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    • 62. 发明授权
    • Nonvolatile semiconductor memory device
    • 非易失性半导体存储器件
    • US08089818B2
    • 2012-01-03
    • US12580795
    • 2009-10-16
    • Hideo MukaiHiroshi MaejimaKatsuaki Isobe
    • Hideo MukaiHiroshi MaejimaKatsuaki Isobe
    • G11C7/10
    • G11C8/14G11C7/18G11C8/12G11C13/0004G11C13/0007G11C13/0011G11C13/0028G11C2213/31G11C2213/72
    • A nonvolatile-semiconductor-memory-device including a cell array having a plurality of MATs (unit-cell-array) disposed in a matrix, the MATs each include a plurality of first lines, a plurality of second lines crossing the first lines, and memory cells being connected between the first and second lines. The device further includes a first and second drive circuit selecting the first and second lines connected to the memory cells of each MAT that are accessed, and driving the selected first and second lines to write or read data. The memory cells form a page by being connected to each first line selected from the MATs. The device also includes a data latch latching the write or the read data in units of pages, where the first and second drive circuit drive the first and second lines multiple times to write or read data for one page in and out of the cell array.
    • 一种非易失性半导体存储器件,包括具有以矩阵形式设置的多个MAT(单位阵列)的单元阵列,所述MAT各包括多条第一线,与第一线交叉的多条第二线,以及 存储单元连接在第一和第二线之间。 该装置还包括第一和第二驱动电路,选择连接到每个MAT的存储器单元的第一和第二线,所述存储器单元被访问,并且驱动所选择的第一和第二行来写入或读取数据。 存储单元通过连接到从MAT中选择的每个第一行形成页面。 该设备还包括以页为单位锁存写入或读取数据的数据锁存器,其中第一和第二驱动电路多次驱动第一和第二行以写入或读取单元阵列中的一页的数据。
    • 63. 发明申请
    • NONVOLATILE SEMICONDUCTOR STORAGE DEVICE AND DATA WRITING METHOD THEREFOR
    • 非易失性半导体存储器件及其数据写入方法
    • US20110128775A1
    • 2011-06-02
    • US13024926
    • 2011-02-10
    • Hiroshi MAEJIMAKatsuaki IsobeHideo Mukai
    • Hiroshi MAEJIMAKatsuaki IsobeHideo Mukai
    • G11C11/00
    • G11C13/0007G11C7/00G11C13/0004G11C13/0011G11C13/0064G11C13/0069G11C2013/009G11C2213/31G11C2213/56G11C2213/71G11C2213/72
    • A nonvolatile semiconductor storage device comprises: a first wire and a second wire intersecting each other; a memory cell which is disposed at each intersection of the first wire and the second wire and electrically rewritable and in which a variable resistor for memorizing a resistance value as data in a nonvolatile manner and a rectifying device are connected in series; and a control circuit which applies a voltage necessary for writing of data to the first and second wires. The control circuit precharges a non-selected second wire up to a standby voltage larger than a reference voltage prior to a set operation for programming only a variable resistor connected to selected first and second wires by supplying the reference voltage to a non-selected first wire and the selected second wire, applying a program voltage necessary for programming of the selected variable resistor based on the reference voltage to the selected first wire and applying a control voltage which prevents the rectifying device from turning ON based on the program voltage to the non-selected second wire.
    • 非易失性半导体存储装置包括:第一线和彼此交叉的第二线; 存储单元,其配置在所述第一配线和所述第二配线的各交叉点并且是电可重写的,并且其中存储用作非易失性数据的电阻值的可变电阻器和整流装置串联连接; 以及控制电路,其向第一和第二导线施加写入数据所需的电压。 控制电路在设置操作之前将未选择的第二线预充电到大于参考电压的待机电压,以仅通过将参考电压提供给未选择的第一线来仅编程连接到所选择的第一和第二线的可变电阻器 和所选择的第二线路,基于参考电压将所选择的可变电阻器编程所需的编程电压施加到所选择的第一线路,并施加防止整流装置导通的控制电压, 选择第二根线。
    • 65. 发明授权
    • Voltage generation circuit and semiconductor memory device including the same
    • 电压产生电路和包括其的半导体存储器件
    • US07656225B2
    • 2010-02-02
    • US11739397
    • 2007-04-24
    • Katsuaki IsobeNoboru Shibata
    • Katsuaki IsobeNoboru Shibata
    • G05F1/10G05F3/02
    • G11C7/14G11C5/147
    • A voltage generation circuit comprises a reference voltage generation circuit; a differential amplifier; an output node; a P-channel MOS transistor; a first resistor series; a second resistor series; a third resistor series; and a selection control circuit. A reference voltage generated by the reference voltage generation circuit is input to a first input terminal of the differential amplifier. The first resistor series is connected between a drain of the P-channel MOS transistor and the output node. The second resistor series is connected between the output node and a second input terminal of the differential amplifier. The third resistor array is connected between the second input terminal of the differential amplifier and a ground. The selection control circuit controls such that a sum of the resistances of the first resistor series and the second resistor series is constant.
