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61. 发明申请

US20080100732A1 Optical device module, fabrication method thereof, optical device unit and fabrication method thereof 有权
标题翻译：光器件模块及其制造方法，光学元件单元及其制造方法
公开(公告)号：US20080100732A1
公开(公告)日：2008-05-01
申请号：US11798370
申请日：2007-05-14
申请人： Masanori Minamio , Yutaka Harada , Yoshiki Takayama , Toshiyuki Fukuda
发明人： Masanori Minamio , Yutaka Harada , Yoshiki Takayama , Toshiyuki Fukuda
IPC分类号： H04N5/335 , G06F19/00
CPC分类号： H04N5/2251 , H01L2924/0002 , H04N5/2257 , H05K1/189 , H05K2201/046 , H05K2201/10121 , H05K2201/10689 , H01L2924/00
摘要： One end of a flexible substrate is connected to a solid-state image sensing device and the other end constitutes an external connection part in which external lead-out electrodes are provided. A plurality of electronic components are mounted on a mounting part of the flexible substrate. The flexible substrate is bent at a first bent part thereof to make an acute angle with the solid-state image sensing device and also bent at a second bent part thereof to make an acute angle with the external connection part. The two acute angles are alternate angles and the solid-state image sensing device has a cross section of the letter Z.
摘要翻译：柔性基板的一端连接到固态图像感测装置，另一端构成外部引出电极的外部连接部。多个电子部件安装在柔性基板的安装部上。柔性基板在其第一弯曲部分处弯曲以与固态图像感测装置成锐角并且在其第二弯曲部分处弯曲以与外部连接部分成锐角。两个锐角是交替的角度，固态图像感测装置具有字母Z的横截面。

62. 发明申请

US20080083964A1 Semiconductor image sensor die and production method thereof, semiconductor image sensor module, image sensor device, optical device element, and optical device module 审中-公开
标题翻译：半导体图像传感器芯片及其制造方法，半导体图像传感器模块，图像传感器装置，光学元件元件和光学器件模块
公开(公告)号：US20080083964A1
公开(公告)日：2008-04-10
申请号：US11889675
申请日：2007-08-15
申请人： Hiroaki Fujimoto , Masanori Minamio , Toshiyuki Fukuda
发明人： Hiroaki Fujimoto , Masanori Minamio , Toshiyuki Fukuda
IPC分类号： H01L31/0232 , H01L21/71
CPC分类号： H01L27/14618 , H01L27/14625 , H01L31/0203 , H01L31/0232 , H01L2224/45124 , H01L2224/45144 , H01L2224/48465 , H01L2924/10252 , H01L2924/10253 , H01L2924/10272 , H01L2924/10329 , H01L2924/1033 , H01L2924/10335 , H01L2924/3025 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor image sensor die includes a substrate, an imaging area, a surrounding circuit area, a plurality of electrode portions, a translucent member, a transparent adhesive, and a bump. The imaging area, the surrounding circuit area, and the electrode portion are provided on an upper surface of the substrate. The surrounding circuit area is provided outside the imaging area. The electrode portion is provided outside the surrounding circuit area. The translucent member is adhered via the transparent adhesive to the imaging area, covering the imaging area. The bump is provided on a portion of the electrode portions. The surface of the bump includes an upper surface which is located higher than an upper surface of the transparent adhesive.
摘要翻译：半导体图像传感器芯片包括基板，成像区域，周围电路区域，多个电极部分，半透明构件，透明粘合剂和凸块。成像区域，周围电路区域和电极部分设置在基板的上表面上。周围的电路区域设置在成像区域的外部。电极部设置在周围电路区域的外侧。半透明构件通过透明粘合剂粘附到成像区域，覆盖成像区域。凸块设置在电极部分的一部分上。凸起的表面包括位于比透明粘合剂的上表面高的上表面。

