专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

61. 发明授权

US08590144B2 Method of manufacturing printed circuit board 失效
标题翻译：制造印刷电路板的方法
公开(公告)号：US08590144B2
公开(公告)日：2013-11-26
申请号：US12919914
申请日：2009-03-02
申请人： Hye Sun Yoon , Jae Bong Choi , Eun Jung Lee , Jung Ho Hwang , Joon Wook Han
发明人： Hye Sun Yoon , Jae Bong Choi , Eun Jung Lee , Jung Ho Hwang , Joon Wook Han
IPC分类号： H05K1/03 , H05K3/00
CPC分类号： H05K3/0097 , H05K1/036 , H05K1/0366 , H05K3/0052 , H05K3/06 , H05K3/107 , H05K3/244 , H05K3/3452 , H05K2201/0209 , H05K2201/0355 , H05K2201/068 , H05K2203/0278 , H05K2203/0315 , H05K2203/1536
摘要： Provided is a method of manufacturing a printed circuit board including, disposing first and second insulating members and first and second conductive films on both sides of a separating member to perform a thermocompression bonding process on the first and second insulating members and the first and second conductive films on the both sides of the separating member, so as to attach the first member to the second member with the separating member therebetween and attach the first insulating member to the first conductive film and attach the second insulating member to the second conductive film, selectively removing the first and second conductive films to form first and second circuit patterns, and cutting the separating member and the first and second insulating members to separate the first and second insulating members with the first and second circuit patterns from the separating member.
摘要翻译：提供一种制造印刷电路板的方法，包括：在分离部件的两侧设置第一绝缘部件和第二绝缘部件以及第一导电膜和第二导电膜，对第一绝缘部件和第二绝缘部件进行热压接，在所述分离构件的两侧上形成膜，以将所述第一构件与所述分隔构件连接在所述第二构件上，并将所述第一绝缘构件附接到所述第一导电膜，并且将所述第二绝缘构件附接到所述第二导电膜，去除第一和第二导电膜以形成第一和第二电路图案，以及切割分离构件和第一和第二绝缘构件，以使第一和第二绝缘构件与第一和第二电路图案与分离构件分离。

62. 发明授权

US08562727B2 Electroless palladium plating solution 有权
标题翻译：无电镀钯溶液
公开(公告)号：US08562727B2
公开(公告)日：2013-10-22
申请号：US13319194
申请日：2010-05-07
申请人： Hideto Watanabe , Kazuhiro Kojima , Kaoru Yagi
发明人： Hideto Watanabe , Kazuhiro Kojima , Kaoru Yagi
IPC分类号： C23C18/44
CPC分类号： C23C18/44 , H01L2224/85464 , H05K3/244
摘要： Disclosed is an electroless palladium plating solution which can form a plating layer having excellent soldering properties onto electronic components and the like and excellent wire bonding properties. The electroless palladium plating solution comprises a palladium compound, an amine compound, an inorganic sulfur compound and a reducing agent, wherein a combination of hypophosphorous acid or a hypophosphorous acid compound and formic acid or a formic acid compound is used as the reducing agent, and wherein the palladium compound, the amine compound, the inorganic sulfur compound, the hypophosphorous acid compound, and formic acid or the formic acid compound are contained in amounts of 0.001 to 0.1 mole/l, 0.05 to 5 mole/l, 0.01 to 0.1 mole/l, 0.05 to 1.0 mole/l and 0.001 to 0.1 mole/l, respectively. The electroless palladium plating solution is characterized by having excellent soldering properties and excellent wire bonding properties.
摘要翻译：公开了一种化学镀钯溶液，其可以形成对电子部件等具有优异的焊接性质的镀层，并且具有优异的引线接合性能。化学镀钯溶液包括钯化合物，胺化合物，无机硫化合物和还原剂，其中使用次磷酸或次磷酸化合物与甲酸或甲酸化合物的组合作为还原剂，以及其中钯化合物，胺化合物，无机硫化合物，次磷酸化合物，甲酸或甲酸化合物的含量为0.001至0.1摩尔/升0.05至5摩尔/升0.01至0.1摩尔分别为0.05〜1.0摩尔/升和0.001〜0.1摩尔/升。无电镀钯溶液的特征在于具有优异的焊接性能和优良的引线接合性能。

