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61. 发明授权

US08072046B2 Through-electrode, circuit board having a through-electrode, semiconductor package having a through-electrode, and stacked semiconductor package having the semiconductor chip or package having a through-electrode 失效
标题翻译：通孔电极，具有贯通电极的电路板，具有贯通电极的半导体封装，以及具有半导体芯片或封装的叠层半导体封装，具有贯通电极
公开(公告)号：US08072046B2
公开(公告)日：2011-12-06
申请号：US12209584
申请日：2008-09-12
申请人： Han Jun Bae , Jong Hoon Kim
发明人： Han Jun Bae , Jong Hoon Kim
IPC分类号： H01L23/538 , H05K1/02
CPC分类号： H05K3/4046 , H01L23/49827 , H01L2924/0002 , H05K2201/0347 , H05K2201/10242 , H01L2924/00
摘要： A stacked semiconductor package includes a first semiconductor package having a first semiconductor chip having a first pad and a through-hole passing through a the portion corresponding to the pad; a second semiconductor package disposed over the first semiconductor package, and including a second semiconductor chip having a second pad disposed at a portion corresponding to the first pad and blocking the through-hole; and a through-electrode disposed within the through-hole, and having a pillar shaped core supported by the second pad, a through-electrode unit disposed over a surface of the core and electrically connected with the second pad, a first metal layer interposed between the core and the through electrode unit, and a second metal layer interposed between an inner surface of the first semiconductor chip formed by the through-hole and the through-electrode unit.
摘要翻译：堆叠半导体封装包括具有第一半导体芯片的第一半导体封装，第一半导体芯片具有第一焊盘和穿过对应于焊盘的部分的通孔; 第二半导体封装，设置在所述第一半导体封装上，并且包括第二半导体芯片，所述第二半导体芯片具有设置在与所述第一焊盘对应的部分处并阻塞所述通孔的第二焊盘; 以及设置在所述通孔内的贯通电极，并具有由所述第二焊盘支撑的柱状芯，贯通电极单元，设置在所述芯的表面上并与所述第二焊盘电连接;第一金属层，芯和贯通电极单元，以及插入在由通孔形成的第一半导体芯片的内表面和通孔单元之间的第二金属层。

62. 发明授权

US08049341B2 Semiconductor package and method for manufacturing the same 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US08049341B2
公开(公告)日：2011-11-01
申请号：US12244322
申请日：2008-10-02
申请人： Seung Taek Yang , Min Suk Suh , Seung Hyun Lee , Jong Hoon Kim
发明人： Seung Taek Yang , Min Suk Suh , Seung Hyun Lee , Jong Hoon Kim
IPC分类号： H01L23/52
CPC分类号： H01L23/481 , H01L23/3128 , H01L25/0657 , H01L2224/05001 , H01L2224/05026 , H01L2224/05548 , H01L2224/05611 , H01L2224/05624 , H01L2224/05644 , H01L2224/05655 , H01L2224/16 , H01L2224/16145 , H01L2225/06513 , H01L2225/06527 , H01L2225/06541 , H01L2924/00014 , H01L2924/15311 , H01L2224/05099
摘要： A stacked semiconductor package and a method for manufacturing the same are presented which exhibit a reduced electrical resistance and an increased junction force. The semiconductor package includes at least two semiconductor chips stacked upon each other. Each semiconductor chip has a plurality of bonding pads formed on upper surfaces and has via-holes. First wiring lines are located on the upper surfaces of the semiconductor chips, on the surfaces of the via-holes, and respectively connected onto their respective bonding pads. Second wiring lines are located on lower surfaces of the semiconductor chips and on the surfaces of the respective via-holes which connect to their respective first wiring lines. The semiconductor chips are stacked so that the first wiring lines on an upper surface of an upwardly positioned semiconductor chip are respectively joined with corresponding second wiring lines formed on a lower surface of a downwardly positioned semiconductor chip.
摘要翻译：本发明提供一种叠层半导体封装及其制造方法，其具有降低的电阻和增加的接合力。半导体封装包括彼此堆叠的至少两个半导体芯片。每个半导体芯片具有形成在上表面上并具有通孔的多个接合焊盘。第一布线位于半导体芯片的上表面上，位于通孔的表面上，分别连接到它们各自的接合焊盘上。第二布线位于半导体芯片的下表面和连接到它们各自的第一布线的相应通孔的表面上。半导体芯片被堆叠，使得位于向上定位的半导体芯片的上表面上的第一布线分别与形成在向下定位的半导体芯片的下表面上的相应的第二布线接合。

