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61. 发明授权

US06924641B1 Method and apparatus for monitoring a metal layer during chemical mechanical polishing 有权
标题翻译：化学机械抛光期间监测金属层的方法和装置
公开(公告)号：US06924641B1
公开(公告)日：2005-08-02
申请号：US09574008
申请日：2000-05-19
申请人： Hiroji Hanawa , Nils Johansson , Boguslaw Swedek , Manoocher Birang
发明人： Hiroji Hanawa , Nils Johansson , Boguslaw Swedek , Manoocher Birang
IPC分类号： B24B37/013 , B24B37/20 , B24B49/02 , B24B49/12 , G01B7/06 , G01N27/90 , H01L21/00
CPC分类号： B24B37/013 , B24B37/205 , B24B49/02 , B24B49/105 , B24B49/12 , G01B7/105
摘要： A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around a second portion of the core. The sensor can be positioned on a side of the polishing surface opposite the substrate. The sensor can detect a phase difference between a drive signal and a measured signal.
摘要翻译：用于在化学机械抛光期间监测衬底中的导电膜的传感器产生撞击衬底并引起涡流的交变磁场。传感器可以具有芯，围绕芯的第一部分缠绕的第一线圈和缠绕在芯的第二部分上的第二线圈。传感器可以位于与衬底相对的抛光表面的一侧。传感器可以检测到驱动信号和测量信号之间的相位差。

62. 发明授权

US06878036B2 Apparatus for monitoring a metal layer during chemical mechanical polishing using a phase difference signal 有权
标题翻译：用于使用相位差信号在化学机械抛光期间监测金属层的装置
公开(公告)号：US06878036B2
公开(公告)日：2005-04-12
申请号：US10446878
申请日：2003-05-27
申请人： Hiroji Hanawa , Nils Johansson , Bogusla W Swedek , Manoocher Birang
发明人： Hiroji Hanawa , Nils Johansson , Bogusla W Swedek , Manoocher Birang
IPC分类号： B24B37/013 , B24B37/20 , B24B49/02 , B24B49/12 , G01B7/06 , G01N27/90 , H01L21/00 , B24B49/00 , B24B51/00
CPC分类号： B24B37/013 , B24B37/205 , B24B49/02 , B24B49/105 , B24B49/12 , G01B7/105
摘要： A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around a second portion of the core. The sensor can be positioned on a side of the polishing surface opposite the substrate. The sensor can detect a phase difference between a drive signal and a measured signal.
摘要翻译：用于在化学机械抛光期间监测衬底中的导电膜的传感器产生撞击衬底并引起涡流的交变磁场。传感器可以具有芯，围绕芯的第一部分缠绕的第一线圈和缠绕在芯的第二部分上的第二线圈。传感器可以位于与衬底相对的抛光表面的一侧。传感器可以检测到驱动信号和测量信号之间的相位差。

63. 发明授权

US06876454B1 Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations 失效
公开(公告)号：US06876454B1
公开(公告)日：2005-04-05
申请号：US09399310
申请日：1999-09-20
申请人： Manoocher Birang , Nils Johansson , Allan Gleason
发明人： Manoocher Birang , Nils Johansson , Allan Gleason
IPC分类号： B24B37/04 , B24B47/12 , B24B49/04 , B24B49/12 , B24B51/00 , B24D7/12 , B24D13/14 , G01B11/06 , G01B9/02 , B24B49/00 , G01B11/28
CPC分类号： H01L22/12 , B24B37/013 , B24B37/205 , B24B47/12 , B24B49/04 , B24B49/12 , B24B51/00 , G01B11/0683
摘要： An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.

64. 发明申请

US20060009128A1 Eddy current sensing of metal removal for chemical mechanical polishing 审中-公开
标题翻译：用于化学机械抛光的金属去除的涡流检测
公开(公告)号：US20060009128A1
公开(公告)日：2006-01-12
申请号：US11218977
申请日：2005-09-01
申请人： Hiroji Hanawa , Nils Johansson , Boguslaw Swedek , Manoocher Birang
发明人： Hiroji Hanawa , Nils Johansson , Boguslaw Swedek , Manoocher Birang
IPC分类号： B24B49/00
CPC分类号： B24B37/013 , B24B37/205 , B24B49/02 , B24B49/105 , B24B49/12 , G01B7/105
摘要： A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around a second portion of the core. The sensor can be positioned on a side of the polishing surface opposite the substrate. The sensor can detect a phase difference between a drive signal and a measured signal.
摘要翻译：用于在化学机械抛光期间监测衬底中的导电膜的传感器产生撞击衬底并引起涡流的交变磁场。传感器可以具有芯，围绕芯的第一部分缠绕的第一线圈和缠绕在芯的第二部分上的第二线圈。传感器可以位于与衬底相对的抛光表面的一侧。传感器可以检测到驱动信号和测量信号之间的相位差。

