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    • 61. 发明申请
    • Fuel cell reliability improvement by using stack end plate temperature sensors
    • 通过使用堆栈端板温度传感器来提高燃料电池的可靠性
    • US20080145729A1
    • 2008-06-19
    • US11640087
    • 2006-12-15
    • Abdullah B. AlpDavid A. Arthur
    • Abdullah B. AlpDavid A. Arthur
    • H01M8/04G01K13/00
    • G01K13/10G01K15/00H01M8/0267H01M8/04007H01M8/04358H01M8/04365H01M8/04679H01M8/04686H01M8/249H01M2008/1095Y10T29/49856
    • A system and method for determining whether a fuel cell stack is overheating. The system measures the temperature of end cells in the stack using end cell temperature sensors, and calculates an average end cell temperature based on the end cell temperature measurements. The system also measures the temperature of a cooling fluid being output from the fuel cell stack. The system determines if any of the measured end cell temperatures are outlying by comparing each end cell temperature measurement to the average. The system determines that the cooling fluid outlet temperature sensor has possibly failed if the cooling fluid outlet temperature is greater than the average end cell temperature and the cooling fluid outlet temperature minus the average end cell temperature is greater than a predetermined temperature value. The system also determines that the fuel cell stack may be overheating if the average end cell temperature is greater than the cooling fluid outlet temperature and the average end cell temperature minus the cooling fluid outlet temperature is greater than a predetermined temperature value.
    • 一种用于确定燃料电池堆是否过热的系统和方法。 该系统使用终端电池温度传感器测量堆叠中端电池的温度,并根据端电池温度测量计算平均端电池温度。 该系统还测量从燃料电池堆输出的冷却流体的温度。 该系统通过将每个终端电池温度测量与平均值进行比较来确定测量的终端电池温度是否偏离。 如果冷却流体出口温度大于平均端电池温度并且冷却流体出口温度减去平均端电池温度大于预定温度值,则系统确定冷却液出口温度传感器可能失效。 如果平均端电池温度大于冷却流体出口温度并且平均端电池温度减去冷却流体出口温度大于预定温度值,则该系统还确定燃料电池堆可能过热。
    • 62. 发明申请
    • METHOD FOR DETECTING ABNORMALITY OF TEMPERATURE SENSOR IN MACHINE TOOL
    • 检测机床温度传感器异常的方法
    • US20080144693A1
    • 2008-06-19
    • US11950561
    • 2007-12-05
    • Reiji SATO
    • Reiji SATO
    • G01K15/00
    • G01K15/00G01K15/007
    • The invention relates to a method for detecting an abnormality of a temperature sensor.A plurality of temperature sensors are preliminarily grouped for each of predetermined attachment areas of a machine tool, and after a temperature of each part is measured in S1, the detected temperatures are classified in S2 for each of the grouped attachment areas, and then sorted in descending order in S3. Subsequently, a difference ΔT between any closest two of the detected temperatures is obtained in S4, and then compared with a preset limit value γ in S5, when ΔT exceeds the limit value γ, temperature sensors in a corresponding attachment area are determined abnormal in S6, and an alarm is displayed.
    • 本发明涉及一种检测温度传感器异常的方法。 对于机床的每个预定的附接区域,预先对多个温度传感器进行分组,并且在S 1中测量每个部件的温度后,对于每个分组的附接区域,将检测到的温度分类为S 2,然后 在S 3中以降序排序。随后,在S 4中获得任何最接近的两个检测温度之间的差值DeltaT,然后在S 5中与预设极限值γ进行比较,当DeltaT超过极限值γ时,温度传感器 在S 6中在相应的附接区域被确定为异常,并且显示报警。
    • 63. 发明授权
    • Method and apparatus for calibration of an on-chip temperature sensor within a memory device
    • 用于在存储器件内校准片上温度传感器的方法和装置
    • US07383144B2
    • 2008-06-03
    • US11354955
    • 2006-02-16
    • Harald Lorenz
    • Harald Lorenz
    • G01K13/00G01K15/00G06F19/00
    • G01K15/00
    • According to embodiments of the present invention, an automatic trim or calibration for a temperature sensor of a chip or memory device is performed on that chip. An embodiment of the present invention includes a calibration unit that increments trim or calibration values provided to the chip temperature sensor and stored in a calibration register. The calibration unit retrieves status bits from the temperature sensor indicating a measured temperature for each calibration value and compares those bits to a reference or target value associated with a target temperature and stored in a reference register. When the status bits satisfy the comparison, the corresponding calibration value is identified as the proper calibration value for the temperature sensor and is subsequently used by the temperature sensor for temperature measurements.
