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61. 发明授权

US09439289B2 Wiring board and method for manufacturing the same 有权
标题翻译：接线板及其制造方法
公开(公告)号：US09439289B2
公开(公告)日：2016-09-06
申请号：US13687016
申请日：2012-11-28
申请人： IBIDEN CO., LTD.
发明人： Toshiki Furutani , Yukinobu Mikado , Toyotaka Shimabe , Shinobu Kato
IPC分类号： H05K1/02 , H05K1/18 , H05K3/10 , H05K3/30 , H05K1/11 , H01L23/00 , H05K3/46
CPC分类号： H05K1/186 , H01L24/19 , H01L2224/04105 , H01L2224/32225 , H01L2224/73267 , H01L2224/92144 , H01L2924/15153 , H05K1/0296 , H05K1/111 , H05K1/116 , H05K1/185 , H05K3/10 , H05K3/30 , H05K3/306 , H05K3/4697 , H05K2201/10636 , Y02P70/611 , Y10T29/49146
摘要： A wiring board includes a substrate which has multiple opening portions and one or more boundary portions separating the opening portions, multiple electronic devices positioned in the opening portions of the substrate, respectively, a conductive pattern formed on a surface of the boundary portion, and an insulation layer formed on the substrate and the conductive pattern on the boundary portion of the substrate such that the insulation layer covers the electronic devices in the opening portions of the substrate.
摘要翻译：布线基板包括具有多个开口部分和分离开口部分的一个或多个边界部分的基板，分别位于基板的开口部分中的多个电子装置，形成在边界部分的表面上的导电图案，以及形成在基板上的绝缘层和基板的边界部分上的导电图案，使得绝缘层覆盖基板的开口部分中的电子器件。

62. 发明授权

US09426896B2 Insulating resin film, bonded structure using insulating resin film, and production method of bonded structure 有权
标题翻译：绝缘树脂膜，使用绝缘树脂膜的结合结构和粘结结构的制造方法
公开(公告)号：US09426896B2
公开(公告)日：2016-08-23
申请号：US14278810
申请日：2014-05-15
申请人： Dexerials Corporation
发明人： Daisuke Sato , Junichi Nishimura , Ryosuke Odaka
IPC分类号： H05K3/30 , C09J7/02 , C09J163/00 , H01L23/00 , C08K3/00
CPC分类号： H05K3/30 , C08K3/01 , C09J7/35 , C09J163/00 , C09J2201/134 , C09J2205/102 , C09J2463/00 , H01L24/29 , H01L24/32 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29366 , H01L2224/29386 , H01L2224/83101 , H01L2224/83194 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01033 , H01L2924/01045 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15788 , H05K3/305 , H05K2201/0195 , H05K2201/0209 , Y02P70/613 , Y10T428/28 , Y10T428/2848 , H01L2924/00 , H01L2924/05442 , H01L2924/00014 , H01L2924/05432 , H01L2924/05042 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： To provide an insulating resin film, which contains: a first adhesive layer; and a second adhesive layer, wherein the insulating resin film is configured to bond a substrate and an electronic part together, and the first adhesive layer is provided at a side of the substrate and the second adhesive layer is provided at a side of the electronic part, wherein the first adhesive layer and the second adhesive layer each contain inorganic filler, wherein the second adhesive layer has a DSC exothermic peak temperature that is higher than a DSC exothermic peak temperature of the first adhesive layer, and wherein a thickness of the first adhesive layer is 50% to 90% of a total thickness of the insulating resin film.
摘要翻译：提供绝缘树脂膜，其包含：第一粘合剂层; 和第二粘合剂层，其中所述绝缘树脂膜被构造成将基板和电子部件结合在一起，并且所述第一粘合层设置在所述基板的一侧，并且所述第二粘合层设置在所述电子部件的一侧其中，所述第一粘合剂层和所述第二粘合剂层各自含有无机填料，其中所述第二粘合剂层具有比所述第一粘合剂层的DSC放热峰值温度高的DSC放热峰值温度，并且其中所述第一粘合剂的厚度层是绝缘树脂膜的总厚度的50％至90％。