65. 发明授权

US06930478B2 Method for monitoring a metal layer during chemical mechanical polishing using a phase difference signal 有权
标题翻译：使用相位差信号在化学机械抛光期间监测金属层的方法
公开(公告)号：US06930478B2
公开(公告)日：2005-08-16
申请号：US10446550
申请日：2003-05-27
申请人： Hiroji Hanawa , Nils Johansson , Boguslaw Swedek , Manoocher Birang
发明人： Hiroji Hanawa , Nils Johansson , Boguslaw Swedek , Manoocher Birang
IPC分类号： B24B37/013 , B24B37/20 , B24B49/02 , B24B49/12 , G01B7/06 , G01N27/90 , H01L21/00
CPC分类号： B24B37/013 , B24B37/205 , B24B49/02 , B24B49/105 , B24B49/12 , G01B7/105
摘要： A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around a second portion of the core. The sensor can be positioned on a side of the polishing surface opposite the substrate. The sensor can detect a phase difference between a drive signal and a measured signal.
摘要翻译：用于在化学机械抛光期间监测衬底中的导电膜的传感器产生撞击衬底并引起涡流的交变磁场。传感器可以具有芯，围绕芯的第一部分缠绕的第一线圈和缠绕在芯的第二部分上的第二线圈。传感器可以位于与衬底相对的抛光表面的一侧。传感器可以检测到驱动信号和测量信号之间的相位差。

66. 发明授权

US06399501B2 Method and apparatus for detecting polishing endpoint with optical monitoring 有权
标题翻译：用光学监测检测抛光终点的方法和装置
公开(公告)号：US06399501B2
公开(公告)日：2002-06-04
申请号：US09460529
申请日：1999-12-13
申请人： Manoocher Birang , Boguslaw Swedek , Nils Johansson
发明人： Manoocher Birang , Boguslaw Swedek , Nils Johansson
IPC分类号： H01L21302
CPC分类号： B24B37/013 , B24B49/04 , B24B49/12 , H01L21/3212
摘要： An apparatus, as well as a method, brings a surface of a substrate into contact with a polishing pad that has a window, causes relative motion between the substrate and the polishing pad, and directs a light beam through the window so that the motion of the polishing pad relative to the substrate causes the light beam to move in a path across the substrate. An extreme intensity measurement is derived from a plurality of intensity measurements made as the light beam moves across the substrate. The beam sweeps across the substrate a plurality of times to generate a plurality of extreme intensity measurements, and a polishing endpoint is detected based on the plurality of extreme intensity measurements.
摘要翻译：一种装置以及方法使基板的表面与具有窗口的抛光垫接触，引起基板和抛光垫之间的相对运动，并引导光束通过窗口，使得运动抛光垫相对于基底使得光束在穿过基底的路径中移动。当光束穿过衬底移动时，从多个强度测量得出极强度测量。光束扫过基板多次以产生多个极强度测量，并且基于多个极强度测量来检测抛光端点。

67. 发明授权

US07731566B2 Substrate polishing metrology using interference signals 失效
标题翻译：使用干涉信号的基板抛光计量
公开(公告)号：US07731566B2
公开(公告)日：2010-06-08
申请号：US11838808
申请日：2007-08-14
申请人： Manoocher Birang , Grigory Pyatigorsky
发明人： Manoocher Birang , Grigory Pyatigorsky
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B47/12 , B24B49/04 , B24B49/12 , B24B51/00 , G01B11/06 , G01B11/0683
摘要： A method of polishing a substrate includes holding the substrate on a polishing pad with a polishing head, wherein the polishing pad is supported by a platen, creating relative motion between the substrate and the polishing pad to polish a side of the substrate, generating a light beam and directing the light beam towards the substrate to cause the light beam to impinge on the side of the substrate being polished. Light reflected from the substrate is at a detector to generate an interference signal. A measure of uniformity is computed from the interference signal.
摘要翻译：抛光衬底的方法包括：将抛光垫保持在具有抛光头的抛光垫上，其中抛光垫由压板支撑，在衬底和抛光垫之间产生相对运动以抛光衬底的侧面，产生光光束并将光束引向基板，以使光束撞击正在抛光的基板的侧面。从基板反射的光在检测器处产生干涉信号。从干扰信号计算均匀度的度量。

