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    • 61. 发明授权
    • Semiconductor integrated circuit including semiconductor memory
    • 半导体集成电路包括半导体存储器
    • US08243491B2
    • 2012-08-14
    • US12884378
    • 2010-09-17
    • Toshiki HisadaHiromitsu Mashita
    • Toshiki HisadaHiromitsu Mashita
    • G11C5/06
    • G11C16/0483G11C7/18G11C2207/002H01L27/11519H01L27/11526H01L27/11529
    • According to one embodiment, a memory cell array includes memory cells arranged at crossing points of bit lines and word lines. The bit lines include first, second, third, and fourth bit lines sequentially arranged. A first sense circuit is arranged on a first end side of the memory cell array, electrically connected to the first and third bit lines. A second sense circuit is arranged on a second end side of the memory cell array, electrically connected to the second and fourth bit lines. A first hookup region is arranged between the memory cell array and the first sense circuit and includes a first transfer transistor connected to the first bit line and the first sense circuit. A second hookup region is arranged between the first hookup region and the first sense circuit and includes a second transfer transistor connected to the third bit line and the first sense circuit.
    • 根据一个实施例,存储单元阵列包括布置在位线和字线的交叉点处的存储单元。 位线包括顺序排列的第一,第二,第三和第四位线。 第一感测电路布置在存储单元阵列的第一端侧,电连接到第一和第三位线。 第二感测电路布置在存储单元阵列的第二端侧上,电连接到第二和第四位线。 第一连接区域布置在存储单元阵列和第一感测电路之间,并且包括连接到第一位线和第一感测电路的第一传输晶体管。 第二连接区域布置在第一连接区域和第一感测电路之间,并且包括连接到第三位线和第一感测电路的第二传输晶体管。
    • 63. 发明授权
    • Embedded memory databus architecture
    • 嵌入式内存数据总线架构
    • US08218386B2
    • 2012-07-10
    • US12952560
    • 2010-11-23
    • Richard C. Foss
    • Richard C. Foss
    • G11C7/02
    • G11C7/1069G11C7/06G11C7/1048G11C7/1051G11C11/4091G11C11/4093G11C11/4096G11C11/4097G11C2207/002G11C2207/005
    • A dynamic random access memory (DRAM) having pairs of bitlines, each pair being connected to a first bit line sense amplifier, wordlines crossing the bitlines pairs forming an array, charge storage cells connected to the bitlines, each having an enable input connected to a wordline, the bit line sense amplifiers being connected in a two dimensional array, pairs of primary databuses being connected through first access transistors to plural corresponding bit line sense amplifiers in each row of the array, apparatus for enabling columns of the first access transistors, databus sense amplifiers each connected to a corresponding data bus pair, a secondary databus, the secondary databus being connected through second access transistors to the databus sense amplifiers, and apparatus for enabling the second access transistors, whereby each the primary databus pair may be shared by plural sense amplifiers in a corresponding row of the array and the secondary databus may be shared by plural primary databus pairs.
    • 具有位线对的动态随机存取存储器(DRAM),每对都连接到第一位线读出放大器,与形成阵列的位线对交叉的字线,连接到位线的电荷存储单元,每个具有连接到位线的使能输入 字线,位线读出放大器以二维阵列连接,成对的初级数据总线通过第一存取晶体管连接到阵列的每一行中的多个相应的位线读出放大器,用于使第一存取晶体管的列,数据总线 读出放大器各自连接到对应的数据总线对,辅助数据总线,次级数据总线通过第二存取晶体管连接到数据总线读出放大器,以及用于使能第二存取晶体管的装置,由此每个主数据总线对可以被多个 阵列的相应行中的读出放大器和辅助数据总线可以由多个pri共享 玛丽数据总线对。
    • 67. 发明授权
    • Semiconductor memory device and driving method of the same
    • 半导体存储器件及其驱动方法
    • US08174920B2
    • 2012-05-08
    • US12711613
    • 2010-02-24
    • Fumiyoshi MatsuokaTakashi Ohsawa
    • Fumiyoshi MatsuokaTakashi Ohsawa
    • G11C7/02G11C11/24
    • G11C11/4091G11C11/4076G11C2207/002G11C2207/005G11C2211/4016
    • A memory includes a first and a second bit lines (BL); a first and a second sense nodes (SN); a first transfer gate between the 1st-BL and the 1st-SN; a second transfer gate (TG) between the 2nd-BL and the 2nd-SN; a latch circuit latching data to the 1st and 2nd-SN; a first data line (DQ) from the 1st-SN to outside; and a 2nd-DQ from the 2nd-SN to outside, wherein write data is transmitted from the 1st and 2nd-DQ to the 1st and 2nd-SN corresponding to selected cells before the 1st and 2nd-TG are set to be a conductive state, when writing data into the selected cells to be written out of the cells, and write data in the 1st and 2nd-SN corresponding to the selected cells are started to be written into the selected cells, when the 1st and 2nd-TG are set to be a conductive state.