63. 发明授权

US09392730B2 Systems, structures and materials for electronic device cooling 有权
标题翻译：用于电子设备冷却的系统，结构和材料
公开(公告)号：US09392730B2
公开(公告)日：2016-07-12
申请号：US14055616
申请日：2013-10-16
申请人： Outlast Technologies LLC
发明人： Mark Hartmann , Greg Roda
IPC分类号： H05K7/20 , H05K3/30 , G06F1/20
CPC分类号： H05K1/0209 , G06F1/203 , H01L23/373 , H01L23/3737 , H01L23/42 , H01L23/427 , H01L2924/0002 , H05K1/0204 , H05K3/28 , H05K3/284 , H05K3/285 , H05K3/30 , H05K7/2039 , H05K7/20454 , Y10T29/49146 , H01L2924/00
摘要： An electronic device having one or more components that generate heat during operation includes a structure for temperature management and heat dissipation. The structure for temperature management and heat dissipation comprises a heat transfer substrate having a surface that is in thermal communication with the ambient environment and a temperature management material in physical contact with at least a portion of the one or more components of the electronic device and at least a portion of the heat transfer substrate. The temperature management material comprises a polymeric phase change material having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C., and a thermal conductive filler.
摘要翻译：具有在运行中产生热量的一个或多个部件的电子设备包括用于温度管理和散热的结构。用于温度管理和散热的结构包括具有与周围环境热连通的表面的传热基板和与电子设备的一个或多个部件的至少一部分物理接触的温度管理材料，至少一部分传热基板。温度管理材料包括具有至少5焦耳/克的潜热和0℃至100℃之间的转变温度和导热填料的聚合物相变材料。

64. 发明授权

US09391708B2 Multi-substrate electro-optical interconnection system 有权
标题翻译：多基板电光互连系统
公开(公告)号：US09391708B2
公开(公告)日：2016-07-12
申请号：US14714582
申请日：2015-05-18
申请人： STMICROELECTRONICS S.r.l.
发明人： Antonio Fincato , Salvatore Mario Rotolo , Enrico Stefano Temporiti Milani , Maurizio Zuffada
IPC分类号： H04B10/00 , H04B10/40 , H04B10/70 , H04B10/50 , H05K3/30 , H04B10/80
CPC分类号： H04B10/40 , H04B10/503 , H04B10/70 , H04B10/801 , H05K3/30 , Y10T29/49131
摘要： An intra-board chip-to-chip optical communications system has a high bit rate and high data throughput based on the use of a silicon photonic interposer. The system includes a multi-substrate electro-optical structure for communications with CMOS and/or BiCMOS IC chips of a PCB. The structure includes a multi-chip module primary substrate mounted over the supporting PCB. The multi-chip module primary substrate implements high frequency electrical interconnections between transceiver circuit chips, mounted on the silicon photonic interposer, and the IC chips.
摘要翻译：基于硅光子插入器的使用，板内芯片到芯片的光通信系统具有高比特率和高数据吞吐量。该系统包括用于与PCB的CMOS和/或BiCMOS IC芯片通信的多基板电光结构。该结构包括安装在支撑PCB上的多芯片模块主要基板。多芯片模块主要基板在安装在硅光子插入器上的收发器电路芯片和IC芯片之间实现高频电互连。

65. 发明申请

US20160195497A1 Multi-Layer Eddy Current Probe, Method for Producing a Multi-Layer Eddy Current Probe, and Test Unit Comprising a Multi-Layer Eddy Current Probe 审中-公开
标题翻译：多层涡流探头，多层涡流探头的制造方法以及包含多层涡流探头的测试单元
公开(公告)号：US20160195497A1
公开(公告)日：2016-07-07
申请号：US14911945
申请日：2014-08-01
申请人： MAGNETISCHE PRÜFANLAGEN GMBH
发明人： Timur KUDYAKOV
IPC分类号： G01N27/90 , G01R3/00 , H05K3/30 , H05K1/16 , H05K3/40
CPC分类号： G01N27/9033 , G01R3/00 , H01F1/00 , H01L21/00 , H01L2221/00 , H05K1/165 , H05K3/30 , H05K3/4038 , H05K2201/09672
摘要： A multi-layer eddy current probe has a large number of flat spiral coils which are arranged in different coil layers of a multi-layer arrangement, wherein a respective insulating layer which is composed of electrically insulating material is arranged between adjacent coil layers of the multi-layer arrangement. Each of the flat coils has an inner terminal and an outer terminal. Selected terminals of selected flat coils of different coil layers are electrically connected to one another by way of vias. The flat coils form at least one coil group which has at least three flat coils which are arranged one above the other in different layers, wherein the inner terminals of the at least three flat coils of the coil group are electrically conductively connected by means of a common inner via.
摘要翻译：多层涡流探针具有大量扁平螺旋线圈，其布置在多层布置的不同线圈层中，其中由电绝缘材料构成的相应绝缘层布置在多层布线的相邻线圈层之间层次排列。每个扁平线圈具有内部端子和外部端子。所选择的不同线圈层的扁平线圈的端子通过通孔彼此电连接。扁平线圈形成至少一个具有至少三个扁平线圈的线圈组，所述至少三个扁平线圈在不同的层中彼此上下布置，其中线圈组的至少三个扁平线圈的内部端子通过共同内部通路。

