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    • 71. 发明授权
    • Method of manufacturing array substrate
    • 阵列基板的制造方法
    • US06528357B2
    • 2003-03-04
    • US09266804
    • 1999-03-12
    • Masayuki DojoAkira Kubo
    • Masayuki DojoAkira Kubo
    • H01L2100
    • H01L27/124H01L27/1214H01L27/1259H01L29/458H01L29/4908H01L29/66765
    • In the manufacturing method of array substrates for use in flat panel display devices including liquid crystal display (LCD) devices, it is aimed to prevent failure of interlayer dielectric film due to wiring deformation or the like while reducing the resistivity of wiring. It is also aimed to prevent corrosion of a metal wiring layer at the etching process and to thereby prevent deterioration of production yield due to corrosion. According to the method of the invention, to form scanning lines (111), an aluminum-neodymium alloy (Al-Nd) film (1110) is deposited in 300 nm thickness on the first hand, and then 50 nm thick Mo film (1110) is deposited thereon. Subsequently, gate insulator films (115 and 117) are formed by CVD processes at a substrate temperature of 350° C. Further, an etching process for forming pixel electrode (131) is carried out by HBr, HI, Oxalic acid or a mixture liquid containing at least one of these acids.
    • 在液晶显示(LCD)装置的平板显示装置中使用的阵列基板的制造方法中,为了防止由布线变形等引起的层间绝缘膜的故障,同时降低布线的电阻率。 另外,为了防止腐蚀时的金属配线层的腐蚀,防止腐蚀引起的制造成品率的劣化。 根据本发明的方法,为了形成扫描线(111),首先以300nm的厚度沉积铝 - 钕合金(Al-Nd)膜(1110),然后将50nm厚的Mo膜(1110 )沉积在其上。 随后,在350℃的衬底温度下通过CVD工艺形成栅极绝缘膜(115和117)。此外,用HBr,HI,草酸或混合液体进行用于形成像素电极(131)的蚀刻工艺 含有这些酸中的至少一种。
    • 73. 发明授权
    • Method of Fabricating semiconductor device
    • 制造半导体器件的方法
    • US06274480B1
    • 2001-08-14
    • US09392661
    • 1999-09-09
    • Akira Kubo
    • Akira Kubo
    • H01L214763
    • H01L21/31111H01L21/31116H01L21/3212H01L21/76825H01L21/76826
    • There is provided a method of fabricating a semiconductor device, including the steps of (a) forming an insulating film on a semiconductor substrate, the insulating film being formed with a contact hole, (b) covering the insulating film with a metal film so that the contact hole is filled with the metal film, and (c) applying polishing such as CMP and wet-etching to the metal film to thereby pattern the metal film into a metal plug or a metal wiring layer. For instance, the insulating film is dipped into etchant or is exposed to vapor of etchant in the wet-etching. Since the insulating film is removed by wet-etching having a smaller removal rate than that of CMP, it is possible to minimize projection of a metal film, ensuring reliability of a semiconductor device.
    • 提供一种制造半导体器件的方法,包括以下步骤:(a)在半导体衬底上形成绝缘膜,所述绝缘膜形成有接触孔,(b)用金属膜覆盖绝缘膜,使得 接触孔填充有金属膜,(c)对金属膜进行CMP,湿法蚀刻等的研磨,将金属膜图案化成金属插塞或金属配线层。 例如,绝缘膜浸入蚀刻剂中,或者在湿蚀刻中暴露于蚀刻剂的蒸汽。 由于通过湿蚀刻除去具有比CMP更小的去除率的绝缘膜,所以可以使金属膜的投影最小化,从而确保半导体器件的可靠性。
    • 74. 发明授权
    • Method of manufacturing thin-film transistors
    • 制造薄膜晶体管的方法
    • US06235561B1
    • 2001-05-22
    • US09114471
    • 1998-07-13
    • Masahiro SeikiAkira Kubo
    • Masahiro SeikiAkira Kubo
    • H01L2100
    • H01L21/28008G02F1/1368H01L29/42384H01L29/66765
    • An array substrate of a liquid crystal display device has a glass substrate on which gate lines, signal lines, pixel electrodes, and thin-film transistors are arranged. Each of the thin-film transistors includes a gate electrode composed of a part of one of the gate lines and including a first conductive layer formed on the glass substrate and a second conductive layer covering the first conductive layer. A gate insulating film is formed on the glass substrate and covers the gate electrode. A thin non-single-crystal silicon film is disposed on the gate insulating film on the gate electrode and includes a channel region. Source and drain electrodes are connected electrically to the thin non-single-crystal silicon film. The first conductive layer has two opposite side edge portions extending inclined at an angle to the surface of the substrate, the inclination angle of each side edge portion is ranges from 10° to 30°, so that the thin non-single-crystal silicon film has a continuous interface without bends, situated on the side of the gate insulating film in the channel region.