63. 发明授权

US08528200B2 Printed wiring board and method for manufacturing printed wiring board 有权
标题翻译：印刷电路板及制造印刷线路板的方法
公开(公告)号：US08528200B2
公开(公告)日：2013-09-10
申请号：US12915582
申请日：2010-10-29
申请人： Masaru Takada , Fusaji Nagaya , Takao Okada , Tomohiko Murata
发明人： Masaru Takada , Fusaji Nagaya , Takao Okada , Tomohiko Murata
IPC分类号： H05K3/02
CPC分类号： H05K1/111 , H01L21/4846 , H01L21/486 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/49894 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/0657 , H01L2224/13099 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2224/81192 , H01L2224/81385 , H01L2224/85411 , H01L2224/85444 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H05K3/244 , H05K3/28 , H05K3/3452 , H05K2201/09481 , H05K2201/09881 , H05K2201/10674 , H05K2203/049 , Y10T29/49155 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for manufacturing a printed wiring board includes forming a pad for mounting an electronic component on a resin layer, forming a solder-resist layer on the resin layer and the pad, exposing an upper surface of the pad and a portion of a side wall of the pad from the solder-resist layer, and forming a metal layer on the upper surface of the pad and the portion of the side wall of the pad.
摘要翻译：一种印刷电路板的制造方法，其特征在于，在树脂层上形成用于安装电子部件的焊盘，在树脂层和焊盘上形成阻焊层，露出焊盘的上表面和侧壁的一部分的焊盘，并且在焊盘的上表面和焊盘的侧壁的部分上形成金属层。

64. 发明申请

US20130163142A1 SURFACE MOUNT COMPONENT HAVING MAGNETIC LAYER THEREON AND METHOD OF FORMING SAME 审中-公开
标题翻译：具有磁性层的表面安装部件及其形成方法
公开(公告)号：US20130163142A1
公开(公告)日：2013-06-27
申请号：US13771022
申请日：2013-02-19
申请人： Haixiao Sun
发明人： Haixiao Sun
IPC分类号： H01G13/00 , H01G2/02
CPC分类号： H01G13/00 , H01G2/02 , H01L2924/0002 , H05K3/244 , H05K3/303 , H05K3/3442 , H05K2201/083 , H05K2201/10909 , H05K2203/043 , Y02P70/613 , Y10T428/24826 , H01L2924/00
摘要： A microelectronic assembly, a surface mount component and a method of providing the surface mount component. The assembly comprises: a substrate having bonding pads disposed on a mounting surface thereof, the bonding pads including a ferromagnetic material therein; solidified solder disposed on the bonding pads; and a surface mount component bonded to the substrate by way of the solidified solder and including a magnetic layer disposed on a substrate side thereof, the magnetic layer being adapted to cooperate with the ferromagnetic material in the bonding pads to establish a magnetic force of a sufficient magnitude to hold the surface mount component on the substrate before and during soldering.
摘要翻译：微电子组件，表面安装部件和提供表面安装部件的方法。组件包括：具有设置在其安装表面上的接合焊盘的衬底，所述接合焊盘在其中包括铁磁材料; 设置在接合焊盘上的固化焊料; 以及表面安装部件，其通过固化的焊料结合到基板，并且包括设置在其基板侧上的磁性层，所述磁性层适于与焊盘中的铁磁材料配合以建立足够的磁力在焊接之前和期间将表面安装部件保持在基板上。

65. 发明授权

US08421232B2 Semiconductor device and automotive ac generator 有权
标题翻译：半导体装置和汽车交流发电机
公开(公告)号：US08421232B2
公开(公告)日：2013-04-16
申请号：US13117544
申请日：2011-05-27
申请人： Osamu Ikeda , Masato Nakamura , Satoshi Matsuyoshi , Koji Sasaki , Shinji Hiramitsu
发明人： Osamu Ikeda , Masato Nakamura , Satoshi Matsuyoshi , Koji Sasaki , Shinji Hiramitsu
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H05K3/3463 , B23K35/262 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/16 , H01L2224/29101 , H01L2224/29111 , H01L2224/29144 , H01L2224/29211 , H01L2224/29311 , H01L2224/32225 , H01L2224/32245 , H01L2224/32507 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/13055 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , H05K3/244 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/01016 , H01L2924/01028 , H01L2924/01032 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A semiconductor device includes a semiconductor element, a support member bonded to a first surface of the semiconductor element with a first bonding material and a lead electrode bonded to a second surface of the semiconductor element supported on the support member with a second bonding material, and further including a method of producing the semiconductor device. Respective connecting parts of the support member and the lead electrode are Ni-plated and each of the first and the second bonding material is a Sn solder having a Cu6Sn5 content greater than a eutectic content.
摘要翻译：半导体器件包括半导体元件，利用第一接合材料接合到半导体元件的第一表面的支撑构件和利用第二接合材料接合到支撑在支撑构件上的半导体元件的第二表面的引线电极，以及还包括制造半导体器件的方法。支撑构件和引线电极的各个连接部分是镀镍的，并且第一和第二接合材料中的每一个是Cu 6 Sn 5含量大于共晶含量的Sn焊料。