    • 存储器包括第一和第二位线(BL); 第一和第二感测节点(SN); 第一个BL和第一个SN之间的第一个传输门; 在第二BL和第二-SN之间的第二传输门(TG); 锁存电路将数据锁存到第1和第2-SN; 第一个数据线(DQ)从第一个SN到外部; 以及从第2-SN到外部的第2-DQ,其中在将第1和第2 -TT设置为导通状态之前,将写入数据从第1和第2-DQ发送到对应于所选择的单元的第1和第2-SN 当将数据写入要被写入单元格的所选单元格中时,开始将与所选单元相对应的第1和第2-SN中的写入数据写入所选单元格,当设置第1和第2 -TG时 成为导电状态。
    • 69. 发明授权
    • Bit line decoder architecture for NOR-type memory array
    • NOR型存储器阵列的位线解码器架构
    • US08154902B2
    • 2012-04-10
    • US13099792
    • 2011-05-03
    • Pantas Sutardja
    • Pantas Sutardja
    • G11C17/00G11C11/34G11C8/00
    • G11C7/1048G11C16/0491G11C16/08G11C16/24G11C2207/002
    • An integrated circuit including a plurality of bit lines, a memory array, and a bit line decoder. The memory array includes a plurality of memory cells, wherein each memory cell is respectively coupled to (i) two corresponding bit lines of the plurality of bit lines. During sensing of a state of a given memory cell, the bit line decoder (i) precharges a first bit line of the two corresponding bit lines to which the given memory cell is coupled to a first voltage potential, including precharging all other bit lines on a same side of the memory array as the first bit line to the first voltage potential, and (ii) precharges a second bit line of the two corresponding bit lines to a second voltage potential, including precharging all other bit lines on a same side of the memory array as the second bit line to the second voltage potential.
    • 包括多个位线的集成电路,存储器阵列和位线解码器。 存储器阵列包括多个存储器单元,其中每个存储器单元分别耦合到(i)多个位线中的两个对应的位线。 在感测给定存储单元的状态期间,位线解码器(i)对给定存储单元耦合到的第一电压电位的两个对应位线的第一位线进行预充电,包括对所有其它位线进行预充电 存储器阵列的与第一位线相同的一侧到第一电压电位,以及(ii)将两个相应位线的第二位线预充电到第二电压电位,包括对同一侧的所有其它位线进行预充电 存储器阵列作为第二位线到第二电压电位。
    • 70. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US08130577B2
    • 2012-03-06
    • US12590417
    • 2009-11-06
    • Jong-Hak WonYoung-Soo AnJung-Hyeon Kim
    • Jong-Hak WonYoung-Soo AnJung-Hyeon Kim
    • G11C8/00
    • G11C7/08G11C5/025G11C7/1012G11C7/12G11C2207/002
    • A semiconductor memory device includes a sub memory cell array region having memory cells each connected between word lines extending in a first direction and bit lines extending in a second direction that is orthogonal to the first direction of extension of the word lines and a sub word line driver region disposed at a side of the sub memory cell array region in the first direction and including sub word line drivers that activate the word lines. A sensing region is disposed at a side of the sub memory cell array region in the second direction and including an equalizer that precharges the bit line in response to a signal transferred through a drive signal line and at least one first control signal driver that activates an inverted control signal line in response to a signal transferred through a control signal line. A conjunction region disposed at an intersection between the sub word line driver region and the sensing region, in which the inverted control signal line is connected to the drive signal line.
    • 半导体存储器件包括具有存储单元的子存储单元阵列区域,每个存储单元分别连接在沿第一方向延伸的字线和沿着与字线的第一延伸方向正交的第二方向延伸的位线和一个子字线 驱动器区域,设置在副存储单元阵列区域的第一方向的一侧,并且包括激活字线的子字线驱动器。 感测区域设置在副存储单元阵列区域的第二方向的一侧,并且包括响应于通过驱动信号线传送的信号而对位线进行预充电的均衡器,以及至少一个第一控制信号驱动器,其激活 响应于通过控制信号线传送的信号的反相控制信号线。 配置在副字线驱动器区域和感测区域之间的交叉点处的连接区域,其中反相控制信号线连接到驱动信号线。