63. 发明授权

US07859115B2 Semiconductor package for improving characteristics for transmitting signals and power 有权
标题翻译：用于提高发射信号和功率特性的半导体封装
公开(公告)号：US07859115B2
公开(公告)日：2010-12-28
申请号：US12346963
申请日：2008-12-31
申请人： Jong Hoon Kim , Min Suk Suh , Seung Taek Yang
发明人： Jong Hoon Kim , Min Suk Suh , Seung Taek Yang
IPC分类号： H01L23/48
CPC分类号： H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor package includes a semiconductor chip having a first region and a second region. Bonding pads are formed and through-holes are defined in the first and second regions. Insulation layers are formed on sidewalls of the through-holes, and through-electrodes formed in the through-holes and connected with corresponding bonding pads. The insulation layers formed in the first and second regions have different thicknesses or dielectric constants.
摘要翻译：半导体封装包括具有第一区域和第二区域的半导体芯片。形成接合焊盘并且在第一和第二区域中限定通孔。绝缘层形成在通孔的侧壁上，通孔形成在通孔中并与相应的接合焊盘连接。形成在第一和第二区域中的绝缘层具有不同的厚度或介电常数。

64. 发明授权

US07795514B2 Guitar having chest and arm rests and method of manufacturing same 有权
标题翻译：具有胸部和手臂的吉他及其制造方法
公开(公告)号：US07795514B2
公开(公告)日：2010-09-14
申请号：US12365581
申请日：2009-02-04
申请人： Jong Hoon Kim
发明人： Jong Hoon Kim
IPC分类号： G10D13/02
CPC分类号： G10D3/02
摘要： Disclosed herein is a guitar, which includes a chest rest formed on a back plate of a main body so that the guitar can be gripped in a stable manner and can be played with a comfort of chest. The guitar further includes an arm rest formed on a top plate of the main body so that so that the guitar can be gripped in a stable manner and can be played with a comfort of chest and arm. A method of manufacturing the chest and arm rest is also disclosed.
摘要翻译：这里公开了一种吉他，其包括形成在主体的背板上的胸部休息台，使得吉他可以以稳定的方式被夹持并且可以舒适的胸部玩。吉他还包括形成在主体的顶板上的扶手，使得能够以稳定的方式夹持吉他并且可以舒适的胸部和手臂进行演奏。还公开了制造胸部和扶手的方法。

65. 发明授权

US07741323B2 Indene derivatives and process for the preparation thereof 有权
标题翻译：茚衍生物及其制备方法
公开(公告)号：US07741323B2
公开(公告)日：2010-06-22
申请号：US10599911
申请日：2005-04-13
申请人： Hyae Gyeong Cheon , Sung-Eun Yoo , Sung Soo Kim , Sung-Don Yang , Kwang-Rok Kim , Sang Dal Rhee , Jin Hee Ahn , Seung Kyu Kang , Won Hoon Jung , Sung Dae Park , Nam Gee Kim , Jang Hyuk Lee , Sun Chul Huh , Jae Mok Lee , Seog Beom Song , Soon Ji Kwon , Jong Hoon Kim , Jeong-Hyung Lee , Seung Jun Kim
发明人： Hyae Gyeong Cheon , Sung-Eun Yoo , Sung Soo Kim , Sung-Don Yang , Kwang-Rok Kim , Sang Dal Rhee , Jin Hee Ahn , Seung Kyu Kang , Won Hoon Jung , Sung Dae Park , Nam Gee Kim , Jang Hyuk Lee , Sun Chul Huh , Jae Mok Lee , Seog Beom Song , Soon Ji Kwon , Jong Hoon Kim , Jeong-Hyung Lee , Seung Jun Kim
IPC分类号： C07C255/47 , C07C251/32 , C07C237/24 , C07C69/74 , C07D413/12 , C07D333/28 , C07D333/22 , C07D333/24 , C07D333/60 , C07D317/60 , C07D317/70 , C07D307/54 , C07D277/30 , C07D265/30 , C07D295/135 , C07D233/64 , C07D213/53 , C07D213/64 , A61K31/5377 , A61K31/495 , A61K31/4402 , A61K31/44 , A61K31/426 , A61K31/4164 , A61K31/381 , A61K31/36 , A61K31/277 , A61K31/216 , A61K31/165
CPC分类号： C07D213/30 , C07C291/02 , C07C309/66 , C07C2601/02 , C07C2601/14 , C07C2602/08 , C07C2603/74 , C07D213/53 , C07D233/64 , C07D277/24 , C07D295/088 , C07D295/185 , C07D307/54 , C07D317/60 , C07D317/70 , C07D333/24 , C07D333/28 , C07D417/12
摘要： An indene derivative for selectively modulating the activities of peroxisome proliferator activated receptors (PPARs) having the following formula (I): wherein, R1 is C1-6 alkyl, C1-6 alkenyl, or C3-6 cycloalkyl, each of which is unsubstituted or substituted with one or more phenyl groups; R2 is H, CN, CO2Ra, CH2CO2Ra, CONRbRc, or phenyl; R3 is C1-6 alkyl, C3-6 cycloalkyl, naphthyl, phenyl, being each unsubstituted or substituted with one or more substituents selected from the group consisting of halogen, CN, NH2, NO2, ORa, phenyloxy, C1-6 alkyl, and C3-6 cycloalkyl; and R4, R5, R6, and R7 are each independently H, OH, OSO2CH3, O(CH2)mRe, CH2Rf, OCOCH2ORg, OCH2CH2ORg, OCH2CH═CHRg, or pyridine-2-yloxy, or R5 and R6 together form OCH2O.
摘要翻译：用于选择性调节具有下式（I）的过氧化物酶体增殖物激活受体（PPAR）的活性的茚衍生物：其中，R 1为C 1-6烷基，C 1-6链烯基或C 3-6环烷基，其各自为未取代或未取代的被一个或多个苯基取代; R2是H，CN，CO2Ra，CH2CO2Ra，CONRbRc或苯基; R 3是C 1-6烷基，C 3-6环烷基，萘基，苯基，各自未被取代或被一个或多个选自卤素，CN，NH 2，NO 2，OR a，苯氧基，C 1-6烷基和 C3-6环烷基; 和R 4，R 5，R 6和R 7各自独立地为H，OH，OSO 2 CH 3，O（CH 2）m RE，CH 2 R f，OCOCH 2 OR g，OCH 2 CH 2 OR g，OCH 2 CH = CHR g或吡啶-2-基氧基，或者R 5和R 6一起形成OCH 2 O。

