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    • 62. 发明授权
    • Non-volatile semiconductor memory device
    • 非易失性半导体存储器件
    • US06255690B1
    • 2001-07-03
    • US09282204
    • 1999-03-31
    • Kazuhiro KomoriToshiaki NishimotoSatoshi MeguroHitoshi KumeYoshiaki Kamigaki
    • Kazuhiro KomoriToshiaki NishimotoSatoshi MeguroHitoshi KumeYoshiaki Kamigaki
    • H01L29788
    • H01L27/105G11C16/0416H01L27/0688H01L27/1052H01L27/11526H01L27/11546H01L29/66659H01L29/7835H01L29/7885H01L29/7886
    • A semiconductor memory device having nonvolatile memory cells of a single-element type. The nonvolatile memory cells have a floating gate electrode insulatedly on a main surface of a semiconductor substrate and a control gate electrode on the floating gate via a second gate insulating film. An impurity, for example, arsenic, is introduced in self-alignment with the pair of opposing end sides of the control gate electrode to form both the first and second semiconductor regions but, however, a lower dose of arsenic is introduced in the formation of the second semiconductor region. In accordance with the scheme, the first semiconductor region is formed to have a junction depth greater than the junction depth associated with the second semiconductor region and both the first and second semiconductor regions have portions thereof extending under the floating gate electrode. Moreover, carriers which are stored in the floating gate electrode are transferred therefrom to the first semiconductor region by tunneling through the insulating film beneath the floating gate electrode.
    • 一种具有单一元件类型的非易失性存储单元的半导体存储器件。 非易失性存储单元通过第二栅极绝缘膜,在半导体衬底的主表面和浮动栅极上的控制栅电极上绝缘地具有浮栅电极。 引入与控制栅电极的一对相对端侧自对准的杂质,以形成第一和第二半导体区域,然而,较低剂量的砷被引入到 第二半导体区域。 根据该方案,第一半导体区域形成为具有大于与第二半导体区域相关联的结深度的结深度,并且第一和第二半导体区域都具有在浮置栅极下方延伸的部分。 此外,存储在浮栅电极中的载流子通过隧穿穿过浮置栅电极下方的绝缘膜而从其转移到第一半导体区域。
    • 64. 发明授权
    • Nonvolatile semiconductor memory device
    • 非易失性半导体存储器件
    • US6157576A
    • 2000-12-05
    • US393301
    • 1999-09-10
    • Koichi SekiTakeshi WadaTadashi MutoKazuyoshi ShojiYasurou KubotaHitoshi Kume
    • Koichi SekiTakeshi WadaTadashi MutoKazuyoshi ShojiYasurou KubotaHitoshi Kume
    • G11C16/12G11C16/16G11C16/30G11C16/32G11C16/34G11C16/04
    • G11C16/3445G11C16/06G11C16/12G11C16/16G11C16/30G11C16/32G11C16/344G11C2216/20
    • Within an EEPROM having a memory array in which the electrically erasable nonvolatile storage elements are arranged in a matrix form, an erasing control circuit is included, which performs at least the read out operation one time on the corresponding memory cells after an erasing operation is performed in connection therewith in accordance with externally supplied erasing operation instructions. The erasing operation is automatically performed by the internal erasing control circuit while the EEPROM is electrically isolated from the microprocessor in response to instructions from the microprocessor. The control by the microprocessor requires only a slightly short period of time during which the erasing commencement is instructed while the EEPROM remains in the system during the erasing operation. In one aspect of the present invention, a Vcc power source is applied to a source region or a drain region of each nonvolatile semiconductor memory cell, and an erasure voltage having a polarity opposite to that of the Vcc power source is applied to a control gate electrode. The erasure voltage is supplied to a voltage conversion circuit provided within the nonvolatile memory device. Accordingly, erasure operation can be realized by the Vcc single power source. Further, substantial terminals of the collective erasure operation are individually controlled for every memory element or every collective memory element in response to the individual erasure speed of each memory element.