    • 根据本发明的实施例,在该芯片上执行用于芯片或存储器件的温度传感器的自动修整或校准。 本发明的实施例包括校准单元,其增加提供给芯片温度传感器并存储在校准寄存器中的微调或校准值。 校准单元从温度传感器检索指示每个校准值的测量温度的状态位,并将这些位与与目标温度相关联的参考或目标值进行比较并存储在参考寄存器中。 当状态位满足比较时,相应的校准值被识别为温度传感器的适当校准值,随后由温度传感器用于温度测量。
    • 66. 发明授权
    • Eliminating the effects of the temperature coefficients of series resistance on temperature sensors
    • 消除串联电阻温度系数对温度传感器的影响
    • US07333038B1
    • 2008-02-19
    • US11368135
    • 2006-03-02
    • Mehmet Aslan
    • Mehmet Aslan
    • H03M1/10
    • G01K7/015G01K15/00
    • An embodiment of the present invention is directed to a method for reducing the effects of temperature coefficients of series resistance in a temperature sensing circuit having a temperature sensing element. The currents through the temperature sensing element are relatively constant over temperature. The method includes adjusting the gain of an analog to digital converter to compensate for the change in current densities in the temperature sensing element multiplied by a characterized temperature coefficient of the series resistance of a signal path of the temperature sensing circuit. The method also includes adjusting an offset of the analog to digital converter to compensate for the change in current densities in the temperature sensing element multiplied by a characterized resistance of the signal path of the temperature sensing circuit.
    • 本发明的一个实施例涉及一种用于降低具有温度感测元件的温度检测电路中的串联电阻的温度系数的影响的方法。 通过温度检测元件的电流在温度上相对恒定。 该方法包括调整模数转换器的增益以补偿温度感测元件中的电流密度的变化乘以温度感测电路的信号路径的串联电阻的特征温度系数。 该方法还包括调整模数转换器的偏移以补偿温度感测元件中的电流密度的变化乘以温度感测电路的信号路径的表征电阻。
    • 67. 发明申请
    • DUAL MODE SINGLE TEMPERATURE TRIMMING
    • 双模式单温度剪切
    • US20080030259A1
    • 2008-02-07
    • US11462602
    • 2006-08-04
    • Eric Scheuerlein
    • Eric Scheuerlein
    • H01L35/00
    • G01K7/01G01K15/00H01C17/22Y10S323/907
    • In a system for performing a dual mode single temperature trim upon an electronic device to remove combined mismatch and process variation errors, a dynamic element matching control is configured for enabling dynamic element matching of components of the electronic device. A process trim module is configured for performing a process trim to remove a temperature dependant error from the electronic device while the dynamic element matching is enabled within the electronic device. A mismatch trim module is configured for performing a mismatch trim to remove a mismatch error from the electronic device after the process trim has been performed. The mismatch trim is performed on a portion of the electronic device for which the dynamic element matching has been disabled. Additionally, the mismatch trim is performed at substantially an equivalent temperature to a temperature at which the process trim was performed.
    • 在用于在电子设备上执行双模式单温度修整以消除组合的失配和过程变化误差的系统中,动态元件匹配控制被配置用于实现电子设备的部件的动态元件匹配。 过程调整模块被配置为在电子设备内启用动态元件匹配时,执行过程修剪以从电子设备移除与温度相关的误差。 配置不匹配修正模块被配置为执行不匹配修整以在执行过程修剪之后从电子设备去除不匹配错误。 在已经禁用动态元件匹配的电子设备的一部分上执行不匹配修剪。 此外,不匹配修整在基本上等于进行过程修剪的温度的当量温度下进行。