66. 发明申请

US20100066657A1 Liquid crystal display 有权
标题翻译：液晶显示器
公开(公告)号：US20100066657A1
公开(公告)日：2010-03-18
申请号：US12314806
申请日：2008-12-17
申请人： Joon Kyu Park , Jong Hoon Kim
发明人： Joon Kyu Park , Jong Hoon Kim
IPC分类号： G09G3/36
CPC分类号： G09G3/342 , G09G2320/064 , G09G2320/0646 , G09G2330/021 , G09G2360/16
摘要： Disclosed herein is a liquid crystal display capable of reducing a side effect during local LED dimming to reduce power consumption and improve display quality. The liquid crystal display includes a liquid crystal panel having a plurality of liquid crystal cells formed respectively in a plurality of pixel areas defined by intersections of a plurality of gate lines and a plurality of data lines, a data driver for supplying data voltages to the data lines, a gate driver for supplying scan signals to the gate lines, a timing controller for controlling the data driver and gate driver and outputting a plurality of dimming signals based on an average picture level (APL) detected based on video data supplied to the liquid crystal panel, and a light emitting diode (LED) backlight unit for partitioning the liquid crystal panel into a plurality of areas and supplying appropriate pulse width modulation (PWM) control signals based on the dimming signals to a plurality of LED arrays installed to correspond respectively to the partitioned areas, to supply light to the liquid crystal panel.
摘要翻译：这里公开了一种液晶显示器，其能够在局部LED调光期间减少副作用以降低功耗并提高显示质量。液晶显示器包括具有分别形成在由多条栅极线和多条数据线的交点限定的多个像素区域中的多个液晶单元的液晶面板，用于向数据提供数据电压的数据驱动器线路，用于向栅极线提供扫描信号的栅极驱动器，用于控制数据驱动器和栅极驱动器并基于基于提供给液体的视频数据检测到的平均图像电平（APL）输出多个调光信号的定时控制器水晶面板和用于将液晶面板分割成多个区域的发光二极管（LED）背光单元，并且基于调光信号向安装的多个LED阵列提供适当的脉宽调制（PWM）控制信号，以分别对应到分隔区域，以向液晶面板提供光。

67. 发明申请

US20100037751A1 BINDING FOR MUSICAL INSTRUMENTS 审中-公开
标题翻译：音乐仪器的绑定
公开(公告)号：US20100037751A1
公开(公告)日：2010-02-18
申请号：US12365656
申请日：2009-02-04
申请人： Jong Hoon Kim
发明人： Jong Hoon Kim
IPC分类号： G10D3/00 , B32B5/00
CPC分类号： G10D3/02 , Y10T428/24479
摘要： Disclosed herein is a binding for musical instruments. The binding comprises a combination of a base and a decoration strip. The base is formed with a groove having a sinuate shape. The decoration strip is formed of a plurality of thin and elongated materials having different colors. The thin and elongated materials are attached to each other into a single body. Thus, the musical instruments can be manufactured so as to have more beautiful appearances, and provide more active and meaningful feelings.
摘要翻译：本文公开了对乐器的约束。装订包括基部和装饰条的组合。基部形成有具有中心形状的凹槽。装饰条由多种具有不同颜色的薄而细长的材料形成。薄而细长的材料彼此连接成一体。因此，可以制造乐器以具有更美观的外观，并提供更积极和有意义的感觉。

