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    • 70. 发明授权
    • Buffer-layer treatment of MOCVD-grown nitride structures
    • MOCVD生长氮化物结构的缓冲层处理
    • US07364991B2
    • 2008-04-29
    • US11414012
    • 2006-04-27
    • David BourJacob SmithSandeep Nijhawan
    • David BourJacob SmithSandeep Nijhawan
    • H01L21/20H01L21/36H01L31/20
    • H01L21/02513H01L21/0242H01L21/02458H01L21/0254H01L21/0262
    • Methods are disclosed for fabricating a compound nitride semiconductor structure. An amorphous buffer layer that includes nitrogen and a group-III element is formed over a substrate disposed within a substrate processing chamber at a first temperature. The temperature within the chamber is increased to a second temperature at which the amorphous buffer layer coalesces into crystallites over the substrate. The substrate is exposed to a corrosive agent to destroy at least some of the crystallites. A crystalline nitride layer is formed over the substrate at a third temperature using the crystallites remaining after exposure to the corrosive agent as seed crystals. The third temperature is greater than the first temperature. The crystalline nitride layer also includes nitrogen and a group-III element.
    • 公开了用于制造复合氮化物半导体结构的方法。 在第一温度下,在设置在基板处理室内的基板上形成包含氮和III族元素的非晶缓冲层。 室内的温度增加到非晶缓冲层在衬底上聚结成微晶的第二温度。 将基底暴露于腐蚀剂以破坏至少一些微晶。 在第三温度下使用在作为晶种暴露于腐蚀剂之后残留的微晶,在衬底上形成结晶氮化物层。 第三温度大于第一温度。 结晶氮化物层还包括氮和III族元素。