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61. 发明授权

US08083571B2 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US08083571B2
公开(公告)日：2011-12-27
申请号：US11665648
申请日：2005-10-31
申请人： Osamu Nabeya , Tetsuji Togawa , Makoto Fukushima
发明人： Osamu Nabeya , Tetsuji Togawa , Makoto Fukushima
IPC分类号： B24B49/00
CPC分类号： B24B37/20 , B24B37/005 , B24B37/10 , B24B37/105 , B24B37/30 , B24B37/32 , B24B47/22 , B24B49/00 , B24B49/16
摘要： A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical, direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.
摘要翻译：抛光装置具有抛光垫，用于保持半导体晶片的顶环和可操作以沿垂直方向移动顶环的垂直移动机构。抛光装置还具有距离测量传感器，该距离测量传感器可操作以当顶环的下表面与抛光垫接触时检测顶环的位置，以及控制器，其可操作以计算顶环的最佳位置进行抛光基于由距离测量传感器检测到的位置的半导体晶片。垂直移动机构包括可操作以将顶环移动到最佳位置的滚珠丝杠机构。

62. 发明授权

US08070560B2 Polishing apparatus and method 有权
标题翻译：抛光设备和方法
公开(公告)号：US08070560B2
公开(公告)日：2011-12-06
申请号：US12292677
申请日：2008-11-24
申请人： Hozumi Yasuda , Makoto Fukushima , Tetsuji Togawa
发明人： Hozumi Yasuda , Makoto Fukushima , Tetsuji Togawa
IPC分类号： B24B5/00
CPC分类号： B24B37/30
摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a polishing head having at least one elastic membrane configured to form a plurality of pressure chambers for being supplied with a pressurized fluid, and a controller configured to control supply of the pressurized fluid to the pressure chambers. The controller controls supply of the pressurized fluid so that the pressurized fluid is supplied first to the pressure chamber located at a central portion of the substrate when the substrate is brought into contact with the polishing surface, and then the pressurized fluid is supplied to the pressure chamber located at a radially outer side of the pressure chamber located at the central portion of the substrate.
摘要翻译：抛光装置用于将半导体晶片等基板研磨成平面镜面。抛光装置包括具有抛光表面的抛光台，具有至少一个弹性膜的抛光头，所述弹性膜被构造成形成用于供应加压流体的多个压力室，以及控制器，其构造成控制加压流体供应到压力室。控制器控制加压流体的供给，使得当基板与抛光表面接触时，加压流体首先被供应到位于基板的中心部分处的压力室，然后将加压流体供应到压力位于位于基板中心部分处的压力室的径向外侧的腔室。

63. 发明授权

US07867063B2 Substrate holding apparatus and polishing apparatus 有权
公开(公告)号：US07867063B2
公开(公告)日：2011-01-11
申请号：US12453598
申请日：2009-05-15
申请人： Tetsuji Togawa , Hiroshi Yoshida , Osamu Nabeya , Makoto Fukushima , Koichi Fukaya
发明人： Tetsuji Togawa , Hiroshi Yoshida , Osamu Nabeya , Makoto Fukushima , Koichi Fukaya
IPC分类号： B24B7/22
CPC分类号： B24B37/30 , B24B37/32 , B24B49/16
摘要： A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.

64. 发明授权

US07670206B2 Substrate polishing apparatus and substrate polishing method 有权
公开(公告)号：US07670206B2
公开(公告)日：2010-03-02
申请号：US10559135
申请日：2004-06-17
申请人： Tetsuji Togawa , Koichi Fukaya , Mitsuo Tada , Taro Takahashi , Yasunari Suto
发明人： Tetsuji Togawa , Koichi Fukaya , Mitsuo Tada , Taro Takahashi , Yasunari Suto
IPC分类号： B24B49/00
CPC分类号： B24B37/013 , B24B49/105 , B24B49/12 , B24B49/16
摘要： The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surface (101), a substrate holder (1) for holding and pressing a substrate (W) against the polishing surface (101) of the polishing table (100), and a film thickness measuring device (200) for measuring a thickness of a film on the substrate (W). The substrate holder (1) has a plurality of pressure adjustable chambers (22 to 25), and pressures in the respective chambers (22 to 25) are adjusted based on the film thickness measured by the film thickness measuring device (200).