66. 发明申请

US20130078808A1 ELECTROLESS DEPOSITION SOLUTIONS AND PROCESS CONTROL 审中-公开
标题翻译：电沉积解决方案和工艺控制
公开(公告)号：US20130078808A1
公开(公告)日：2013-03-28
申请号：US13681332
申请日：2012-11-19
申请人： Artur Kolics
发明人： Artur Kolics
IPC分类号： H01L21/02 , C09D5/24
CPC分类号： H01L21/02697 , C09D5/24 , C23C18/1601 , C23C18/1617 , C23C18/34 , C23C18/50 , H01L21/288 , H01L21/76849 , H05K3/244
摘要： One embodiment of the present invention is a method of electroless deposition of cap layers for fabricating an integrated circuit. The method includes controlling the composition of an electroless deposition bath so as to substantially maintain the electroless deposition properties of the bath. Other embodiments of the present invention include electroless deposition solutions. Still another embodiment of the present invention is a composition used to recondition an electroless deposition bath.
摘要翻译：本发明的一个实施例是用于制造集成电路的盖层的无电沉积方法。该方法包括控制无电沉积浴的组成，以便基本保持浴的无电沉积性能。本发明的其它实施方案包括无电沉积溶液。本发明的另一个实施方案是用于重新形成无电沉积浴的组合物。

67. 发明申请

US20130057451A1 TRANSMISSION LINE FOR HIGH PERFORMANCE RADIO FREQUENCY APPLICATIONS 有权
标题翻译：用于高性能无线电频率应用的传输线
公开(公告)号：US20130057451A1
公开(公告)日：2013-03-07
申请号：US13464775
申请日：2012-05-04
申请人： Sandra Louise Petty-Weeks , Guohao Zhang , Hardik Bhupendra Modi
发明人： Sandra Louise Petty-Weeks , Guohao Zhang , Hardik Bhupendra Modi
IPC分类号： H01P3/08 , H01Q1/50
CPC分类号： H01L24/85 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2223/6611 , H01L2223/6655 , H01L2223/6677 , H01L2224/32225 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48159 , H01L2224/48227 , H01L2224/48465 , H01L2224/48644 , H01L2224/48844 , H01L2224/73265 , H01L2224/85444 , H01L2924/00011 , H01L2924/00012 , H01L2924/01015 , H01L2924/01047 , H01L2924/10329 , H01L2924/12042 , H01L2924/1305 , H01L2924/13051 , H01L2924/1421 , H01L2924/1423 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/3011 , H05K1/0243 , H05K3/244 , H05K2201/0341 , H01L2924/00014 , H01L2924/00
摘要： This disclosure relates to a transmission line for high performance radio frequency (RF) applications. One such transmission line can include a bonding layer configured to receive an RF signal, a barrier layer, a diffusion barrier layer, and a conductive layer proximate to the diffusion barrier layer. The diffusion barrier layer can have a thickness that allows a received RF signal to penetrate the diffusion barrier layer to the conductive layer. In certain implementations, the diffusion barrier layer can be nickel. In some of these implementations, the transmission line can include a gold bonding layer, a palladium barrier layer, and a nickel diffusion barrier layer.
摘要翻译：本公开涉及用于高性能射频（RF）应用的传输线。一个这样的传输线可以包括被配置为接收RF信号的结合层，阻挡层，扩散阻挡层和靠近扩散阻挡层的导电层。扩散阻挡层可以具有允许接收的RF信号穿透到导电层的扩散阻挡层的厚度。在某些实施方案中，扩散阻挡层可以是镍。在这些实施方案中，传输线可以包括金结合层，钯阻挡层和镍扩散阻挡层。

