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    • 61. 发明授权
    • Method of die bonding electronic component and die bonding apparatus thereof
    • 电子部件和芯片接合装置的芯片接合方法
    • US06176966B1
    • 2001-01-23
    • US09095739
    • 1998-06-11
    • Masaki TsujimotoKenji Kobayashi
    • Masaki TsujimotoKenji Kobayashi
    • B32B3500
    • H01L21/6836H01L21/67132H01L2221/68327Y10S156/941Y10T29/49819Y10T29/49821Y10T29/49822Y10T156/11Y10T156/1132Y10T156/19
    • A method of die bonding electronic components. A wafer is mounted on a dicing tape (17) comprising at least one layer of shrink film and a pressure sensitive adhesive layer so that the wafer is stuck thereto by the pressure sensitive adhesive layer. The wafer is then diced so that the wafer is cut apart into a multiplicity of chips (16). The dicing tape (17) having the multiplicity of chips stuck thereto is placed on a table equipped with heating means. This is followed by shrinking the shrink film forming part of the dicing tape by the heating means (3, 7) so that an area of adhesion and adhesive strength between the chips and the adhesive layer are decreased and so that the chips are arranged with predetermined spacings. The final step is suctioning the chips (16) arranged with predetermined spacings one at a time by a suction collet (19) disposed above the chips so that the chips are separated from each other. This method enables effective die bonding without damaging the chips. Apparatus for effecting the method is also provided.
    • 一种将电子元件贴合的方法。 将晶片安装在包括至少一层收缩膜和压敏粘合剂层的切割带(17)上,使得晶片通过压敏粘合剂层粘附到其上。 然后对晶片进行切割,使得晶片被切割成多个芯片(16)。 将具有多个芯片的切割胶带(17)放置在装有加热装置的工作台上。 然后,通过加热装置(3,7)使形成切割带的部分的收缩膜收缩,使得芯片和粘合剂层之间的粘附面积和粘合强度降低,使得芯片以预定的方式排列 间距。 最后一步是通过设置在芯片上方的吸入夹头(19)一次抽吸以预定间隔布置的芯片(16),使得芯片彼此分离。 该方法能够有效地进行裸片接合而不损坏芯片。 还提供了用于实现该方法的装置。
    • 68. 发明授权
    • Set of iron golf club heads having a shifting back surface
    • 一组具有移动后表面的铁质高尔夫球杆头
    • US5524880A
    • 1996-06-11
    • US286266
    • 1994-08-05
    • Kenji Kobayashi
    • Kenji Kobayashi
    • A63B53/00A63B53/04
    • A63B53/00A63B2053/005
    • A set of iron golf club heads for correction of each tendency to hook balls for short irons, and to slice balls for long irons respectively. As the number of the iron golf club head increases, the back of each head body is shifted crosswise away from the neck relative to the face. Thus, as the number of the iron golf club head increases, the center of gravity of each head body is generally shifted crosswise away from the neck as well. Particularly, a position of a middle point M of the face of the 5th iron golf club head is approximately consistent with that of the center of gravity with respect to the lateral direction. Owing to the above position-settings of the center of gravity, balls are given slicing rotation for short irons, while balls are given hooking rotation for long irons, thereby decreasing either a habitual hooking or slicing tendency.
    • 一组铁质高尔夫球杆头,用于校正短铁杆钩球的各种倾向,并分别对较长的铁杆切片。 随着铁质高尔夫球杆头数量的增加,每个头部主体的背面相对于面部横向偏离颈部。 因此,随着铁质高尔夫球杆头的数量的增加,每个头部主体的重心通常也与颈部横向偏离。 特别地,第五铁高尔夫球杆头的面的中点M的位置与重心相对于横向方向的位置近似一致。 由于上述重心的位置设定,对于较短的铁杆,球被赋予了切片旋转,而球被长时间的熨斗旋转,从而降低了惯性钩或切片的倾向。