    • 电压产生电路包括参考电压产生电路; 差分放大器; 输出节点; P沟道MOS晶体管; 第一个电阻器系列; 第二个电阻器系列; 第三电阻器系列; 和选择控制电路。 由参考电压产生电路产生的参考电压被输入到差分放大器的第一输入端。 第一个电阻器系列连接在P沟道MOS晶体管的漏极和输出节点之间。 第二电阻器系列连接在差分放大器的输出节点和第二输入端子之间。 第三电阻阵列连接在差分放大器的第二输入端和地之间。 选择控制电路控制使得第一电阻器系列和第二电阻器系列的电阻之和恒定。
    • 67. 发明申请
    • RESISTANCE CHANGE MEMORY DEVICE
    • 电阻变化存储器件
    • US20090174032A1
    • 2009-07-09
    • US12351212
    • 2009-01-09
    • Hiroshi MAEJIMAKatsuaki IsobeHideo Mukai
    • Hiroshi MAEJIMAKatsuaki IsobeHideo Mukai
    • H01L29/00
    • G11C13/00G11C13/0069G11C2013/0073G11C2213/71G11C2213/72H01L27/24
    • A resistance change memory device includes: a semiconductor substrate; a three dimensional cell array formed by a plurality of unit cell array blocks of two dimensional arrangement on the semiconductor substrate, the unit cell array block being formed by stacking a plurality of unit cell arrays including a first wiring, a second wiring crossing with the first wiring, and a variable resistance element connected at an intersection of the both wirings; a reading/writing/driving circuit formed on the semiconductor substrate under the three dimensional cell array; a first via region which is arranged in an end portion of the unit cell array block, and in which a via wiring for connecting the first wiring in each layer to the reading/writing/driving circuit is formed; and a second via region which is arranged in an end portion of the unit cell array block, and in which a via wiring for connecting the second wiring in each layer to the reading/writing/driving circuit is formed. When the first wiring is longer than the second wiring, the number of via arrangements in the first via region is set larger than that in the second via region.
    • 电阻变化存储器件包括:半导体衬底; 由半导体衬底上的二维排列的多个单元阵列块形成的三维单元阵列,所述单元阵列块通过堆叠多个单元阵列而形成,所述单位阵列包括第一布线,与所述第一布线交叉的第二布线 布线和连接在两条布线的交点处的可变电阻元件; 在三维单元阵列下形成在半导体衬底上的读/写/驱动电路; 布置在单元阵列块的端部中的第一通孔区域,其中形成用于将每层中的第一布线连接到读/写/驱动电路的通孔布线; 以及布置在单元阵列块的端部中的第二通孔区域,并且其中形成用于将每层中的第二布线连接到读/写/驱动电路的通孔布线。 当第一布线长于第二布线时,第一通孔区域中的通孔布置的数量被设置为大于第二通孔区域中的通孔布置的数量。
    • 69. 发明授权
    • Semiconductor storage device provided with memory cell having charge accumulation layer and control gate
    • 设置有具有电荷累积层和控制栅极的存储单元的半导体存储装置
    • US07505314B2
    • 2009-03-17
    • US11770199
    • 2007-06-28
    • Katsuaki IsobeNoboru Shibata
    • Katsuaki IsobeNoboru Shibata
    • G11C11/34
    • G11C16/0483G11C11/5628G11C11/5635G11C16/12G11C16/16G11C16/3418
    • A semiconductor memory device includes memory cell transistors, a first selection transistor, and word lines. Each of the memory cell transistors has a stacked gate including a charge accumulation layer and a control gate, and is configured to retain at least two levels of “0” data and “1” data according to a threshold voltage. The threshold voltage corresponding to the “0” data being the lowest threshold voltage in the levels retained by each of the memory cell transistors. The first selection transistor has a current path connected in series to one of the memory cell transistors. Each of the word lines is connected to the control gate of one of the memory cell transistors. upper limit values of threshold voltages of the memory cell transistors retaining the “0” data being different from one another in each word line.
    • 半导体存储器件包括存储单元晶体管,第一选择晶体管和字线。 每个存储单元晶体管具有包括电荷累积层和控制栅极的堆叠栅极,并且被配置为根据阈值电压保持至少两个级别的“0”数据和“1”数据。 对应于“0”数据的阈值电压是由每个存储单元晶体管保持的电平中的最低阈值电压。 第一选择晶体管具有与存储单元晶体管之一串联连接的电流通路。 每个字线连接到存储单元晶体管之一的控制栅极。 保持“0”数据的存储单元晶体管的阈值电压的上限值在每个字线中彼此不同。