会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 62. 发明申请
    • Surrounded-channel transistors with directionally etched gate or insulator formation regions and methods of fabrication therefor
    • 具有定向蚀刻的栅极或绝缘体形成区域的周围通道晶体管及其制造方法
    • US20050224889A1
    • 2005-10-13
    • US11095969
    • 2005-03-31
    • Chang-Woo OhDong-Gun ParkDong-Won KimSung-Young Lee
    • Chang-Woo OhDong-Gun ParkDong-Won KimSung-Young Lee
    • H01L21/336H01L29/423H01L29/76H01L29/786
    • H01L29/785H01L29/42384H01L29/42392H01L29/66545H01L29/66795H01L29/78645Y10S438/924
    • An elongate stacked semiconductor structure is formed on a substrate. The stacked semiconductor structure includes a second semiconductor material region disposed on a first semiconductor material region. The first semiconductor material region is selectively doped to produce spaced-apart impurity-doped first semiconductor material regions and a lower dopant concentration first semiconductor material region therebetween. Etching exposes a portion of the second semiconductor material region between the impurity-doped first semiconductor material regions. The etching removes at least a portion of the lower dopant concentration first semiconductor material region to form a hollow between the substrate and the portion of the second semiconductor material region between the impurity-doped first semiconductor material regions. An insulation layer that surrounds the exposed portion of the second semiconductor material region between the impurity-doped first semiconductor material regions is formed. The hollow may be filled with a gate electrode that completely surrounds the exposed portion of the second semiconductor material region, or the gate electrode may partially surround the exposed portion of the second semiconductor material region and an insulation region may be formed in the hollow.
    • 在衬底上形成细长的堆叠半导体结构。 层叠的半导体结构包括设置在第一半导体材料区域上的第二半导体材料区域。 第一半导体材料区域被选择性地掺杂以产生间隔杂质掺杂的第一半导体材料区域和其间的较低掺杂浓度的第一半导体材料区域。 蚀刻使杂质掺杂的第一半导体材料区域之间的第二半导体材料区域的一部分暴露。 蚀刻去除下掺杂剂浓度的第一半导体材料区域的至少一部分,以在衬底与掺杂杂质的第一半导体材料区域之间的第二半导体材料区域的部分之间形成中空。 形成了在杂质掺杂的第一半导体材料区域之间围绕第二半导体材料区域的暴露部分的绝缘层。 中空部可以填充有完全围绕第二半导体材料区域的暴露部分的栅电极,或者栅电极可以部分地围绕第二半导体材料区域的暴露部分,并且可以在中空部中形成绝缘区域。
    • 65. 发明授权
    • Methods of fabricating surrounded-channel transistors with directionally etched gate or insulator formation regions
    • 用定向蚀刻的栅极或绝缘体形成区域制造环绕晶体管的方法
    • US07396726B2
    • 2008-07-08
    • US11095969
    • 2005-03-31
    • Chang-Woo OhDong-Gun ParkDong-Won KimSung-Young Lee
    • Chang-Woo OhDong-Gun ParkDong-Won KimSung-Young Lee
    • H01L21/336
    • H01L29/785H01L29/42384H01L29/42392H01L29/66545H01L29/66795H01L29/78645Y10S438/924
    • An elongate stacked semiconductor structure is formed on a substrate. The stacked semiconductor structure includes a second semiconductor material region disposed on a first semiconductor material region. The first semiconductor material region is selectively doped to produce spaced-apart impurity-doped first semiconductor material regions and a lower dopant concentration first semiconductor material region therebetween. Etching exposes a portion of the second semiconductor material region between the impurity-doped first semiconductor material regions. The etching removes at least a portion of the lower dopant concentration first semiconductor material region to form a hollow between the substrate and the portion of the second semiconductor material region between the impurity-doped first semiconductor material regions. An insulation layer that surrounds the exposed portion of the second semiconductor material region between the impurity-doped first semiconductor material regions is formed. The hollow may be filled with a gate electrode that completely surrounds the exposed portion of the second semiconductor material region, or the gate electrode may partially surround the exposed portion of the second semiconductor material region and an insulation region may be formed in the hollow.
    • 在衬底上形成细长的堆叠半导体结构。 层叠的半导体结构包括设置在第一半导体材料区域上的第二半导体材料区域。 第一半导体材料区域被选择性地掺杂以产生间隔杂质掺杂的第一半导体材料区域和其间的较低掺杂浓度的第一半导体材料区域。 蚀刻使杂质掺杂的第一半导体材料区域之间的第二半导体材料区域的一部分暴露。 蚀刻去除下掺杂剂浓度的第一半导体材料区域的至少一部分,以在衬底与掺杂杂质的第一半导体材料区域之间的第二半导体材料区域的部分之间形成中空。 形成了在杂质掺杂的第一半导体材料区域之间围绕第二半导体材料区域的暴露部分的绝缘层。 中空部可以填充有完全围绕第二半导体材料区域的暴露部分的栅电极,或者栅电极可以部分地围绕第二半导体材料区域的暴露部分,并且可以在中空部中形成绝缘区域。