Dwight U. Bartholomew
发明人： Chang-Feng Wan , Richard Scott List , Curtis Gene Garrett , Dwight U. Bartholomew
IPC分类号： H01L21/58 , H01L31/00
CPC分类号： H01L24/83 , H01L24/29 , H01L2224/2919 , H01L2224/32145 , H01L2224/8319 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/0103 , H01L2924/01033 , H01L2924/01049 , H01L2924/01051 , H01L2924/01052 , H01L2924/0132 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/12043 , H01L2924/14 , H01L2924/351
摘要： This invention relates to mounting integrated circuits (IC) to multi-chip modules (MCM) or substrates. More specifically, it provides a method of mounting a semiconductor die such as a thin slice of Mercury Cadmium Telluride (MCT) to a silicon semiconductor substrate, a read-out integrated circuit (ROIC), using a thermoplastic to reduce stress on the MCT caused by mismatched Coefficients of Thermal Expansion (CTE). This process provides for an array of infrared photodetectors on a material such as MCT to be mounted to a read-out integrated circuit (ROIC) using the Vertical Integrated Photodiode (VIP) approach to FPAs, while allowing double sided interdiffusion of CdTe for surface passivation to reduce dark currents and improve performance, without the problems associated with mismatched coefficients of thermal expansion during high temperature processes.

79. 发明授权

US5846850A Double sided interdiffusion process and structure for a double layer heterojunction focal plane array 失效
标题翻译：双层异质结焦平面阵列的双面相互扩散过程和结构
公开(公告)号：US5846850A
公开(公告)日：1998-12-08
申请号：US706583
申请日：1996-09-05
申请人： Peter D. Dreiske , Chang-Feng Wan
发明人： Peter D. Dreiske , Chang-Feng Wan
IPC分类号： H01L27/146 , H01L31/18
CPC分类号： H01L27/1465
摘要： This invention relates to a process and structure for performing a high temperature or other process on both sides of a thin slice of material or die prior to being placed onto a integrated circuit or multi-chip module. In a particular embodiment, a process and structure is given to provide for double sided interdiffusion for passivation of a Mercury Cadmium Telluride (MCT) film which is mounted to a read-out integrated circuit (ROIC) face side up in order to fabricate vertically integrated Focal Plane Arrays (FPAs) with reduced dark currents and improved performance. The process of the present invention also allows for the insertion of novel materials such as Double Layer Heterojunction (DLHJ), MBE, MOCVD, etc. in the vertical integrated approach to FPAs.
摘要翻译：本发明涉及一种用于在被放置在集成电路或多芯片模块上之前在薄片材料或管芯的两侧执行高温或其它工艺的工艺和结构。在特定实施例中，提供了一种工艺和结构来提供用于钝化碲化汞碲化镉（MCT）膜的双面相互扩散，其将面向一侧的面向上安装到读出集成电路（ROIC），以制造垂直集成焦平面阵列（FPA）具有降低的暗电流和改进的性能。本发明的方法还允许在垂直集成方法中插入诸如双层异质结（DLHJ），MBE，MOCVD等的新型材料。

80. 发明授权

US4474640A In situ differential thermal analysis for HgCdTe LPE 失效
标题翻译： HgCdTe LPE的原位差热分析
公开(公告)号：US4474640A
公开(公告)日：1984-10-02
申请号：US326301
申请日：1981-12-01
申请人： Chang-Feng Wan
发明人： Chang-Feng Wan
IPC分类号： C30B19/02 , C30B19/10
CPC分类号： C30B19/02 , C30B29/48
摘要： For HgCdTe liquid phase epitaxy (LPE), in situ differential thermal analysis apparatus is used to precisely monitor the liquidus temperature of each HgCdTe melt. The neutral body, e.g. a slug of copper enclosed in a silica ampoule, is placed near the LPE reactor in a furnace. During heating or cooling, differential sensing of a pair of thermocouples (in the melt and in the neutral body) will show an accelerated change at transformation points, since at these points the temperature of the melt will be changed by the energy of the physical change, while that of the neutral body remains subject only to passive heat transfer. Thus, the actual liquidus temperature of each melt can be measured with extreme precision, and isothermal or programmed cooling methods of LPE can be precisely and reliably controlled under production conditions.
摘要翻译：对于HgCdTe液相外延（LPE），使用原位差分热分析仪器精确监测每个HgCdTe熔体的液相线温度。中性体，例如将封闭在二氧化硅安瓿中的铜块放置在炉中的LPE反应器附近。在加热或冷却过程中，一对热电偶（在熔体和中性体中）的差分感应将在相变点显示出加速的变化，因为在这些点上，熔体的温度将被物理变化的能量所改变，而中性身体的物体仍然只受到被动热传递。因此，可以极精度地测量每个熔体的实际液相线温度，并且可以在生产条件下精确可靠地控制LPE的等温或程序冷却方法。

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