66. 发明申请

US20160174388A1 PRINTED CIRCUIT BOARD SECURITY USING EMBEDDED PHOTODETECTOR CIRCUIT 审中-公开
公开(公告)号：US20160174388A1
公开(公告)日：2016-06-16
申请号：US14570150
申请日：2014-12-15
申请人： International Business Machines Corporation
发明人： Gerald K. Bartley , Darryl J. Becker , Matthew S. Doyle , Mark O. Maxson
IPC分类号： H05K3/30
CPC分类号： H03K19/17768 , H05K1/0275 , H05K3/30 , H05K2201/10151
摘要： Systems and methods to obstruct analysis of a microchip may include an electrical component of a microchip and a photodetector positioned within the microchip. The photodetector may be configured to sense electromagnetic radiation. Circuitry in electrical communication with the photodetector may be configured to initiate an action to obstruct analysis of the electrical component in response to a change in a level of the electromagnetic radiation.

67. 发明申请

US20160174387A1 Method for fabrication of an electronic module and electronic module 有权
标题翻译：电子模块和电子模块的制造方法
公开(公告)号：US20160174387A1
公开(公告)日：2016-06-16
申请号：US14569900
申请日：2014-12-15
申请人： GE Embedded Eletronics Oy
发明人： Risto Tuominen
IPC分类号： H05K3/30 , H05K3/46 , H05K3/42 , H05K1/18 , H05K1/11 , H05K1/02
CPC分类号： H05K3/30 , H01L21/486 , H01L23/5384 , H01L23/5389 , H01L24/00 , H01L24/24 , H01L24/82 , H01L25/065 , H01L2224/32225 , H01L2224/83005 , H01L2224/83192 , H01L2224/92144 , H01L2924/12041 , H01L2924/1433 , H01L2924/1434 , H01L2924/1461 , H01L2924/19105 , H05K1/0298 , H05K1/115 , H05K1/185 , H05K3/429 , H05K3/4644 , H05K3/4697 , H05K2201/10522 , H05K2201/10674 , H05K2203/0588 , H05K2203/1469
摘要： The present invention concerns an electronic module with at least one component embedded in insulating material. The electronic module comprises a first insulating material having a first surface and a second surface and a thickness between the first surface and the second surface, at least one opening through the first insulating material, a second insulating material on the second surface of the first insulating material, at least one component embedded in the second insulating material, at least one conductive pattern in the at least one opening, the at least one conductive pattern having a first surface and a second surface, wherein the second surface faces the second insulating material and the first surface faces away from the second insulating material and a distance between the first surface of the first insulating material and the second surface of the at least one conductive pattern is less or greater than the thickness of the first insulating material, an adhesive between the first insulating material and the at least one component, and connection elements between the at least one conductive pattern and the at least one component. The present invention further concerns a method for fabrication of an electronic module with at least one component embedded in an insulating layer.
摘要翻译：本发明涉及一种具有嵌入绝缘材料中的至少一个部件的电子模块。电子模块包括具有第一表面和第二表面以及在第一表面和第二表面之间的厚度的第一绝缘材料，穿过第一绝缘材料的至少一个开口，在第一绝缘材料的第二表面上的第二绝缘材料材料，嵌入在第二绝缘材料中的至少一个部件，至少一个开口中的至少一个导电图案，所述至少一个导电图案具有第一表面和第二表面，其中第二表面面向第二绝缘材料，所述第一表面背离所述第二绝缘材料，并且所述第一绝缘材料的所述第一表面与所述至少一个导电图案的所述第二表面之间的距离小于或大于所述第一绝缘材料的厚度，第一绝缘材料和至少一个部件，以及在所述至少一个cond之间的连接元件舞蹈模式和至少一个组件。本发明还涉及一种用于制造具有嵌入在绝缘层中的至少一个部件的电子模块的方法。

