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61. 外观设计

USD1044455S1 Arrow shaft grinder 有权
公开(公告)号：USD1044455S1
公开(公告)日：2024-10-01
申请号：US29881307
申请日：2022-12-29
申请人： Young Ki Lee
设计人： Young Ki Lee
摘要： FIG. 1 is a perspective view of an arrow shaft grinder embodying my new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a left side elevation view thereof;
FIG. 5 is a right side elevation view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a top and front perspective view thereof in a state of use; and, FIG. 9 is a bottom and front perspective view thereof in a state of use.
The broken lines in FIGS. 8 and 9 represent the environment only and form no part of the claimed design.

62. 外观设计

USD852499S1 Arrowhead case 有权
公开(公告)号：USD852499S1
公开(公告)日：2019-07-02
申请号：US29582757
申请日：2016-10-31
申请人： Young Ki Lee
设计人： Young Ki Lee
摘要： FIG. 1 is a top and front perspective view of an arrowhead case, showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is perspective view thereof, shown in an opened configuration; and,
FIG. 9 is a bottom perspective view of the arrowhead case.

63. 发明授权

US09231167B2 Insulation structure for high temperature conditions and manufacturing method thereof 有权
标题翻译：高温条件的绝缘结构及其制造方法
公开(公告)号：US09231167B2
公开(公告)日：2016-01-05
申请号：US14555186
申请日：2014-11-26
申请人： Young Ki Lee , Seog Moon Choi , Sang Hyun Shin
发明人： Young Ki Lee , Seog Moon Choi , Sang Hyun Shin
IPC分类号： H01L29/207 , H01L33/48 , H05K3/28 , H01L33/62 , H01L33/60
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H05K3/28 , H05K2203/0315 , H05K2203/0542
摘要： An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.
摘要翻译：一种用于高温条件的绝缘结构及其制造方法。在绝缘结构中，衬底具有形成在其至少一个表面上的用于电连接器件的导电图案。通过阳极氧化在导电图案的预定部分上形成金属氧化物层图案，金属氧化物层图案由选自Al，Ti和Mg的一种形成。

64. 发明授权

US08603842B2 Method of manufacturing package substrate for optical element 有权
标题翻译：制造光学元件封装基板的方法
公开(公告)号：US08603842B2
公开(公告)日：2013-12-10
申请号：US13418241
申请日：2012-03-12
申请人： Chang Hyun Lim , Seog Moon Choi , Sang Hyun Shin , Sung Keun Park , Young Ki Lee
发明人： Chang Hyun Lim , Seog Moon Choi , Sang Hyun Shin , Sung Keun Park , Young Ki Lee
IPC分类号： H01L33/62
CPC分类号： H01L33/54 , H01L33/505 , H01L33/62 , H01L2224/32225 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014
摘要： Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided.
摘要翻译：公开了一种用于光学元件的封装基板，其包括基底基板，形成在基底基板上并包括安装部分的第一电路层，安装在安装部分上的光学元件，形成为预定图案的一个或多个沟槽通过去除第一电路层的部分使得第一电路层和光学元件彼此电连接的安装部分和施加在由沟槽限定的区域以覆盖光学元件的荧光树脂材料，以及其中这种沟槽形成在第一电路层上，使得光学元件和第一电路层彼此电连接，从而保持荧光树脂材料的形状，并且消除了在光学元件下形成通孔的需要。还提供了一种制造用于光学元件的封装衬底的方法。