    • 液晶显示装置的阵列基板具有布置有栅极线,信号线,像素电极和薄膜晶体管的玻璃基板。 每个薄膜晶体管包括由一条栅极线的一部分组成的栅极,并且包括形成在玻璃基板上的第一导电层和覆盖第一导电层的第二导电层。 在玻璃基板上形成栅极绝缘膜并覆盖栅电极。 薄的非单晶硅膜设置在栅电极上的栅极绝缘膜上,并且包括沟道区。 源极和漏极电极与薄的非单晶硅膜电连接。 第一导电层具有相对于基板的表面倾斜一定角度的两个相对的侧边缘部分,每个侧边缘部分的倾斜角度在10°至30°的范围内,使得薄的非单晶硅膜 具有不弯曲的连续接口,位于通道区域中的栅极绝缘膜的一侧。
    • 75. 发明授权
    • Polishing method of substrate and polishing device therefor
    • 抛光方法及其抛光装置
    • US5938502A
    • 1999-08-17
    • US967951
    • 1997-11-12
    • Akira Kubo
    • Akira Kubo
    • B24B37/013B24B49/02B24B49/12B24B7/22
    • B24B37/105B24B37/26B24B49/02B24B49/12
    • A method and device for polishing a substrate capable of accurate detection of a terminating point of polishing employing a polishing pad and a slurry. The polishing device includes a bed formed with a polishing pad on the surface and driven for rotation, a carrier rotatable above the bed and reciprocally movable with respect to the surface of the bed, and holding the substrate to be polished and slurry supply means for supplying a slurry as an abrasive to the surface of the polishing pad. Polishing of the surface of the substrate is performed by the abrasive and the polishing pad while pressing the substrate held by the carrier onto the polishing pad. During polishing, bowing condition of the substrate is detected by means of a bowing detector provided on the carrier to detecting a terminating point of polishing on the basis of bowing condition for stopping polishing operation of respective of the bed, carrier and the slurry supply means.