68. 发明申请

US20160172259A1 CUSTOMIZED MODULE LID 有权
公开(公告)号：US20160172259A1
公开(公告)日：2016-06-16
申请号：US14535391
申请日：2014-11-07
申请人： International Business Machines Corporation
发明人： Amilcar R. Arvelo , Michael J. Ellsworth , Eric J. McKeever , Thong N. Nguyen , Edward J. Seminaro
IPC分类号： H01L23/043 , H01L23/367 , H01L23/06
CPC分类号： H01L23/043 , H01L21/4817 , H01L23/04 , H01L23/06 , H01L23/3675 , H01L23/42 , H01L2924/0002 , H05K3/30 , H01L2924/00
摘要： A method of forming a custom module lid. The method may include placing a multichip module (MCM) between a module base and a temporary lid, target components are exposed through viewing windows in the temporary lid, a top surface of the target components is measured and mapped to create a target profile, the target profile is used to form custom pockets in a custom lid, and the custom pockets correspond to the target components.

69. 发明申请

US20160154422A1 MOTHERBOARD WITH A HOLE 有权
标题翻译：带孔的母板
公开(公告)号：US20160154422A1
公开(公告)日：2016-06-02
申请号：US14907117
申请日：2013-07-22
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人： John Norton
IPC分类号： G06F1/16 , H05K3/30
CPC分类号： G06F1/16 , H05K1/18 , H05K3/103 , H05K3/30 , H05K3/4046 , H05K2201/09063 , H05K2201/10287 , H05K2201/10719 , H05K2201/10962
摘要： A printed circuit board (PCB) can include a central processing unit (CPU) installed on a first surface of the PCB. The PCB can also include a cable routed on a second surface of the PCB parallel to the first surface. The PCB can further include a hole extending through a thickness of the PCB to connect the first surface and the second surface. The cable can extend through the hole to be coupled to the CPU.
摘要翻译：印刷电路板（PCB）可以包括安装在PCB的第一表面上的中央处理单元（CPU）。 PCB还可以包括在PCB的平行于第一表面的第二表面上布线的电缆。 PCB还可以包括延伸穿过PCB的厚度的孔，以连接第一表面和第二表面。电缆可以延伸穿过要耦合到CPU的孔。

70. 发明授权

US09320183B1 Ground lid opening on a substrate 有权
标题翻译：基底上的接地盖开口
公开(公告)号：US09320183B1
公开(公告)日：2016-04-19
申请号：US14052708
申请日：2013-10-12
申请人： Cisco Technology, Inc.
发明人： Mohan R. Nagar
IPC分类号： H05K9/00 , H01J5/00 , H01J15/00 , H05K5/06 , H01L27/148 , H01L23/552 , B21D39/00 , G06F1/18 , H01R13/648 , H05K3/30 , G03B15/03 , H01R13/516
CPC分类号： H05K9/0007 , G03B15/03 , G06F1/181 , G06F1/182 , G06F1/20 , G06F1/203 , H01L23/10 , H01L23/552 , H01L2224/0401 , H01L2224/16227 , H01L2224/73253 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/16251 , H01L2924/163 , H01L2924/3025 , H01R13/516 , H01R13/648 , H05K1/0243 , H05K3/30 , H05K3/305 , H05K3/321 , H05K9/00 , H05K9/0009 , H05K9/0028 , H05K2201/10371 , H05K2201/10734
摘要： An apparatus for grounding a chip may be provided. The apparatus may comprise a ground lid, a ground trace, a first substance, and a second substance. The first substance may be configured adhere the ground lid to the ground trace. The second substance may be configured to provide electrical conduction between the ground lid and the ground trace.
摘要翻译：可以提供用于接地芯片的装置。该设备可包括接地盖，接地痕迹，第一物质和第二物质。第一种物质可以被配置为将地盖粘附到地面迹线上。第二物质可以被配置为在接地盖和接地迹线之间提供电传导。

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