65. 发明授权

US08529385B1 Arrowhead having expanding blades controlled by gear mechanism 有权
标题翻译：具有由齿轮机构控制的扩张叶片的箭头
公开(公告)号：US08529385B1
公开(公告)日：2013-09-10
申请号：US13479073
申请日：2012-05-23
申请人： Young Ki Lee
发明人： Young Ki Lee
IPC分类号： F42B6/08
CPC分类号： F42B6/08
摘要： Disclosed is an arrowhead in which a plurality of expandable blades can be quickly and reliably retracted or expanded without using an additional means to bundle the expanding blades, thereby enhancing the penetrating capability or killing capability of an arrow. Particularly, a portion of a shaft forming the arrowhead is provided with a rack gear portion formed thereon and a lower end of each of the expanding blades is provided with a pinion gear portion, such that the rack gear portion and the pinion gear portion engage with each other and such a rack-pinion action controls the operation of retracting or expanding the expanding blades.
摘要翻译：公开了一种箭头，其中可以快速且可靠地缩回或扩展多个可扩展叶片，而不需要使用附加装置来捆扎扩张刀片，从而增强箭头的穿透能力或杀伤能力。特别地，形成箭头的轴的一部分设置有形成在其上的齿条部分，并且每个扩展叶片的下端设置有小齿轮部分，使得齿条部分和小齿轮部分与彼此并且这种齿条 - 小齿轮动作控制缩回或扩大扩张刀片的操作。

66. 发明授权

US08368291B2 Radiant heat substrate and method for manufacturing the radiant heat substrate, and luminous element package with the radiant heat substrate 失效
标题翻译：辐射热基板和辐射热基板的制造方法以及具有辐射热基板的发光元件封装
公开(公告)号：US08368291B2
公开(公告)日：2013-02-05
申请号：US12964285
申请日：2010-12-09
申请人： Ki Ho Seo , Tae Hoon Kim , Sang Hyun Shin , Cheol Ho Heo , Young Ki Lee , Ji Hyun Park
发明人： Ki Ho Seo , Tae Hoon Kim , Sang Hyun Shin , Cheol Ho Heo , Young Ki Lee , Ji Hyun Park
IPC分类号： H01L33/64 , H01L33/48
CPC分类号： H01L33/641 , H01L23/3677 , H01L23/3735 , H01L23/3736 , H01L33/642 , H01L2224/48227 , H01L2224/73265 , H01L2933/0075 , H01S5/02276 , H01S5/02476 , Y10T29/49117
摘要： The present invention provides a radiant heat substrate comprising: a conductive substrate which is formed of a metal material and includes a front surface having a luminous element mounted thereon and a rear surface opposed to the front surface; an insulating film which covers the front surface of the conductive substrate; a metal oxide film which covers the rear surface of the conductive substrate; and a metal pattern which covers the insulating film, wherein the metal pattern comprises: a heat transfer pad which is bonded to the luminous element; and a circuit line which is disposed at a region except from the mounting region of the luminous element and is electrically connected to the luminous element.
摘要翻译：本发明提供了一种辐射热衬底，包括：导电衬底，其由金属材料形成并且包括具有安装在其上的发光元件的前表面和与前表面相对的后表面; 覆盖导电性基板的前表面的绝缘膜; 覆盖导电性基板的背面的金属氧化物膜; 以及覆盖绝缘膜的金属图案，其中所述金属图案包括：传热垫，其接合到所述发光元件; 以及电路线，其设置在除了所述发光元件的安装区域以外的区域，并且与所述发光元件电连接。

67. 发明授权

US08304279B2 Light emitting diode package having anodized insulation layer and fabrication method therefor 有权
标题翻译：具有阳极氧化绝缘层的发光二极管封装及其制造方法
公开(公告)号：US08304279B2
公开(公告)日：2012-11-06
申请号：US13220258
申请日：2011-08-29
申请人： Young Ki Lee , Seog Moon Choi , Sang Hyun Shin
发明人： Young Ki Lee , Seog Moon Choi , Sang Hyun Shin
IPC分类号： H01L21/00
CPC分类号： H01L33/483 , H01L25/0753 , H01L33/58 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/00014 , H01L2924/00
摘要： An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.
摘要翻译：一种具有阳极氧化绝缘层的LED封装，其方法为增加散热效果以延长寿命LED并保持高亮度和高输出。 LED封装包括具有反射区域的Al衬底和安装在衬底上并连接到图案化电极的光源。封装还包括形成在图案化电极和衬底之间的阳极化绝缘层和覆盖在衬底的光源上的透镜。 Al衬底提供了LED的优异的散热效果，从而显着增加了LED的寿命和发光效率。