68. 发明申请

US20130056876A1 COMPOSITE ELECTRODE AND METHOD OF MANUFACTURE THEREOF 有权
标题翻译：复合电极及其制造方法
公开(公告)号：US20130056876A1
公开(公告)日：2013-03-07
申请号：US13696644
申请日：2011-05-09
申请人： Thomas Harvey , Timothy George Ryan
发明人： Thomas Harvey , Timothy George Ryan
IPC分类号： H01L21/283 , H01L29/41
CPC分类号： H05K3/244 , H01L51/0023 , H01L51/003 , H01L51/0097 , H01L51/5212 , H01L2251/5338 , H01L2251/5361 , H05K2201/0108 , Y02E10/549 , Y02P70/521
摘要： The present invention provides a composite electrode and method of manufacturing such a composite electrode, the method comprising the steps of: providing a first substrate layer with an electrically conducting surface; providing a non-conducting curable material; providing a second substrate layer which has a surface relief pattern defining at least one retaining feature corresponding to a desired metal track pattern; forming a line of contact between the conducting carrier layer and at least a part of the surface relief pattern; depositing curable material onto at least part of the surface relief pattern or the electrically conducting surface along the line of contact; advancing the line of contact and curing the curable material through the second substrate layer; releasing the cured material from the surface relief pattern feature so as to leave behind a surface relief pattern on the conducting carrier layer; depositing a first metal layer onto the exposed regions of the electrically conducting surface of the conducting carrier layer and optionally deposition further metal layers on the first metal layer.
摘要翻译：本发明提供一种复合电极及其制造方法，该方法包括以下步骤：提供具有导电表面的第一基底层; 提供不导电的可固化材料; 提供具有限定对应于期望的金属轨道图案的至少一个保持特征的表面浮雕图案的第二基底层; 在所述导电载体层和所述表面浮雕图案的至少一部分之间形成接触线; 将可固化材料沿着所述接触线沉积到所述表面浮雕图案或所述导电表面的至少一部分上; 推进接触线并固化可固化材料通过第二基底层; 从表面浮雕图案特征释放固化材料，以便在导电载体层上留下表面浮雕图案; 将第一金属层沉积到导电载体层的导电表面的暴露区域上，以及任选地在第一金属层上沉积另外的金属层。

69. 发明授权

US08378228B2 Surface mount component having magnetic layer thereon and method of forming same 有权
标题翻译：具有磁性层的表面安装部件及其形成方法
公开(公告)号：US08378228B2
公开(公告)日：2013-02-19
申请号：US12839091
申请日：2010-07-19
申请人： Haixiao Sun
发明人： Haixiao Sun
IPC分类号： H05K1/11
CPC分类号： H01G13/00 , H01G2/02 , H01L2924/0002 , H05K3/244 , H05K3/303 , H05K3/3442 , H05K2201/083 , H05K2201/10909 , H05K2203/043 , Y02P70/613 , Y10T428/24826 , H01L2924/00
摘要： A microelectronic assembly, a surface mount component and a method of providing the surface mount component. The assembly comprises: a substrate having bonding pads disposed on a mounting surface thereof, the bonding pads including a ferromagnetic material therein; solidified solder disposed on the bonding pads; and a surface mount component bonded to the substrate by way of the solidified solder and including a magnetic layer disposed on a substrate side thereof, the magnetic layer being adapted to cooperate with the ferromagnetic material in the bonding pads to establish a magnetic force of a sufficient magnitude to hold the surface mount component on the substrate before and during soldering.
摘要翻译：微电子组件，表面安装部件和提供表面安装部件的方法。组件包括：具有设置在其安装表面上的接合焊盘的衬底，所述接合焊盘在其中包括铁磁材料; 设置在接合焊盘上的固化焊料; 以及表面安装部件，其通过固化的焊料结合到基板，并且包括设置在其基板侧上的磁性层，所述磁性层适于与焊盘中的铁磁材料配合以建立足够的磁力在焊接之前和期间将表面安装部件保持在基板上。

70. 发明授权

US08342384B2 Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate 有权
公开(公告)号：US08342384B2
公开(公告)日：2013-01-01
申请号：US13441353
申请日：2012-04-06
申请人： Jürgen Schulz-Harder
发明人： Jürgen Schulz-Harder
IPC分类号： B23K20/12
CPC分类号： H05K3/061 , B32B2311/12 , C04B37/021 , C04B37/026 , C04B2237/127 , C04B2237/366 , C04B2237/407 , H05K1/0266 , H05K1/0306 , H05K3/244 , H05K3/3452 , H05K3/38 , H05K3/383 , H05K2201/0355 , H05K2201/09909 , H05K2201/09936 , H05K2203/0369 , H05K2203/0571 , H05K2203/0588 , Y10T29/49156
摘要： The invention relates to a novel process for producing a metal ceramic substrate, especially a copper-ceramic substrate, in which at least one metal foil at a time is applied to the surface sides of a ceramic layer or a ceramic substrate using a high temperature bonding process and the metal foil is structured on at least one surface side for forming conductive tracks, contact surfaces, and the like.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式