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    • 61. 发明授权
    • High-speed circuit breaker
    • 高速断路器
    • US4315231A
    • 1982-02-09
    • US214695
    • 1980-12-09
    • Hisashi KondoShozo YamazakiYukio Yamada
    • Hisashi KondoShozo YamazakiYukio Yamada
    • H01H83/08H01H33/42H01H71/50H01H7/03
    • H01H71/50
    • High-speed breaker for an electric circuit, including a fixed contact, movable contact and a movable holder for the movable contact. An actuating rod is reciprocally movable toward and away from the fixed contact between first and second positions. A head is connected to the actuating rod. In the first position of the actuating rod, the head engages with the movable holder to cause the movable contact to engage with the fixed contact. In the second position of the actuating rod, the movable contact is disengaged from the fixed contact. A release member connected to the head is operative in response to overcurrent passing through the circuit when the actuating rod is in the first position, to disengage the movable holder from the head to disengage the movable contact from the fixed contact. An extension of the actuating rod is located between the engaging position of the movable holder with the head and the connecting position of the release member to the head.
    • 用于电路的高速断路器,包括固定触点,可动触头和用于可动触头的可动保持器。 致动杆可在第一位置和第二位置之间朝向和远离固定触头往复移动。 头部连接到致动杆。 在致动杆的第一位置,头部与可动保持器接合,以使可动触头与固定触头接合。 在致动杆的第二位置,可动触头与固定触头分离。 连接到头部的释放构件响应于当致动杆处于第一位置时通过电路的过电流而操作,以使可动保持器与头脱离,以使可动触头与固定触点脱离接触。 致动杆的延伸部位于可动保持器与头部的接合位置和释放构件与头部的连接位置之间。
    • 63. 发明申请
    • ELECTROSTATIC COATING APPARATUS
    • 静电涂装置
    • US20100193613A1
    • 2010-08-05
    • US11909330
    • 2006-05-31
    • Yukio Yamada
    • Yukio Yamada
    • B05B5/04
    • B05B5/0533B05B5/04B05B5/0415B05B5/0426B05B15/50
    • A housing member includes a main housing body and an intermediate tube provided around the outer periphery of the main housing body. Located in a front portion of the main housing body is an atomizer including an air motor and a rotary atomizing head, while located in a rear portion of the main housing body is a high voltage generator to apply a high voltage to paint through the air motor. A multitude of hollow cavities are uniformly formed in the intermediate tube over the entire outer surface thereof by the use of through holes opened through the intermediate tube. A cover member is fitted on the outer surface of the intermediate tube in contact with the intermediate tube, thereby intensifying electric field strength in outer corner portions of the hollow cavities to prevent deposition of charged paint particles.
    • 壳体构件包括主壳体和设置在主壳体的外周周围的中间管。 位于主壳体的前部的是包括气动马达和旋转雾化头的雾化器,而位于主壳体的后部的是高压发生器,以通过气动马达施加高电压来涂装 。 通过使用通过中间管打开的通孔,在中间管的整个外表面上均匀地形成多个中空腔。 覆盖件安装在中间管的与中间管接触的外表面上,从而增强中空腔的外角部的电场强度,以防止带电涂料颗粒的沉积。
    • 65. 发明申请
    • ELECTROSTATIC COATING DEVICE
    • 静电涂层装置
    • US20090032625A1
    • 2009-02-05
    • US11916499
    • 2006-05-31
    • Yukio Yamada
    • Yukio Yamada
    • B05B5/025
    • B05B5/0533B05B5/04B05B5/0415B05B5/0426B05B15/50
    • An atomizer including an air motor and a rotary atomizing head, mounted in a front side of a housing member, while a high voltage generator applying a high voltage to paint through the air motor is mounted in a rear side of the housing member. A cover member is fitted on the housing member to cover an outer surface of the housing member. Opposite axial ends of the cover member are fitted on and attached to opposite axial ends of the housing member so as to leave an annular gap space between the cover member and the housing member. The annular gap space keeps almost entire radially confront areas of the cover member and the housing member, preventing high voltage electrostatic charges on the outer surfaces of the cover member from leaking through the housing member.
    • 包括安装在壳体构件的前侧的空气马达和旋转雾化头的雾化器安装在壳体构件的后侧,同时通过空气马达施加高电压来涂漆的高压发生器。 盖构件安装在壳体构件上以覆盖壳体构件的外表面。 盖构件的相对的轴向端部装配并且附接到壳体构件的相对的轴向端部,以便在盖构件和壳体构件之间留下环形间隙空间。 环形间隙保持盖构件和壳体构件的几乎整个径向对向的区域,防止盖构件的外表面上的高压静电电荷泄漏通过壳体构件。
    • 66. 发明申请
    • MICRO CHIP DEVICE
    • 微芯片设备
    • US20080056953A1
    • 2008-03-06
    • US11751793
    • 2007-05-22
    • Yukio YamadaNaoto KakutaTaisuke Hirono
    • Yukio YamadaNaoto KakutaTaisuke Hirono
    • B01L3/02
    • B01L3/502776B01L2200/0636B01L2200/143B01L2300/0816B01L2400/0487B01L2400/0622
    • Buffer solution and blood are streamed in a channel of a micro chip so as to form layers. Aggregation inducing agent for aggregating platelets in blood is coated at a wall face on a buffer solution streaming side. If streaming amount of blood is increased in this state, a layer width of blood can be increased, and detail analysis between the aggregation inducing agent and the platelets is possible thereby. Even if it is necessary to take an image or a moving image for comparison between a pre-aggregation state and an aggregation state, it is sufficient to take only a portion where the aggregation inducing agent is coated, that is, a reaction portion. Then, a device can be made cheaper without two cameras or a moving mechanism for the camera or a micro chip.
