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    • 64. 发明授权
    • Hydrogen getter for integrated microelectronic assembly
    • 用于集成微电子组件的吸氢剂
    • US06369442B1
    • 2002-04-09
    • US09285596
    • 1999-04-02
    • Yoshio Saito
    • Yoshio Saito
    • H01L2320
    • H01L23/26H01L2924/0002H01L2924/13063H01L2924/1423H01L2924/15153H01L2924/16195H01L2924/00
    • Disclosed are a packaging component for packaging a microelectronic (e.g., III-V semiconductor) device, the packaged microelectronic device, and methods for manufacture thereof. The component has sequentially deposited layers of metal (37, 50), to be located within the package, to act as a hydrogen getter. The sequentially deposited layers of metal include at least a first layer (3) of Ni adjacent the housing member surface, to improve adherence of the sequentially deposited layers and interstitially trap hydrogen; an outermost layer (11) of palladium to convert molecular hydrogen to hydrogen atoms and to absorb hydrogen; and a layer (9) of Ti or Zr adjacent this outermost layer. Additional layers (5, 7) of nickel and of titanium or zirconium can be provided between the first layer and the layer adjacent the outermost layer. Desirably, the surface of the housing member is roughened prior to depositing the first layer thereon.
    • 公开了用于封装微电子(例如,III-V半导体)器件,封装的微电子器件及其制造方法的封装组件。 该组件具有顺序沉积的位于封装内的金属层(37,50),用作吸氢剂。 顺序沉积的金属层包括至少邻近壳体构件表面的Ni的第一层(3),以改善顺序沉积的层的粘附并且间隙地捕获氢; 钯的最外层(11),以将分子氢转化为氢原子并吸收氢; 和邻近该最外层的Ti或Zr层(9)。 可以在第一层和与最外层相邻的层之间提供镍和钛或锆的附加层(5,7)。 理想地,在其上沉积第一层之前,使外壳构件的表面变粗糙。
    • 65. 发明授权
    • Portable telephone
    • 便携式电话
    • US06356768B1
    • 2002-03-12
    • US09349952
    • 1999-07-08
    • Yoshio SaitoNobuyuki SuzukiKiyoshi Watanabe
    • Yoshio SaitoNobuyuki SuzukiKiyoshi Watanabe
    • H04B138
    • H04M1/0262H04B1/3833
    • Conventional portable telephones have a problem that their space factor is bad and the size thereof is increased because a transmitter/receiver unit and a battery are disposed in parallel with each other in a case formed of a lower cover and an upper cover. In a portable telephone of the present invention, the frame member of a transmitter/receiver unit is attached to a mother substrate in the state that the frame member is partly interposed between the mother substrate and a battery. With this arrangement, the space between the mother substrate and the battery can be effectively used, whereby there can be provided a small portable telephone having a good space factor.
    • 传统的便携式电话具有由于在由下盖和上盖形成的壳体中由于发送器/接收器单元和电池彼此平行地布置而导致其空间因素不佳并且其尺寸增大的问题。 在本发明的便携式电话机中,发送器/接收器单元的框架构件在框架构件被部分插入母基板和电池之间的状态下附接到母基板。 通过这种布置,可以有效地使用母基板和电池之间的空间,由此可以提供具有良好的空间因素的小型便携式电话。
    • 67. 发明授权
    • Hydrogen getter for integrated microelectronic assembly
    • 用于集成微电子组件的吸氢剂
    • US6110808A
    • 2000-08-29
    • US206271
    • 1998-12-04
    • Yoshio Saito
    • Yoshio Saito
    • H01L23/26H01L21/48
    • H01L23/26H01L2924/0002H01L2924/13063H01L2924/1423H01L2924/15153H01L2924/16195
    • Disclosed are a packaging component for packaging a microelectronic (e.g., III-V semiconductor) device, the packaged microelectronic device formed using such component, and method for forming the package component and packaged microelectronic device. The component (which can be, e.g., a lid or container 21 of the package) has sequentially deposited layers of metal layers (37, 50), to be located within the package, attached to a housing member, to act as a hydrogen getter in the package. The sequentially deposited layers of metal layers includes at least a first layer (3) of Ni adjacent the housing member surface, to improve adherence of the sequentially deposited layers and interstitially trap hydrogen; an outermost layer (11) of palladium to convert molecular hydrogen to hydrogen atoms and as the primary absorber of the hydrogen; and a layer (9) of Ti or Zr adjacent this outermost layer and acting as a secondary absorber of the hydrogen. Additional layers (5, 7) of nickel and of titanium or zirconium can be provided between the first layer and the layer adjacent the outermost layer. These layers of the sequentially deposited layers of metal layers can be deposited by, e.g., vacuum evaporation or sputtering. Desirably, where sequentially deposited layers is provided directly on the housing member, the surface of the housing member is roughened prior to depositing the first layer thereon, in order to improve hydrogen absorption efficiency of the sequentially deposited layers of metal layers.
    • 公开了用于封装微电子(例如,III-V半导体)器件的封装组件,使用这种部件形成的封装的微电子器件,以及用于形成封装元件和封装的微电子器件的方法。 组件(其可以是例如包装的盖或容器21)具有顺序地沉积的金属层(37,50)层,其位于包装内,附接到壳体构件以用作吸氢剂 在包装中。 依次沉积的金属层包括至少邻近壳体构件表面的Ni的第一层(3),以改善依次沉积的层的粘附性并且间隙地捕获氢; 将分子氢转化为氢原子并作为氢的主要吸收剂的钯的最外层(11); 和邻近该最外层的Ti或Zr层(9),并且用作氢的二次吸收体。 可以在第一层和与最外层相邻的层之间提供镍和钛或锆的附加层(5,7)。 可以通过例如真空蒸发或溅射来沉积顺序沉积的金属层的这些层。 理想地,在顺序沉积的层被直接设置在外壳构件上的情况下,在沉积其上的第一层之前,将外壳构件的表面粗糙化,以提高顺序沉积的金属层的氢吸收效率。