63. 发明申请

US20070228502A1 Semiconductor imaging device and method for manufacturing the same 有权
标题翻译：半导体成像装置及其制造方法
公开(公告)号：US20070228502A1
公开(公告)日：2007-10-04
申请号：US11700124
申请日：2007-01-31
申请人： Masanori Minamio , Tomoko Komatsu , Toshiyuki Fukuda
发明人： Masanori Minamio , Tomoko Komatsu , Toshiyuki Fukuda
IPC分类号： H01L27/14
CPC分类号： H01L27/14618 , H01L24/73 , H01L27/14627 , H01L27/14683 , H01L27/14685 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/92247 , H01L2924/01019 , H01L2924/01079 , H01L2924/15153 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor imaging device includes: a semiconductor imaging element including an imaging region, a peripheral circuit region, and an electrode region, the imaging region including a plurality of micro lenses; a semiconductor package the semiconductor package in which a cavity for mounting the semiconductor imaging element is formed, the semiconductor package including a plurality of internal connection terminals formed inside the periphery of the cavity for being connected with a plurality of electrode terminals of the semiconductor imaging element and a plurality of external connection terminals connected with the internal connection terminals; a fixing member for fixing the semiconductor imaging element to the cavity; and an optical member fixed to the semiconductor package by a sealing member so as to cover the semiconductor imaging element arranged in the cavity. Wherein, a face obtained by connecting vertexes of the micro lenses is formed into a continuous concave curve.
摘要翻译：一种半导体成像装置，包括：具有成像区域，外围电路区域和电极区域的半导体摄像元件，所述摄像区域包括多个微透镜; 半导体封装，其中形成有用于安装半导体成像元件的空腔的半导体封装，所述半导体封装包括形成在所述腔的周围的多个内部连接端子，用于与所述半导体成像元件的多个电极端子连接以及与所述内部连接端子连接的多个外部连接端子; 用于将所述半导体成像元件固定到所述空腔的固定构件; 以及光学构件，其通过密封构件固定到所述半导体封装，以覆盖布置在所述空腔中的所述半导体成像元件。其中，将通过连接微透镜的顶点获得的面形成为连续凹曲线。

64. 发明授权

US07273765B2 Solid-state imaging device and method for producing the same 有权
标题翻译：固态成像装置及其制造方法
公开(公告)号：US07273765B2
公开(公告)日：2007-09-25
申请号：US10676186
申请日：2003-09-30
申请人： Masanori Minamio , Kouichi Yamauchi
发明人： Masanori Minamio , Kouichi Yamauchi
IPC分类号： H01L21/00
CPC分类号： H01L27/14618 , H01L24/97 , H01L27/14683 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/16195 , H01L2924/00014 , H01L2924/00
摘要： A solid-state imaging device includes: a planar substrate; an imaging element fixed onto the substrate; a rib provided on the substrate so as to surround the imaging element; a transparent plate fixed to a top face of the rib; a plurality of wirings for conducting electricity from inside of a package to outside of the same, the package being composed of the substrate, the rib and the transparent plate; and thin metal wires for connecting electrodes of the imaging element with the respective wirings. Each of the wirings includes: an internal electrode disposed on a surface with the imaging element mounted thereon; an external electrode disposed on a rear surface of the imaging-element mounted surface and at a position corresponding to the internal electrode and an end face electrode disposed on an end face of the substrate, for connecting the internal electrode and the external electrode. An end face of the substrate, a side face of the rib and an end face of the transparent plate form a substantially coplanar surface. The structure of the substrate having an external terminal is simple, thus facilitating the miniaturization of the device.
摘要翻译：固态成像装置包括：平面基板; 固定在基板上的成像元件; 设置在所述基板上以围绕所述成像元件的肋; 固定到所述肋的顶面的透明板; 多个用于从封装内部向外部引导电力的布线，所述封装由所述基板，所述肋和所述透明板构成; 以及用于将成像元件的电极与各个配线连接的细金属线。每个布线包括：设置在其上安装有成像元件的表面上的内部电极; 设置在所述摄像元件安装面的背面和与所述内部电极对应的位置的外部电极和设置在所述基板的端面上的端面电极，用于连接所述内部电极和所述外部电极。基板的端面，肋的侧面和透明板的端面形成基本上共面的表面。具有外部端子的衬底的结构简单，从而有助于器件的小型化。

