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    • 66. 发明授权
    • Multi-layered unit
    • 多层单位
    • US06930875B2
    • 2005-08-16
    • US10460763
    • 2003-06-12
    • Yukio Sakashita
    • Yukio Sakashita
    • H01G4/10H01L21/02H01L21/316H01G4/228
    • H01G4/10H01L21/02197H01L21/02293H01L21/31691H01L28/55H01L28/65
    • A multi-layered unit according to the present invention includes a support substrate formed of a material which has conductivity and on which a dielectric material containing a bismuth layer structured compound can be epitaxially grown, at least the surface thereof being oriented in the [001] direction, and a dielectric layer formed by epitaxially growing a dielectric material containing a bismuth layer structured compound on the support substrate and formed of a dielectric material containing a bismuth layer structured compound oriented in the [001] direction. Since the thus constituted multi-layered unit includes the dielectric layer containing a bismuth layer structured compound oriented in the c axis direction, in the case of, for example, providing an upper electrode on the dielectric layer to form a thin film capacitor and applying a voltage between the electrode layer and the upper electrode, the direction of the electric field substantially coincides with the c axis of the bismuth layer structured compound contained in the dielectric layer. As a result, since the ferroelectric property of the bismuth layer structured compound contained in the dielectric layer can be suppressed and the paraelectric property thereof can be fully exhibited, it is possible to fabricate a thin film capacitor having a small size, large capacitance and an excellent dielectric characteristic.
    • 根据本发明的多层单元包括由具有导电性的材料形成的支撑衬底,并且其上可以外延生长含有铋层结构化合物的电介质材料,至少其表面取向为[001] 方向,以及通过在支撑基板上外延生长含有铋层结构化合物的电介质材料形成的电介质层,并由包含沿[001]方向取向的铋层结构化合物的电介质材料形成。 由于如此构成的多层单元包括在c轴方向上包含铋层结构化合物的电介质层,例如在电介质层上设置上电极以形成薄膜电容器并施加 电极层与上部电极之间的电压,电场方向基本上与包含在电介质层中的铋层结构化合物的c轴重合。 结果,由于可以抑制包含在电介质层中的铋层结构化合物的铁电性能并且可以充分发挥其顺电特性,所以可以制造具有小尺寸,大电容的薄膜电容器和 优良的介电特性。
    • 70. 发明申请
    • Manufacture of solid state electornic components
    • 固态电极组件的制造
    • US20050000071A1
    • 2005-01-06
    • US10478839
    • 2002-05-24
    • David Huntington
    • David Huntington
    • H01G9/26H01C17/00H01G20060101H01G4/012H01G4/10H01G4/38H01G9/00H01G9/032H01G9/15H01G13/00
    • H01G9/0029H01G9/15H01G9/26Y10T29/417Y10T29/435Y10T29/49002
    • The present invention concerns the field of the manufacture of solid state components, and in preferred embodiments, capacitors. The method relates particularly to massed production methods for manufacturing solid state components, such as capacitors. According to one aspect of the present invention there is provided a method of manufacturing multiple solid state electronic components comprising: (i) providing a first substrate provided with a plurality of first solid state electronic component elements formed on a surface e thereof, (ii) providing a second substrate provided with a plurality of second sold state electronic component elements formed on a surface thereof, (iii) aligning the first and second substrates so that respective first and second component elements are each mutually aligned, (iv) fixing the first and second substrates together, so that the first and second elements are operatively connected one to another, thereby to form a substrate sandwich, (v) dividing the substrate sandwich to form a plurality of individual components, each comprising a first component element cooperatively connected to a second component element. Suitable types of component are capacitors, diodes and resistors, although this list is not exhaustive and other suitable components are available to be made using this method.
    • 本发明涉及固体组分的制造领域,并且在优选实施方案中涉及电容器。 该方法特别涉及用于制造诸如电容器的固态部件的批量生产方法。 根据本发明的一个方面,提供一种制造多个固态电子部件的方法,包括:(i)提供设置有形成在其表面e上的多个第一固态电子部件元件的第一基板,(ii) 提供设置有形成在其表面上的多个第二销售状态电子元件元件的第二基板,(iii)使第一和第二基板对齐,使得相应的第一和第二元件各自相互对齐,(iv)固定第一和第二基板 第二基板在一起,使得第一和第二元件可操作地彼此连接,从而形成基板夹层,(v)将基板夹层隔开以形成多个单独的部件,每个部件包括与第一部件元件协作地连接的第一部件元件 第二组成元素。 组件的合适类型是电容器,二极管和电阻器,尽管这个列表并不详尽,并且使用这种方法可以使用其他合适的组件。