    • 在具有其中电可擦除非易失性存储元件以矩阵形式布置的存储器阵列的EEPROM中,包括擦除控制电路,其在执行擦除操作之后在对应的存储器单元上至少执行一次读出操作 根据外部提供的擦除操作指令。 擦除操作由内部擦除控制电路自动执行,同时响应于来自微处理器的指令,EEPROM与微处理器电隔离。 微处理器的控制只需要稍微短的时间段,在擦除操作期间EEPROM保留在系统中时,指令擦除开始。 在本发明的一个方面中,将Vcc电源施加到每个非易失性半导体存储单元的源极区域或漏极区域,并且将具有与Vcc电源的极性相反的极性的擦除电压施加到控制栅极 电极。 擦除电压被提供给设置在非易失性存储器件内的电压转换电路。 因此,可以通过Vcc单电源实现擦除操作。 此外,响应于每个存储元件的单独擦除速度,对于每个存储元件或每个集合存储元件单独控制集体擦除操作的实质端子。
    • 66. 发明授权
    • Nonvolatile semiconductor memory device
    • 非易失性半导体存储器件
    • US5932909A
    • 1999-08-03
    • US851536
    • 1997-05-05
    • Masataka KatoTetsuo AdachiHitoshi KumeShoji Shukuri
    • Masataka KatoTetsuo AdachiHitoshi KumeShoji Shukuri
    • H01L21/8247H01L27/115H01L29/788H01L29/792
    • H01L27/11521Y10S257/90
    • A method of manufacturing a nonvolatile semiconductor memory device which is protected against deterioration in the electron injection/discharge characteristics between a floating gate of a memory cell and a channel. Three layers including a gate oxide film, a first polysilicon layer and a first nitride film are sequentially deposited on a silicon substrate surface and patterned with stripe-like columnwise lines. A second nitride film is formed on side walls of the columnwise lines, respectively. An element isolating insulation film is formed on the silicon substrate surface which is not covered with the first and second nitride films. After removal of the first and second nitride films, a first insulation film is formed on the side walls of the first polysilicon layer. Subsequently, at least two layers including a second insulation film and a second polysilicon layer are deposited and a pattern of rowwise lines extending orthogonally to the columnwise lines are formed by processing correspondingly the second polysilicon layer. Even after formation of the element isolating insulation film, thickening of the gate oxide film at distal portions thereof can be suppressed, whereby variations and deterioration in the characteristic of electron injection based on hot electron and tunnel phenomena can be minimized.
    • 一种制造非易失性半导体存储器件的方法,其被保护以防止存储单元的浮置栅极和沟道之间的电子注入/放电特性的劣化。 在硅衬底表面上依次沉积包括栅极氧化膜,第一多晶硅层和第一氮化物膜的三个层,并用条纹状的列线进行图案化。 分别在柱状线的侧壁上形成第二氮化物膜。 在未被第一和第二氮化物膜覆盖的硅衬底表面上形成元件隔离绝缘膜。 在去除第一和第二氮化物膜之后,在第一多晶硅层的侧壁上形成第一绝缘膜。 随后,沉积包括第二绝缘膜和第二多晶硅层的至少两层,并且通过相应地处理第二多晶硅层来形成与柱状线垂直延伸的横线的图案。 即使在形成元件隔离绝缘膜之后,也可以抑制其远端部分的栅极氧化膜的增厚,从而可以使基于热电子和隧道现象的电子注入特性的变化和劣化最小化。
    • 68. 发明授权
    • Method of manufacturing a semiconductor integrated circuit device having
single-element type non-volatile memory elements
    • 制造具有单元型非易失性存储元件的半导体集成电路器件的方法
    • US5656522A
    • 1997-08-12
    • US451268
    • 1995-05-30
    • Kazuhiro KomoriToshiaki NishimotoSatoshi MeguroHitoshi KumeYoshiaki Kamigaki
    • Kazuhiro KomoriToshiaki NishimotoSatoshi MeguroHitoshi KumeYoshiaki Kamigaki
    • H01L21/8247H01L27/06H01L27/105H01L27/115H01L29/788H01L29/792
    • H01L27/105H01L27/1052H01L27/11526H01L27/11546H01L29/66659H01L29/7835H01L29/7885H01L29/7886G11C16/0416H01L27/0688
    • A method of manufacturing a semiconductor memory device having non-volatile memory elements or memory cells of a single-element type. The method provides for the formation of a floating gate electrode on a main surface of a semiconductor substrate and a control gate electrode on the floating gate electrode via a second gate insulating film. In accordance with the method, an impurity is introduced in self-alignment with one of a pair of opposing end portions of the control gate electrode to form a first semiconductor region, and on the second of the opposing end portions of the control gate electrode of the memory cell, the same impurity, for example, arsenic, but, however, of a lower dose is introduced in self-alignment to form a second semiconductor region. In accordance with the formation of the first semiconductor region, the impurity is selectively introduced into the substrate by using a mask layer which covers a portion of the main surface of the substrate where the second semiconductor region is to be formed. In accordance with such manufactured memory cells, carriers which are stored in the floating gate electrode are transferred therefrom to the first semiconductor region by tunneling through the insulating film underlying the floating gate electrode. The first semiconductor region is formed so as to extend in an overlapping relation with the floating gate electrode by a greater amount than that of the second semiconductor region.
    • 一种制造具有单一元件类型的非易失性存储元件或存储单元的半导体存储器件的方法。 该方法提供了通过第二栅极绝缘膜在半导体衬底的主表面上形成浮置栅电极和浮置栅电极上的控制栅电极。 根据该方法,与控制栅电极的一对相对端部之一自对准地引入杂质以形成第一半导体区域,并且在控制栅电极的相对端部的第二端部 存储单元,相同的杂质,例如砷,但是以较低剂量引入自对准以形成第二半导体区域。 根据第一半导体区域的形成,通过使用覆盖要形成第二半导体区域的基板的主表面的一部分的掩模层,将杂质选择性地引入到基板中。 根据这种制造的存储单元,通过隧穿穿过浮置栅电极下面的绝缘膜,将存储在浮栅中的载流子从其转移到第一半导体区。 第一半导体区域形成为与浮置栅电极重叠地延伸比第二半导体区域大的量。