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61. 发明申请

US20050241690A1 Thermoelectric Module 审中-公开
标题翻译：热电模块
公开(公告)号：US20050241690A1
公开(公告)日：2005-11-03
申请号：US11150707
申请日：2005-06-09
申请人： Kenichi Tajima , Koichi Tanaka
发明人： Kenichi Tajima , Koichi Tanaka
IPC分类号： H01L35/00 , H01L35/04 , H01L35/08 , H01L35/10 , H01L35/28 , H01L35/34 , H01L37/00
CPC分类号： H01L35/08 , H01L35/10
摘要： A thermoelectric module 11 includes support substrates 1a and 1b, the same numbers of N-type thermoelectric elements 2a and P-type thermoelectric elements 2b disposed on the support substrates 1a and 1b, wiring conductors 3a and 3b that electrically connect between the thermoelectric elements in series and an external connection terminal 4 electrically connected to the wiring conductor 3a. The N-type thermoelectric elements 2a and the P-type thermoelectric elements 2b have different values of resistivity.
摘要翻译：热电模块11包括支撑基板1a和1b，设置在支撑基板1a和1b上的相同数量的N型热电元件2a和P型热电元件2b，布线导体3a和3b 串联的热电元件与电连接到布线导体3a的外部连接端子4电连接。 N型热电元件2a和P型热电元件2b具有不同的电阻率值。

62. 发明授权

US06712258B2 Integrated quantum cold point coolers 失效
标题翻译：集成量子冷点冷却器
公开(公告)号：US06712258B2
公开(公告)日：2004-03-30
申请号：US10015237
申请日：2001-12-13
申请人： Uttam Shyamalindu Ghoshal
发明人： Uttam Shyamalindu Ghoshal
IPC分类号： B23K100
CPC分类号： H01L35/34 , H01L35/10 , H01L35/16 , H01L35/30
摘要： A method for forming a thermoelement for a thermoelectric cooler is provided. In one embodiment a first substrate having a plurality of pointed tips separated by valleys wherein the substrate is covered by a metallic layer, portions of the metallic layer is covered by an insulator, and other portions of the metallic layer are exposed is formed. The other portions of the metallic layer that are exposed are covered with a thermoelectric material overcoat. A second substrate of thermoelectric material is then fused to the pointed tip side of the first substrate by, for example, heating the back of the first substrate to melt the thermoelectric material overcoat or by passing current through the pointed tips to induce Joule heating and thereby melt the thermoelectric material overcoat.
摘要翻译：提供一种用于形成热电冷却器的热电偶的方法。在一个实施例中，具有由谷分开的多个尖端的第一衬底，其中衬底被金属层覆盖，金属层的部分被绝缘体覆盖，并且形成金属层的其它部分被暴露。暴露的金属层的其它部分被热电材料外涂层覆盖。然后，通过例如加热第一基板的背面以熔化热电材料外涂层或通过使电流通过尖端来引起焦耳加热，从而将热电材料的第二基板熔合到第一基板的尖端侧，从而熔化热电材料外涂层。

63. 发明授权

US4268710A Hot-junction electrode members for copper/silver chalocogenides 失效
标题翻译：铜/银致胞菌素的热接电极构件
公开(公告)号：US4268710A
公开(公告)日：1981-05-19
申请号：US70892
申请日：1979-08-29
申请人： Edward F. Hampl, Jr.
发明人： Edward F. Hampl, Jr.
IPC分类号： H01L35/10 , H01L35/16 , H01J35/30
CPC分类号： H01L35/16 , H01L35/10
摘要： Tungsten, molybdenum, and alloys thereof are useful as electrode members for thermoelectric legs made from chalcogenides of copper and/or silver.
摘要翻译：钨，钼及其合金可用作由铜和/或银的硫族化物制成的热电腿的电极构件。

64. 发明授权

US3528893A Vacuum depositing and electrodepositing method of forming a thermoelectric module 失效
标题翻译：形成热电模块的真空沉积和电沉积方法
公开(公告)号：US3528893A
公开(公告)日：1970-09-15
申请号：US3528893D
申请日：1967-11-17
申请人： ATOMIC ENERGY AUTHORITY UK
发明人： CHRISTIE IAN ROBERT ARTHUR , CASE DEREK FRANK
IPC分类号： H01L35/10 , C23B5/50 , C23B5/64
CPC分类号： H01L35/10

65. 发明授权

US3097425A Method of soldering copper connection 失效
公开(公告)号：US3097425A
公开(公告)日：1963-07-16
申请号：US3097425D
IPC分类号： H01L35/10
CPC分类号： H01L35/10 , Y10T29/49169

