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    • 61. 发明授权
    • Semicondutor device
    • 半导体器件
    • US08896026B2
    • 2014-11-25
    • US13137311
    • 2011-08-04
    • Woo Chul JeonKi Yeol ParkYoung Hwan Park
    • Woo Chul JeonKi Yeol ParkYoung Hwan Park
    • H01L31/072H01L31/109
    • H01L29/7787H01L29/2003H01L29/402H01L29/42368H01L29/42376H01L29/475H01L29/66462
    • Provided is a nitride semiconductor device including: a nitride semiconductor layer over a substrate wherein the nitride semiconductor has a two-dimensional electron gas (2DEG) channel inside; a drain electrode in ohmic contact with the nitride semiconductor layer; a source electrode in Schottky contact with the nitride semiconductor layer wherein the source electrode is spaced apart from the drain electrode; a dielectric layer formed on the nitride semiconductor layer between the drain electrode and the source electrode and on at least a portion of the source electrode; and a gate electrode disposed on the dielectric layer to be spaced apart from the drain electrode, wherein a portion of the gate electrode is formed over a drain-side edge portion of the source electrode with the dielectric layer interposed therebetween, and a manufacturing method thereof.
    • 提供一种氮化物半导体器件,其包括:氮化物半导体层,其在氮化物半导体内部具有二维电子气体(2DEG)通道的衬底上; 与氮化物半导体层欧姆接触的漏电极; 与氮化物半导体层肖特基接触的源电极,其中源电极与漏电极间隔开; 形成在所述氮化物半导体层上的所述漏电极和所述源电极之间以及所述源电极的至少一部分上的电介质层; 以及设置在所述电介质层上以与所述漏极间隔开的栅电极,其中所述栅电极的一部分形成在所述源电极的漏极侧边缘部分之间,并且介电层插入其间;以及其制造方法 。
    • 62. 发明授权
    • Nitride based semiconductor device and manufacturing method thereof
    • 氮化物基半导体器件及其制造方法
    • US08841704B2
    • 2014-09-23
    • US13406123
    • 2012-02-27
    • Young Hwan ParkWoo Chul JeonKi Yeol ParkSeok Yoon Hong
    • Young Hwan ParkWoo Chul JeonKi Yeol ParkSeok Yoon Hong
    • H01L29/66
    • H01L29/66462H01L29/2003H01L29/7787
    • Disclosed herein is a nitride based semiconductor device, including: a substrate; a nitride based semiconductor layer having a lower nitride based semiconductor layer and an upper nitride based semiconductor layer on the substrate; an isolation area including an interface between the lower nitride based semiconductor layer and the upper nitride based semiconductor layer; and drain electrodes, source electrode, and gate electrodes formed on the upper nitride based semiconductor layer. According to preferred embodiments of the present invention, in the nitride based semiconductor device, by using the isolation area including the interface between the lower nitride based semiconductor layer and the upper nitride based semiconductor layer, problems of parasitic capacitance and leakage current are solved, and as a result, a switching speed can be improved through a gate pad.
    • 本文公开了一种氮化物基半导体器件,包括:衬底; 在衬底上具有下氮化物基半导体层和上部氮化物基半导体层的氮化物基半导体层; 隔离区域,包括下部氮化物基半导体层和上部氮化物基半导体层之间的界面; 以及形成在上部氮化物基半导体层上的漏电极,源电极和栅电极。 根据本发明的优选实施例,在基于氮化物的半导体器件中,通过使用包括下部氮化物基半导体层和上部氮化物类半导体层之间的界面的隔离区域,解决寄生电容和漏电流的问题, 结果,可以通过栅极焊盘改善切换速度。
    • 63. 发明授权
    • Nitride semiconductor device
    • 氮化物半导体器件
    • US08716754B2
    • 2014-05-06
    • US13429148
    • 2012-03-23
    • Young Hwan ParkWoo Chul JeonKi Yeol ParkSeok Yoon Hong
    • Young Hwan ParkWoo Chul JeonKi Yeol ParkSeok Yoon Hong
    • H01L31/072
    • H01L29/42316H01L29/1066H01L29/2003H01L29/66462H01L29/7787
    • The present invention relates to a nitride semiconductor device One aspect of the present invention provides a nitride semiconductor device including: a nitride semiconductor layer having a 2DEG channel; a source electrode in ohmic contact with the nitride semiconductor layer; a drain electrode in ohmic contact with the nitride semiconductor layer; a p-type nitride layer formed on the nitride semiconductor layer between the source and drain electrodes; an n-type nitride layer formed on the p-type nitride layer; and a gate electrode formed between the source and drain electrodes to be close to the source electrode and in contact with the n-type nitride layer so that a source-side sidewall thereof is aligned with source-side sidewalls of the p-type and n-type nitride layers.
    • 本发明涉及氮化物半导体器件本发明的一个方面提供一种氮化物半导体器件,其包括:具有2DEG通道的氮化物半导体层; 与氮化物半导体层欧姆接触的源电极; 与氮化物半导体层欧姆接触的漏电极; 形成在所述源极和漏极之间的所述氮化物半导体层上的p型氮化物层; 形成在p型氮化物层上的n型氮化物层; 以及形成在源电极和漏电极之间的栅电极,以接近源电极并与n型氮化物层接触,使得源侧侧壁与p型和n型源极侧的侧壁对准 型氮化物层。
    • 68. 发明授权
    • Nitride semiconductor device having a two-dimensional electron gas (2DEG) channel
    • 具有二维电子气(2DEG)通道的氮化物半导体器件
    • US08384130B2
    • 2013-02-26
    • US13137291
    • 2011-08-03
    • Woo Chul JeonKi Yeol ParkYoung Hwan Park
    • Woo Chul JeonKi Yeol ParkYoung Hwan Park
    • H01L29/739H01L31/0328H01L31/0336H01L31/072H01L31/109
    • H01L29/66431H01L29/2003H01L29/404H01L29/42316H01L29/66462H01L29/7787
    • Provided is a nitride semiconductor device including: a nitride semiconductor layer over a substrate wherein the nitride semiconductor has a two-dimensional electron gas (2DEG) channel inside; a drain electrode in ohmic contact with the nitride semiconductor layer; a source electrode spaced apart from the drain electrode, in Schottky contact with the nitride semiconductor layer, and having an ohmic pattern in ohmic contact with the nitride semiconductor layer inside; a dielectric layer formed on the nitride semiconductor layer between the drain electrode and the source electrode and on at least a portion of the source electrode; and a gate electrode disposed on the dielectric layer to be spaced apart from the drain electrode, wherein a portion of the gate electrode is formed over a drain-side edge portion of the source electrode with the dielectric layer interposed therebetween, and a manufacturing method thereof.
    • 提供一种氮化物半导体器件,其包括:氮化物半导体层,其在氮化物半导体内部具有二维电子气体(2DEG)通道的衬底上; 与氮化物半导体层欧姆接触的漏电极; 源极与漏极间隔开,与氮化物半导体层肖特基接触,并且具有与内部的氮化物半导体层欧姆接触的欧姆图案; 形成在所述氮化物半导体层上的所述漏电极和所述源电极之间以及所述源电极的至少一部分上的电介质层; 以及设置在所述电介质层上以与所述漏极间隔开的栅电极,其中所述栅电极的一部分形成在所述源电极的漏极侧边缘部分之间,并且介电层插入其间;以及其制造方法 。