    • 一种用于抛光能够使用抛光垫和浆料精确检测抛光终点的基板的方法和装置。 抛光装置包括在表面上形成有抛光垫并被驱动旋转的床,载体可在床之上转动并相对于床的表面往复运动,并保持待抛光的基底和用于供应的浆料供给装置 作为研磨剂的浆料作为抛光垫的表面。 通过磨料和抛光垫对衬底的表面进行抛光,同时将由载体保持的衬底压在抛光垫上。 在抛光期间,通过设置在载体上的弯曲检测器检测基板的弯曲状态,以基于用于停止床,载体和浆料供给装置的各个的抛光操作的弯曲条件检测终止点。
    • 76. 发明授权
    • Thin-film transistor with edge inclined gates and liquid crystal display
device furnished with the same
    • 具有边缘倾斜门的薄膜晶体管和配备相同的液晶显示装置
    • US5811835A
    • 1998-09-22
    • US701464
    • 1996-08-22
    • Masahiro SeikiAkira Kubo
    • Masahiro SeikiAkira Kubo
    • G02F1/136G02F1/1368H01L21/28H01L21/336H01L21/77H01L21/84H01L27/12H01L29/786H01L27/01
    • H01L21/28008H01L29/42384H01L29/66765G02F1/1368
    • An array substrate of a liquid crystal display device has a glass substrate on which gate lines, signal lines, pixel electrodes, and thin-film transistors are arranged. Each of the thin-film transistors includes a gate electrode composed of a part of one of the gate lines and including a first conductive layer formed on the glass substrate and a second conductive layer covering the first conductive layer. A gate insulating film is formed on the glass substrate and covers the gate electrode. A thin non-single-crystal silicon film is disposed on the gate insulating film on the gate electrode and includes a channel region. Source and drain electrodes are connected electrically to the thin non-single-crystal silicon film. The first conductive layer has two opposite side edge portions extending inclined at an angle to the surface of the substrate, the inclination angle of each side edge portion is ranges from 10.degree. to 30.degree., so that the thin non-single-crystal silicon film has a continuous interface without bends, situated on the side of the gate insulating film in the channel region.
    • 液晶显示装置的阵列基板具有布置有栅极线,信号线,像素电极和薄膜晶体管的玻璃基板。 每个薄膜晶体管包括由一条栅极线的一部分组成的栅极,并且包括形成在玻璃基板上的第一导电层和覆盖第一导电层的第二导电层。 在玻璃基板上形成栅极绝缘膜并覆盖栅电极。 薄的非单晶硅膜设置在栅电极上的栅极绝缘膜上,并且包括沟道区。 源极和漏极电极与薄的非单晶硅膜电连接。 第一导电层具有相对于基板的表面倾斜倾斜的两个相对的侧边缘部分,每个侧边缘部分的倾斜角度在10°至30°的范围内,使得薄的非单晶硅膜 具有不弯曲的连续接口,位于通道区域中的栅极绝缘膜的一侧。
    • 78. 发明授权
    • System and method for thresholding system power loss notifications in a data processing system based on current distribution network configuration
    • 基于当前分布式网络配置,在数据处理系统中对系统功率损耗通知进行阈值处理的系统和方法
    • US07937602B2
    • 2011-05-03
    • US11695297
    • 2007-04-02
    • John Charles ElliottRobert Akira KuboGregg Steven Lucas
    • John Charles ElliottRobert Akira KuboGregg Steven Lucas
    • G06F1/26
    • G06F1/28G06F1/305
    • Mechanisms for thresholding system power loss notifications in a data processing system are provided. Power loss detection modules are provided in a data processing system having one or more data processing devices, such as blades in an IBM BladeCenter® chassis. The power loss detection modules detect the type of infrastructure of the data processing system, a position of a corresponding data processing device within the data processing system, and a capability of the data processing system to provide power during a power loss scenario. The detection module detects various inputs identifying these types of data processing system and power system characteristics and provides logic for defining a set of behaviors during a power loss scenario, e.g., behaviors for sending system notifications of imminent power loss. The detection of the various inputs and the defining of a set of behaviors may be performed statically and/or dynamically.