66. 发明授权

US2864878A Thermocouple cable suspension 失效
标题翻译：热电偶电缆悬挂
公开(公告)号：US2864878A
公开(公告)日：1958-12-16
申请号：US44271554
申请日：1954-07-12
申请人： MARK W GEHAN
发明人： DALGLISH HERBERT F
IPC分类号： G01K13/10 , H01L35/10
CPC分类号： G01K13/10 , H01L35/10

67. 发明申请

US20180090658A1 THERMOELECTRIC CONVERSION DEVICE 审中-公开
公开(公告)号：US20180090658A1
公开(公告)日：2018-03-29
申请号：US15448475
申请日：2017-03-02
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Yusuke KASAHARA , Miwa SATO , Yasuo AKATSUKA , Masamichi SUZUKI , Tomoaki INOKUCHI
IPC分类号： H01L35/32 , H01L35/34 , H01L35/10
CPC分类号： H01L35/325 , H01L35/10 , H01L35/34
摘要： According to one embodiment, a thermoelectric conversion device includes a first stacked body comprising a plurality of first semiconductor layers of a first conductivity type, the first semiconductor layers spaced from each other in a first direction, a second stacked body comprising a plurality of second semiconductor layers of a second conductivity type, the second semiconductor layers spaced from each other in the first direction, and a first connection portion electrically connecting the first stacked body to the second stacked body, wherein the first stacked body has a plurality of first openings that extend inwardly of the first stacked body in the first direction, wherein a direction from the first stacked body to the second stacked body intersects the first direction, and wherein the second stacked body has a plurality of second openings extending inwardly of the second stacked body in the first direction.

68. 发明申请

US20170365764A1 THERMOELECTRIC CONVERTER 审中-公开
公开(公告)号：US20170365764A1
公开(公告)日：2017-12-21
申请号：US15497370
申请日：2017-04-26
申请人： Panasonic Intellectual Property Management Co., Ltd.
发明人： TAKAFUMI SHINGAI , TETSUYA NISHIO
IPC分类号： H01L35/32 , H01L35/10 , H01L27/16
CPC分类号： H01L35/32 , H01L27/16 , H01L35/10
摘要： A thermoelectric converter includes a first substrate that is deformable, a second substrate that is deformable, a plurality of thermoelectric conversion elements, and a group of electrodes. The plurality of thermoelectric conversion elements are disposed between the first substrate and the second substrate. The group of electrodes electrically interconnect the plurality of thermoelectric conversion elements. The plurality of thermoelectric conversion elements are arranged in a plurality of rows. The group of electrodes include a bridge electrode disposed across a first row and a second row among the plurality of rows. The first row is adjacent to the second row. The bridge electrode has a first part whose thickness is smaller than a thickness of each of remaining electrodes other than the bridge electrode among the group of electrodes and whose surface area is larger than a surface area of each of the remaining electrodes.

69. 发明授权

US09837594B2 Thermoelectric module, method for producing a thermoelectric module and use of a metallic glass or a sintered material 有权
公开(公告)号：US09837594B2
公开(公告)日：2017-12-05
申请号：US14233983
申请日：2012-07-20
申请人： Hans-Heinrich Angermann
发明人： Hans-Heinrich Angermann
IPC分类号： H01L35/32 , H01L35/10 , C22C1/00 , C22C45/10 , B22F7/08 , H01L35/34
CPC分类号： H01L35/32 , B22F7/08 , C22C1/002 , C22C45/10 , H01L35/10 , H01L35/34
摘要： The invention relates to a thermoelectric module, having an electric insulation, an electric conductor path, one surface of the electric conductor path being attached to a surface of the electrical insulation, and a thermoelectric material, one surface of the thermoelectric material being attached to another surface of the conductor path.

70. 发明申请

US20170287977A1 POWER HARVESTING FOR INTEGRATED CIRCUITS 审中-公开
公开(公告)号：US20170287977A1
公开(公告)日：2017-10-05
申请号：US15479140
申请日：2017-04-04
申请人： Synopsys, Inc.
发明人： Victor Moroz , Jamil Kawa
IPC分类号： H01L27/16 , H01L35/32 , H01L35/34 , H01L35/10
CPC分类号： H01L27/16 , H01L35/10 , H01L35/32 , H01L35/34
摘要： Integrated circuit devices which include a thermoelectric generator which recycles heat generated by operation of an integrated circuit, into electrical energy that is then used to help support the power requirements of that integrated circuit. Roughly described, the device includes an integrated circuit die having an integrated circuit thereon, the integrated circuit having power supply terminals for connection to a primary power source, and a thermoelectric generator structure disposed in sufficient thermal communication with the integrated circuit die so as to derive, from heat generated by the die, a voltage difference across first and second terminals of the thermoelectric generator structure. A powering structure is arranged to help power the integrated circuit, from the voltage difference across the first and second terminals of the thermoelectric generator. The thermoelectric generator can include IC packaging material that is made from thermoelectric semiconductor materials.

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