    • 缓冲溶液和血液在微芯片的通道中流动以形成层。 用于聚集血液中血小板的聚集诱导剂在缓冲溶液流动侧的壁面上被涂覆。 如果在这种状态下血液流量增加,则可以增加血液层的宽度,从而能够进行聚集诱导剂与血小板的细节分析。 即使在预聚合状态和聚集状态之间需要拍摄图像或运动图像进行比较,只需要仅涂覆聚集诱导剂的部分即反应部分即可。 然后,如果没有两个相机或用于相机或微芯片的移动机构,则可以使设备更便宜。
    • 67. 发明授权
    • Bumpless semiconductor device
    • 无铅半导体器件
    • US07109058B2
    • 2006-09-19
    • US10467638
    • 2002-02-18
    • Yukio YamadaMasayuki NakamuraHiroyuki Hishinuma
    • Yukio YamadaMasayuki NakamuraHiroyuki Hishinuma
    • H01L21/44
    • H01L21/563H01L21/4853H01L24/11H01L24/13H01L2224/05571H01L2224/05573H01L2224/11003H01L2224/11332H01L2224/13099H01L2224/131H01L2224/73203H01L2924/0001H01L2924/01004H01L2924/01005H01L2924/01006H01L2924/01013H01L2924/01029H01L2924/01033H01L2924/01078H01L2924/01079H01L2924/014H01L2924/07802H01L2924/07811H01L2924/14H01L2924/00015H01L2924/00H01L2224/05624H01L2924/00014
    • When connecting a semiconductor device such as an IC chip with a circuit board by the flip-chip method, a semiconductor device is provided without forming bumps thereon, which enables highly reliable and low cost connection between the IC chip and circuit board while ensuring suppressing short-circuiting, lowering connection costs, suppressing stress concentrations at the joints and reducing damage of the IC chip or circuit board. The bumpless semiconductor device is provided with electrode pads 2 on the surface thereof and with a passivation film 3 at the periphery of the electrode pads 2, and conductive particles 4 are metallically bonded to the electric pads 2. Composite particles in which a metallic plating layer is formed at the surface of resin particles are employed as the conductive particles 4. This bumpless semiconductor device can be manufactured by (a) causing conductive particles to be electrostatically adsorbed onto one face of a flat plate; and (b) overlaying the surface of the plate having the adsorbed conductive particles on the surface of electrode pads of a bumpless semiconductor device which is provided with the electrode pads on the surface thereof and with a passivation film at the periphery of the electrode pads, and ultrasonically welding this assembly, so that the conductive particles are metallically bonded and transferred from the flat plate to the electrode pads.
    • 当通过倒装芯片方法将诸如IC芯片的半导体器件与电路板连接时,提供半导体器件而不在其上形成凸块,这使得IC芯片和电路板之间可以实现高可靠性和低成本的连接,同时确保抑制短路 电路,降低连接成本,抑制接头处的应力集中,降低IC芯片或电路板的损坏。 无源半导体器件在其表面上设置有电极焊盘2,并且在电极焊盘2的周围具有钝化膜3,并且导电粒子4金属结合到电焊盘2。 采用在树脂粒子表面形成有金属镀层的复合粒子作为导电粒子4.这种无凸起的半导体器件可以通过(a)使导电粒子静电吸附在平板的一个面上来制造。 和(b)将具有吸附的导电颗粒的板的表面覆盖在其表面上设置有电极焊盘的无扰动半导体器件的电极焊盘的表面上,并且在电极焊盘的周围具有钝化膜, 并且超声波焊接该组件,使得导电颗粒被金属地结合并从平板转移到电极焊盘。
    • 69. 发明申请
    • Conversion lens system
    • 转换镜头系统
    • US20050168830A1
    • 2005-08-04
    • US11035970
    • 2005-01-18
    • Yoshio SegawaYukio Yamada
    • Yoshio SegawaYukio Yamada
    • G02B7/02G02B15/10G02B15/12G03B17/12G03B17/14G03B17/56G02B15/02G02B15/14
    • G02B15/12G02B15/10
    • A conversion lens apparatus includes a first and second barrels for housing a first and second lenses, wherein a back portion of the first barrel is detachably attached to the main body side barrel, a back portion of the second barrel is detachably attached to a front portion of the first barrel, the first barrel is configured, so a magnification rate of total optical system including the first lens and imaging optical system is converted to be more wide-angle side than magnification rate of the imaging optical system itself, when attached to the main body side barrel, and the second barrel is configured, so the magnification rate of total optical system including the first lens and imaging optical system is converted to be more telescopic side than magnification rate of the imaging optical system itself, when attached to the first barrel which is attached to the main body side barrel.
    • 一种转换透镜装置,包括用于容纳第一和第二透镜的第一和第二筒,其中第一筒的后部可拆卸地附接到主体侧筒,第二筒的后部可拆卸地附接到前部 在第一筒体中配置第一筒体,因此将包括第一透镜和成像光学系统的总光学系统的放大率转换为与成像光学系统本身的放大率相比更大的角度, 主体侧镜筒和第二镜筒构成,因此包括第一透镜和成像光学系统的总光学系统的放大率被转换为比成像光学系统本身的放大率更大的伸缩侧,当附接到第一镜头 桶,其连接到主体侧桶。