68. 发明授权

US08299692B2 Light emitting device package and method of manufacturing the same 有权
标题翻译：发光器件封装及其制造方法
公开(公告)号：US08299692B2
公开(公告)日：2012-10-30
申请号：US12213241
申请日：2008-06-17
申请人： Young Ki Lee , Seog Moon Choi , Hyung Jin Jeon , Sang Hyun Shin
发明人： Young Ki Lee , Seog Moon Choi , Hyung Jin Jeon , Sang Hyun Shin
IPC分类号： H01J1/62 , H01J9/02 , H01L31/00
CPC分类号： H01L33/486 , H01L33/62 , H01L33/647 , H01L2224/48227
摘要： The present invention relates to a light emitting device package and a method of manufacturing the same. There is provided a light emitting device package including a metal core; an insulating layer formed on the metal core; a metal layer formed on the insulating layer; a first cavity formed by removing parts of the metal layer and the insulating layer to expose a top surface of the metal core; and a light emitting device directly mounted on the top surface of the metal core in the first cavity and further there is provided a method of manufacturing the light emitting device package.
摘要翻译：本发明涉及一种发光器件封装及其制造方法。提供了一种包括金属芯的发光器件封装; 形成在金属芯上的绝缘层; 形成在所述绝缘层上的金属层; 通过去除金属层和绝缘层的部分以暴露金属芯的顶表面而形成的第一腔; 以及直接安装在第一腔中的金属芯的顶表面上的发光器件，并且还提供了制造发光器件封装的方法。

69. 发明授权

US08242371B2 Heat dissipating circuit board and method of manufacturing the same 有权
标题翻译：散热电路板及其制造方法
公开(公告)号：US08242371B2
公开(公告)日：2012-08-14
申请号：US12614405
申请日：2009-11-07
申请人： Hye Sook Shin , Seog Moon Choi , Shan Gao , Chang Hyun Lim , Tae Hyun Kim , Young Ki Lee
发明人： Hye Sook Shin , Seog Moon Choi , Shan Gao , Chang Hyun Lim , Tae Hyun Kim , Young Ki Lee
IPC分类号： H05K7/20 , H05K1/00
CPC分类号： H05K7/205 , H05K1/0209 , H05K1/0263 , H05K1/053 , H05K3/202 , H05K3/24 , H05K3/341 , H05K2201/066 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155
摘要： Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.
摘要翻译：公开了一种散热电路板，其包括金属芯，该金属芯包括在其表面上形成的绝缘层，形成在绝缘层上的电路层，包括种子层和第一电路图案，以及散热框架层，使用焊料并具有第二电路图案的电路层，其中散热框架层不是通过电镀工艺而是通过使用焊料结合到电路层上，因此降低了电镀工艺的成本和时间并减轻了施加的应力由于电镀过程而导致散热电路板。还提供了制造散热电路板的方法。

70. 发明申请

US20110260198A1 INSULATION STRUCTURE FOR HIGH TEMPERATURE CONDITIONS AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：高温条件绝缘结构及其制造方法
公开(公告)号：US20110260198A1
公开(公告)日：2011-10-27
申请号：US13177276
申请日：2011-07-06
申请人： Young Ki Lee , Seog Moon Choi , Sang Hyun Shin
发明人： Young Ki Lee , Seog Moon Choi , Sang Hyun Shin
IPC分类号： H01L33/60
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H05K3/28 , H05K2203/0315 , H05K2203/0542
摘要： An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device.A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.
摘要翻译：一种用于高温条件的绝缘结构及其制造方法。在绝缘结构中，衬底具有形成在其至少一个表面上的用于电连接器件的导电图案。通过阳极氧化在导电图案的预定部分上形成金属氧化物层图案，金属氧化物层图案由选自Al，Ti和Mg的一种形成。

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