    • 提供了在数据处理系统中对系统功率损耗通知进行阈值处理的机制。 在具有一个或多个数据处理设备的数据处理系统中提供功率损耗检测模块,例如IBM BladeCenter机箱中的刀片。 功率损耗检测模块检测数据处理系统的基础设施的类型,数据处理系统内相应的数据处理设备的位置,以及数据处理系统在功率损耗情景期间提供功率的能力。 检测模块检测识别这些类型的数据处理系统和电力系统特性的各种输入,并提供用于在功率丢失情景期间定义一组行为的逻辑,例如用于发送即将发生的功率损耗的系统通知的行为。 可以静态和/或动态地执行各种输入的检测和一组行为的定义。
    • 79. 发明申请
    • Floating Connector
    • 浮动连接器
    • US20100075536A1
    • 2010-03-25
    • US12627858
    • 2009-11-30
    • Akira Kubo
    • Akira Kubo
    • H01R13/66
    • H01R13/6315H01R12/7005H01R12/727H01R13/6477
    • A floating connector is provides that enables impedance matching in the entire contact without hindrance of the movement of a movable housing. The floating connector includes a contact, a movable housing, a fixed housing, and an impedance adjusting member. The contact includes a contact portion to be mated with a mating contact, a board connecting portion to be connected to a circuit board, and a flexible coupling portion that is flexible and that couples the contact portion and the board connecting portion. The movable housing receives the contact portion of the contact therein, while the fixed housing secures the board connecting portion of the contact thereto. The movable housing is stacked over the fixed housing, with each being spaced apart from each other by a given distance. The impedance adjusting member is arranged and receives the coupling portion. The flexible coupling portion is formed in such a way to have an S-shape. The flexible coupling portion includes a first curved portion, a second curved portion, and a linear coupling portion. The second curved portion bends in a reversed direction from a direction that the first curved portion bends, while the linear coupling portion connects the first curved portion and the second curved portion.
    • 提供了一种浮动连接器,其能够在整个接触中实现阻抗匹配,而不会妨碍可移动壳体的运动。 浮动连接器包括触点,可动壳体,固定壳体和阻抗调节构件。 触点包括与配合触点配合的接触部分,与电路板连接的电路板连接部分,以及柔性耦合部分,该柔性耦合部分是柔性连接接触部分和电路板连接部分。 可动壳体容纳其中的触点的接触部分,而固定壳体将触点的板连接部分固定在其上。 可移动壳体堆叠在固定壳体上,每个彼此间隔一定距离。 阻抗调节构件被布置并接收耦合部分。 柔性联接部分形成为具有S形的方式。 柔性联接部分包括第一弯曲部分,第二弯曲部分和线性联接部分。 第二弯曲部从与第一弯曲部弯曲的方向相反的方向弯曲,而线状耦合部连接第一弯曲部和第二弯曲部。
    • 80. 发明授权
    • RFID active/passive tag identifying failed sub-CRU and location within higher level CRU
    • RFID主动/被动标签识别失败的次CRU和更高级别CRU中的位置
    • US07627788B2
    • 2009-12-01
    • US11532398
    • 2006-09-15
    • John Charles ElliottRobert Akira KuboGregg Steven LucasAndrew Ellis Seidel
    • John Charles ElliottRobert Akira KuboGregg Steven LucasAndrew Ellis Seidel
    • G06F11/00
    • G06F11/0784G06F11/0724G06Q10/06
    • A radio frequency identifier (RFID) active/passive tag is provided to identify failed sub-CRU and location within a higher level CRU. When an error occurs on the base blade or within one of the sub-CRUs, the embedded processor writes failure information to the RFID. RFID tags may also contain data identifying the locations, of the sub-CRUs of the blade. Thus, when there is a failure, the RFID may report the failed component as well as the location of a failed sub-CRU. Sub-CRUs may also include an embedded processor and RFID tag. When a service action is initiated to repair or replace a blade, the RFID tag may be read by a RFID reader. The RFID reader device may then present failure information, including the identification of the failed sub-CRU and other associated information to the operator. The RFID reader device may also request associated information from a server computer.
    • 提供射频标识符(RFID)主动/被动标签以识别出较高级别CRU内的故障子CRU和位置。 当基本刀片或其中一个子CRU发生错误时,嵌入式处理器将故障信息写入RFID。 RFID标签还可以包含识别刀片的子CRU的位置的数据。 因此,当发生故障时,RFID可以报告故障组件以及故障子CRU的位置。 子CRU还可以包括嵌入式处理器和RFID标签。 当启动维修或更换刀片的服务动作时,RFID标签可被RFID读取器读取。 RFID读取器设备然后可以向操作者呈现故障信息,包括故障子CRU的标识和其他相关信息。 RFID读取器设备还可以从服务器计算机请求相关信息。