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    • 63. 发明申请
    • PROCESS FOR PRODUCING MULTILAYERED GAS-BARRIER FILM
    • 生产多层气体阻隔膜的方法
    • US20130323436A1
    • 2013-12-05
    • US13963227
    • 2013-08-09
    • MITSUBISHI PLASTICS, INC.
    • Shigenobu YOSHIDAChiharu OkawaraKota Ozeki
    • C09D5/00
    • C09D5/00B05D1/62B05D7/56B05D2252/02B05D2350/60C23C14/10C23C14/562C23C16/401C23C16/545C23C28/00
    • Provided are a method for producing a film, which is satisfactory in productivity, exhibits high gas-barrier property immediately after production, and has excellent adhesive strength between constituent layers while maintaining the excellent gas-barrier property, and a gas-barrier film, which is obtained by the method. The method for producing a gas-barrier film includes the steps of: (1) forming an inorganic thin film by a vacuum deposition method on at least one surface of a base film; (2) forming a thin film by a plasma CVD method on the inorganic thin film formed in the step (1); and (3) forming an inorganic thin film by the vacuum deposition method on the thin film formed in the step (2), in which each of the steps (1) and (3), and the step (2) are sequentially carried out at a pressure of 1×10−7 to 1 Pa, and at a pressure of 1×10−3 to 1×102 Pa, respectively.
    • 本发明提供一种膜的制造方法,其生产率良好,生产后立即显示出高的阻气性,并且在保持优异的阻气性的同时具有优异的组成层之间的粘合强度和阻气膜, 通过该方法获得。 制造阻气膜的方法包括以下步骤:(1)通过真空沉积法在基膜的至少一个表面上形成无机薄膜; (2)在步骤(1)中形成的无机薄膜上通过等离子体CVD法形成薄膜; 和(3)通过真空沉积法在步骤(2)中形成的薄膜上形成无机薄膜,其中步骤(1)和(3)和步骤(2)中的每一个依次进行 压力为1×10-7〜1Pa,压力为1×10-3〜1×102Pa。