65. 发明授权

US07632173B2 Substrate holding apparatus and polishing apparatus 有权
标题翻译：基板保持装置和抛光装置
公开(公告)号：US07632173B2
公开(公告)日：2009-12-15
申请号：US11987978
申请日：2007-12-06
申请人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
发明人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
IPC分类号： B24B1/00
CPC分类号： B24B37/30 , B24B41/061 , B24B49/105
摘要： The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.
摘要翻译：本发明涉及一种用于将基板（例如半导体晶片）保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。根据本发明的基板保持装置包括其中具有容纳空间的顶环主体和可在顶环体中的容纳空间内垂直移动的可垂直移动的构件。具有弹性膜的邻接构件附接到可垂直移动构件的下表面。邻接构件的弹性膜包括邻接部分，其具有向外突出的凸缘，与基底直接或间接接触;以及连接部分，其从邻接部分的凸缘的基部向上延伸并连接到垂直活动件。连接部由具有高于邻接部的材料的柔软性的材料制成。

66. 发明申请

US20080070479A1 Polishing Apparatus 有权
标题翻译：抛光装置
公开(公告)号：US20080070479A1
公开(公告)日：2008-03-20
申请号：US11665648
申请日：2005-10-31
申请人： Osamu Nabeya , Tetsuji Togawa , Makoto Fukushima , Hozumi Yasuda
发明人： Osamu Nabeya , Tetsuji Togawa , Makoto Fukushima , Hozumi Yasuda
IPC分类号： B24B49/00 , B24B51/00 , B24B29/00 , B24B5/00
CPC分类号： B24B37/20 , B24B37/005 , B24B37/10 , B24B37/105 , B24B37/30 , B24B37/32 , B24B47/22 , B24B49/00 , B24B49/16
摘要： A polishing apparatus (1) has a polishing pad (22), a top ring (20) for holding a semiconductor wafer (W), a vertical movement mechanism (24) operable to move the top ring (20) in a vertical direction, a distance measuring sensor (46) operable to detect a position of the top ring (20) when a lower surface of the top ring (20) is brought into contact with the polishing pad (22), and a controller (47) operable to calculate an optimal position of the top ring (20) to polish the semiconductor wafer (W) based on the position detected by the distance measuring sensor (46). The vertical movement mechanism (24) includes a ball screw mechanism (30, 32, 38, 42) operable to move the top ring (20) to the optimal position.
摘要翻译：抛光装置（1）具有抛光垫（22），用于保持半导体晶片（W）的顶环（20），可垂直移动顶环（20）的垂直运动机构（24）当所述顶环（20）的下表面与所述抛光垫（22）接触时，所述距离测量传感器（46）可操作以检测所述顶环（20）的位置;以及控制器（47），其可操作以基于由距离测量传感器（46）检测到的位置，计算顶环（20）的最佳位置以对半导体晶片（W）进行抛光。垂直运动机构（24）包括可操作以将顶环（20）移动到最佳位置的滚珠丝杆机构（30,32,38,42）。

67. 发明申请

US20070232193A1 Substrate holding apparatus, polishing apparatus, and polishing method 有权
标题翻译：基板保持装置，抛光装置和抛光方法
公开(公告)号：US20070232193A1
公开(公告)日：2007-10-04
申请号：US11730142
申请日：2007-03-29
申请人： Hozumi Yasuda , Tetsuji Togawa , Osamu Nabeya , Kenichiro Saito , Makoto Fukushima , Tomoshi Inoue
发明人： Hozumi Yasuda , Tetsuji Togawa , Osamu Nabeya , Kenichiro Saito , Makoto Fukushima , Tomoshi Inoue
IPC分类号： B24B51/00
CPC分类号： B24B37/32
摘要： A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring comprises a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.
摘要翻译：基板保持装置防止基板滑出并允许基板被稳定地抛光。基板保持装置具有用于将基板保持并压靠在研磨面上的顶环体，以及用于按压研磨面的保持环，保持环设置在顶环体的外周部。保持环包括由磁性材料制成的第一构件和具有设置在其表面上的磁体的第二构件，该磁体保持抵靠第一构件。