65. 发明授权

US07265340B2 Optical device and method for fabricating the same 有权
标题翻译：光学装置及其制造方法
公开(公告)号：US07265340B2
公开(公告)日：2007-09-04
申请号：US11137549
申请日：2005-05-26
申请人： Masanori Minamio , Kiyokazu Itoi
发明人： Masanori Minamio , Kiyokazu Itoi
IPC分类号： H01L23/08
CPC分类号： H01S5/02208 , H01L2224/48091 , H01S5/0224 , H01L2924/00014
摘要： An optical device comprises a copper plate having an opening; a flexible board placed below the copper plate; a light receiving element substrate placed below the copper plate and mounted on a wiring pattern of the flexible board via bumps; a light emitting element and a light receiving element both provided at the principal surface of the light receiving element substrate; and a supporting frame supporting the flexile board in a downwardly posture. The supporting frame fixes the flexible board and the copper plate. Therefore, a thin optical device can be realized without employing a resin mold structure.
摘要翻译：光学装置包括具有开口的铜板; 放置在铜板下面的柔性板; 光接收元件基板，设置在铜板的下方，通过凸块安装在柔性基板的布线图案上; 在所述受光元件基板的主面设置有发光元件和受光元件，以及以向下姿势支撑柔性板的支撑框架。支撑框架固定了柔性板和铜板。因此，可以在不使用树脂模具结构的情况下实现薄的光学装置。

66. 发明申请

US20070019101A1 Optical device, optical device apparatus, camera module, and optical device manufacturing method 有权
标题翻译：光学装置，光学装置装置，相机模块和光学装置的制造方法
公开(公告)号：US20070019101A1
公开(公告)日：2007-01-25
申请号：US11490232
申请日：2006-07-21
申请人： Masanori Minamio , Yutaka Harada , Toshiyuki Fukuda
发明人： Masanori Minamio , Yutaka Harada , Toshiyuki Fukuda
IPC分类号： G02B13/16
CPC分类号： H01L27/14632 , G02B3/0006 , G02B3/0056 , H01L27/14618 , H01L27/14625 , H01L27/14685 , H01L27/14687 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： An optical device includes an optical element, a transparent member arranged on the optical element, and a transparent resin adhesive for causing the transparent member to adhere and be fixed onto a circuit formation face of the optical element. The optical device includes a light detecting region having a plurality of micro lenses, a peripheral circuit region formed in the outer peripheral part of the light detecting region, and an electrode region formed at the outer peripheral part of the peripheral circuit region. A roughed region in a saw-toothed shape in section is formed in part of a face of the transparent member which adheres to the optical element, the part being overlapped with the outer peripheral part of the light detecting region as viewed in plan.
摘要翻译：光学装置包括光学元件，布置在光学元件上的透明构件和用于使透明构件粘附并固定到光学元件的电路形成面上的透明树脂粘合剂。光学装置包括具有多个微透镜的光检测区域，形成在光检测区域的外周部分中的外围电路区域和形成在外围电路区域的外周部分处的电极区域。如图所示，锯齿状形状的粗糙区域形成在粘附于光学元件的透明构件的表面的一部分中，该部分与光检测区域的外周部分重叠。