68. 发明申请

US20100024622A1 MAGNETIC COVER 审中-公开
标题翻译：磁性盖
公开(公告)号：US20100024622A1
公开(公告)日：2010-02-04
申请号：US12365613
申请日：2009-02-04
申请人： Jong Hoon Kim
发明人： Jong Hoon Kim
IPC分类号： G10D3/00
CPC分类号： H01F7/0252 , G10G7/00
摘要： The present invention relates to a magnetic cover that is coupled to a body of a product by means of a magnetic force, wherein the magnetic cover does not have any screw hole thereon since no screws are required to couple the magnetic cover to the body of the product, thereby providing good outer appearance to the product and conducting easy and convenient coupling and removing operations. In addition, even when the coupling and removing are carried out repeatedly or carelessly, no damage or deformation occurs, and further, no tool like a driver is needed for the coupling or removing.
摘要翻译：本发明涉及一种通过磁力联接到产品主体的磁性盖，其中磁性盖不具有任何螺孔，因为不需要任何螺丝来将磁性盖连接到磁性体的主体产品，从而为产品提供良好的外观，并进行简单方便的联接和拆卸操作。另外，即使重复地或不小心地进行联接和移除，也不会发生损坏或变形，并且不需要像驱动器这样的工具来进行联接或移除。

69. 发明授权

US07629956B2 Apparatus and method for driving image display device 有权
标题翻译：用于驱动图像显示装置的装置和方法
公开(公告)号：US07629956B2
公开(公告)日：2009-12-08
申请号：US11301948
申请日：2005-12-13
申请人： Chul Sang Jang , Jong Hoon Kim
发明人： Chul Sang Jang , Jong Hoon Kim
IPC分类号： G09G3/36
CPC分类号： G09G3/3688 , G09G3/3648 , G09G2300/0876 , G09G2310/027 , G09G2330/021 , G09G2330/06
摘要： An apparatus and method for driving an image display device is disclosed, in which data signals are transmitted in a multilevel to reduce transmission frequencies, power consumption and transmission lines. The apparatus for driving an image display device includes a display panel including an image display unit for displaying images, a plurality of data driver integrated circuits supplying image signals to the image display unit, and a timing controller converting externally supplied i bit digital source data (i is a positive number) to a plurality of voltage levels to supply the converted voltage levels to the respective data driver integrated circuits and controlling the data driver integrated circuits.
摘要翻译：公开了一种用于驱动图像显示装置的装置和方法，其中数据信号以多级传输以减少传输频率，功耗和传输线。用于驱动图像显示装置的装置包括：显示面板，包括用于显示图像的图像显示单元，向图像显示单元提供图像信号的多个数据驱动器集成电路;以及转换外部提供的i位数字源数据的定时控制器 i是正数）到多个电压电平，以将转换的电压电平提供给各个数据驱动器集成电路并控制数据驱动器集成电路。

70. 发明授权

US07589410B2 Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package 有权
标题翻译：模制的重新配置的晶片，使用它的堆叠封装以及用于制造堆叠封装的方法
公开(公告)号：US07589410B2
公开(公告)日：2009-09-15
申请号：US11777643
申请日：2007-07-13
申请人： Jong Hoon Kim
发明人： Jong Hoon Kim
IPC分类号： H01L23/538
CPC分类号： H01L23/3135 , H01L21/561 , H01L23/3121 , H01L24/48 , H01L24/73 , H01L24/96 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/04105 , H01L2224/16 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/92 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06527 , H01L2225/06548 , H01L2225/06565 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18162 , H01L2224/96 , H01L2224/82 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A stack package includes at least two stacked package units. Each package unit comprises semiconductor chips having bonding pads on upper surfaces thereof; a molding part formed to surround side surfaces of the semiconductor chips; through-electrodes formed in the molding part; and re-distribution lines formed to connect the through-electrodes and adjacent bonding pads with each other.
摘要翻译：堆叠包装包括至少两个堆叠的包装单元。每个封装单元包括其上表面上具有接合焊盘的半导体芯片; 形成为围绕半导体芯片的侧表面的模制部件; 在模制部件中形成的通孔; 以及形成为将贯通电极和相邻接合焊盘彼此连接的再分配线。

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