68. 发明申请

US20070212988A1 Polishing apparatus 审中-公开
标题翻译：抛光设备
公开(公告)号：US20070212988A1
公开(公告)日：2007-09-13
申请号：US11797721
申请日：2007-05-07
申请人： Osamu Nabeya , Tetsuji Togawa
发明人： Osamu Nabeya , Tetsuji Togawa
IPC分类号： B24B29/00 , B24B5/00
CPC分类号： B24B37/32 , B24B49/16
摘要： A polishing apparatus has a polishing surface, a top ring for holding a semiconductor wafer, and a top ring shaft for pressing the top ring against the polishing surface. The top ring has a retainer ring for holding a peripheral portion of the semiconductor wafer, a housing substantially in a form of a disk which is connected to the top ring shaft, a sliding contact joint interconnecting the retainer ring and the housing in a state such that the retainer ring and the housing are brought into sliding contact with each other.
摘要翻译：抛光装置具有抛光面，用于保持半导体晶片的顶环和用于将顶环压靠在抛光表面上的顶环轴。顶环具有用于保持半导体晶片的周边部分的保持环，基本上为与顶环轴连接的圆盘形状的壳体，以及保持环和壳体的滑动接触接头，保持环和壳体彼此滑动接触。

69. 发明授权

US07156725B2 Substrate polishing machine 失效
标题翻译：基材抛光机
公开(公告)号：US07156725B2
公开(公告)日：2007-01-02
申请号：US10481591
申请日：2002-07-10
申请人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
发明人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
IPC分类号： B24B29/00 , B24B5/00
CPC分类号： B24B37/30 , B24B37/32
摘要： There is provided a substrate polishing machine which comprises a polishing surface and a substrate carrier for holding a substrate and bringing it into contact with the polishing surface. The substrate carrier comprises a carrier body, a substrate holding member for holding a substrate with a surface of the substrate to be polished being directed towards the polishing surface. The substrate holding member is mounted on the carrier body in such a manner that the substrate holding member is movable both towards and away from the polishing surface. The substrate polishing machine further comprises a substrate holding member positioning device provided on a side of the substrate holding member opposite to that used for holding the substrate. The substrate holding member positioning device has a flexible member which defines a chamber, and which, upon introduction of a non-compressible fluid, is expanded in a direction towards the polishing surface.
摘要翻译：提供了一种衬底抛光机，其包括抛光表面和用于保持衬底并使其与抛光表面接触的衬底载体。基板载体包括载体主体，用于保持待抛光基板的表面朝向抛光表面的基板的基板保持构件。衬底保持构件以使得衬底保持构件能够朝向和远离抛光表面移动的方式安装在载体主体上。基板研磨机还包括基板保持部件定位装置，该基板保持部件定位装置设置在基板保持部件的与保持基板相同的一侧。衬底保持构件定位装置具有限定腔室的柔性构件，并且在引入不可压缩流体时沿朝向抛光表面的方向膨胀。

70. 发明申请

US20060270323A1 Polishing apparatus 有权
公开(公告)号：US20060270323A1
公开(公告)日：2006-11-30
申请号：US11499784
申请日：2006-08-07
申请人： Tetsuji Togawa
发明人： Tetsuji Togawa
IPC分类号： B24B49/00 , B24B21/18
CPC分类号： B24B37/30 , B24B47/06 , B24B49/16 , B24B53/017
摘要： A polishing apparatus for polishing a substrate comprises a polishing table having a polishing surface, and a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against the polishing surface. The substrate holding apparatus comprises a vertically movable top ring body for holding a substrate, and a fluid supply source for supplying a fluid under a positive pressure or a negative pressure to a hermetically sealed chamber which is defined in the top ring body so as to control pressure under which the substrate is pressed against the polishing surface. The substrate holding apparatus further comprises a measuring device disposed in a fluid passage interconnecting the hermetically sealed chamber and the fluid supply source for measuring a flow rate of the fluid in the fluid passage.

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