67. 发明授权

US07154156B2 Solid-state imaging device and method for producing the same 有权
标题翻译：固态成像装置及其制造方法
公开(公告)号：US07154156B2
公开(公告)日：2006-12-26
申请号：US10676135
申请日：2003-09-30
申请人： Masanori Minamio , Mutsuo Tsuji , Kouichi Yamauchi
发明人： Masanori Minamio , Mutsuo Tsuji , Kouichi Yamauchi
IPC分类号： H01L27/14 , H01L31/00
CPC分类号： H01L27/14618 , H01L2224/16225 , H01L2924/00014 , Y10T29/49121 , Y10T29/49158 , Y10T29/49167 , Y10T29/49176 , Y10T29/49204 , Y10T29/4922 , H01L2224/0401
摘要： A solid-state imaging device includes: a base made of an insulation material and having a frame form in planar shape with an aperture formed at an inner region; a plurality of wirings provided on one surface of the base and extending toward an outer periphery of the base from a region along the aperture; and an imaging element mounted on the surface of the base with wirings provided thereon so that a light-receptive region of the imaging element faces the aperture. An end portion on the aperture side of each of the plurality of wirings forms an internal terminal portion and an end portion on the outer peripheral side of each of the plurality of wirings forms an external terminal portion, the internal terminal portion of the wiring being connected electrically with an electrode of the imaging element. The wirings are made of thin metal plate leads, the base is made up of a resin molded member in which the thin metal plate leads are embedded, and at least a part of a side edge face of the thin metal plate leads is embedded in the base. The rigidity of the base is enhanced by the thin metal plate leads, thus reducing a curl and a warp of the base.
摘要翻译：一种固态成像装置，包括：由绝缘材料制成的底座，具有平面形状的框架形状，其内部形成有孔; 多个布线设置在基座的一个表面上，并沿着孔径从基座的外周延伸; 以及安装在基座表面上的成像元件，其上设置有布线，使得成像元件的光接收区域面向孔。多个布线中的每一个的开口侧的端部形成内部端子部，多个布线的外周侧的端部形成外部端子部，布线的内部端子部分被连接与成像元件的电极电连接。所述布线由薄金属板引线构成，所述基座由嵌入所述薄金属板引线的树脂模制构件构成，并且所述薄金属板引线的侧边缘的至少一部分嵌入所述基础。通过薄金属板引线增强基座的刚性，从而减小基部的卷曲和翘曲。

68. 发明申请

US20050168845A1 Optical device 有权
标题翻译：光学装置
公开(公告)号：US20050168845A1
公开(公告)日：2005-08-04
申请号：US10962594
申请日：2004-10-13
申请人： Masanori Minamio , Hikaru Sano , Kenji Furumoto
发明人： Masanori Minamio , Hikaru Sano , Kenji Furumoto
IPC分类号： G02B5/32 , H01L23/02 , H01L27/14 , H01L27/146 , H01L31/02 , H01L31/0203 , H04N5/335 , H04N5/372 , G02B7/02
CPC分类号： H01L27/14618 , H01L31/0203 , H01L2224/16
摘要： An optical device includes a base of ring shape, and a light emitting/receiving element and a transparent plate both attached to the base. A side face of the opening of the base is formed to have a taper serving as a draft for a molding resin. A side surface of the transparent plate is formed to have a taper widened upwardly and corresponding to the draft. These side face and surface engage each other with an adhesive layer interposed therebetween. A hologram may be mounted instead of the transparent plate.
摘要翻译：光学装置包括环形基座，以及连接到基座的发光/接收元件和透明板。基座的开口的侧面形成为具有用于模塑树脂的牵伸的锥形。透明板的侧表面形成为具有向上加宽并对应于牵伸的锥形。这些侧面和表面之间夹有粘合剂层彼此接合。可以安装全息图而不是透明板。

69. 发明申请

US20050167855A1 Resin-encapsulation semiconductor device and method for fabricating the same 有权
标题翻译：树脂封装半导体器件及其制造方法
公开(公告)号：US20050167855A1
公开(公告)日：2005-08-04
申请号：US11090011
申请日：2005-03-28
申请人： Masanori Minamio , Toru Nomura
发明人： Masanori Minamio , Toru Nomura
IPC分类号： H01L23/28 , H01L23/31 , H01L23/495 , H01L23/50 , H01L21/44
CPC分类号： H01L23/3107 , H01L23/49503 , H01L23/49548 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/32014 , H01L2224/32055 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/181 , H01L2224/85 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： A resin-encapsulation semiconductor device of this invention includes a die pad for mounting a semiconductor element; a plurality of supporting leads; a semiconductor element; a plurality of leads disposed to have tips thereof opposing the die pad; metal wires; and an encapsulation resin for encapsulating the die pad excluding a bottom thereof, the leads excluding bottoms and outside edges thereof, connecting regions with the metal wires, the supporting leads and the semiconductor element. The outside edges of the leads are disposed on substantially the same plane as the side face of the encapsulation resin, and the tip of each lead has a thin portion where the thickness is reduced in an upper face thereof.
摘要翻译：本发明的树脂封装半导体器件包括用于安装半导体元件的管芯焊盘; 多个支撑引线; 半导体元件多个引线，其设置成具有与所述管芯焊盘相对的尖端; 金属线; 以及用于封装除了底部之外的芯片焊盘的封装树脂，不包括底部和外部边缘的引线，与金属线，支撑引线和半导体元件的连接区域。引线的外缘设置在与封装树脂的侧面基本相同的平面上，并且每个引线的尖端具有其上部厚度减小的薄部分。

70. 发明申请

US20050151242A1 Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：US20050151242A1
公开(公告)日：2005-07-14
申请号：US11029785
申请日：2005-01-05
申请人： Haruto Nagata , Masanori Minamio , Hiroshi Horiki
发明人： Haruto Nagata , Masanori Minamio , Hiroshi Horiki
IPC分类号： H01L23/50 , H01L23/10 , H01L23/12 , H01L23/28 , H01L23/31 , H01L23/34 , H01L23/433 , H01L23/495
CPC分类号： H01L23/49503 , H01L23/3107 , H01L23/4334 , H01L24/48 , H01L2224/32014 , H01L2224/32055 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01019 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor chip is mounted on an upper surface of the heat sink plate that is provided with a plurality of heat releasing terminals on a lower surface of the heat releasing. A plurality of electric signal terminals are regularly disposed in a lattice-like manner around the heat sink plate. Lower end surfaces of the electric signal terminals and the heat releasing terminals are exposed from and sealed with a sealing resin. The heat sink plate is formed as an integrated body including a protruding portion that protrudes from a central portion of an upper surface and supports the semiconductor chip, a plurality of supporting portions that are positioned around a rear surface of the protruding portion so as to support the protruding portion and that are exposed at a rear surface of the sealing resin, the plurality of heat releasing terminals, and a thin-walled portion that is recessed from lower end surfaces of the supporting portions and the heat releasing terminals. Lower surfaces of the protruding portion and the thin-walled portion are covered with the sealing resin. The plurality of supporting portions are disposed so that they are continuous with the protruding portion and symmetrical to each other around the protruding portion. A degree of freedom is improved in board wiring below the heat sink plate in a land grid array type package.
摘要翻译：半导体芯片安装在散热板的上表面上，在散热板的下表面上设置有多个散热端子。多个电信号端子以格子状规则地布置在散热板周围。电信号端子和散热端子的下端面由密封树脂露出并密封。散热板形成为一体，该突出部具有从上表面的中央部突出并支撑半导体芯片的突出部，多个支撑部，其位于突出部的后表面周围，以支撑突出部分暴露在密封树脂的后表面，多个散热端子以及从支撑部分和散热端子的下端表面凹入的薄壁部分。突出部分和薄壁部分的下表面被密封树脂覆盖。多个支撑部分被布置成使得它们与突出部分连续并且围绕突出部分彼此对称。在平台栅格阵列型封装中的散热板下面的板布线中的自由度得到改善。

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