68. 发明授权

US07727364B2 Auxiliary electrode encased in cation exchange membrane tube for electroplating cell 有权
标题翻译：辅助电极封装在电镀槽的阳离子交换膜管中
公开(公告)号：US07727364B2
公开(公告)日：2010-06-01
申请号：US11362432
申请日：2006-02-24
申请人： Saravjeet Singh , Hooman Hafezi , Manoocher Birang , Aron Rosenfeld , Joseph Behnke
发明人： Saravjeet Singh , Hooman Hafezi , Manoocher Birang , Aron Rosenfeld , Joseph Behnke
IPC分类号： C25D17/12 , C25D7/12
CPC分类号： C25D17/10 , C25D5/04 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/007 , C25D17/02 , H01L21/2885
摘要： A method and apparatus for plating a metal onto a substrate. One embodiment of the invention provides an apparatus for electrochemically plating a substrate. The apparatus comprises a fluid basin configured to retain a plating solution therein, an anode assembly disposed in the fluid basin, a substrate support member configured to support the substrate and contact the substrate electrically, and an encased auxiliary electrode assembly disposed in the fluid basin. The encased auxiliary electrode assembly generally comprises an auxiliary electrode disposed in a protective tube.
摘要翻译：一种用于将金属电镀到基底上的方法和装置。本发明的一个实施例提供了一种用于对基底进行电化学电镀的装置。该装置包括被配置为在其中保持电镀溶液的流体池，设置在流体池中的阳极组件，被配置为支撑基板并电连接基板的基板支撑构件以及设置在流体池中的封装辅助电极组件。包封的辅助电极组件通常包括设置在保护管中的辅助电极。

69. 发明申请

US20100050779A1 CARBON NANOTUBE-BASED LOAD CELLS 有权
标题翻译：基于碳纳米管的负载细胞
公开(公告)号：US20100050779A1
公开(公告)日：2010-03-04
申请号：US12201242
申请日：2008-08-29
申请人： Victor L. Pushparaj , Omkaram Nalamasu , Manoocher Birang
发明人： Victor L. Pushparaj , Omkaram Nalamasu , Manoocher Birang
IPC分类号： G01B7/16 , H01L49/00 , H01L21/66
CPC分类号： G01L1/20 , G01L1/18 , G01L5/0076 , Y10S977/953 , Y10S977/956
摘要： A robust, stand-alone load cell comprises a block of aligned carbon nanotubes with parallel electrodes on opposing sides of the block and an electrical circuit connected between the electrodes for measuring the electrical resistance of the block. The nanotubes are preferably aligned perpendicular to the electrodes. Carbon nanotube-based load cells may be incorporated into a wafer asssembly for characterizing semiconductor processing equipment. Such a wafer assembly includes two parallel wafers with a plurality of carbon nanotube load cells positioned between and attached to both wafers. The load cells are independently electrically connected to a device which monitors and records the resistivity of the load cell. According to further aspects of the invention, each of the load cell's parallel electrodes may be comprised of many small electrodes, where each small electrode on one side of the block has a corresponding small electrode on the opposing side of the block; corresponding pairs of small electrodes are connected in series to form a chain; an electrical circuit, connected to both ends of the chain of opposing pairs of electrodes, is used to measure the electrical resistance of the chain.
摘要翻译：坚固的独立测力传感器包括在块的相对侧上具有平行电极的对准碳纳米管块和连接在电极之间的用于测量块的电阻的电路。纳米管优选垂直于电极取向。可以将碳纳米管基称重传感器结合到用于表征半导体处理设备的晶片组件中。这种晶片组件包括两个平行的晶片，其中多个碳纳米管负载单元位于两个晶片之间并附着在两个晶片上。称重传感器独立地电连接到监测和记录称重传感器的电阻率的装置。根据本发明的另外的方面，每个负载传感器的平行电极可以由许多小电极组成，其中块的一侧上的每个小电极在块的相对侧具有相应的小电极; 相应的一对小电极串联连接形成链条; 连接到相对电极对的链的两端的电路用于测量链的电阻。

70. 发明申请

US20060266653A1 In-situ profile measurement in an electroplating process 失效
标题翻译：电镀工艺中的原位型材测量
公开(公告)号：US20060266653A1
公开(公告)日：2006-11-30
申请号：US11137711
申请日：2005-05-25
申请人： Manoocher Birang , Nicolay Kovarsky , Bernardo Donoso
发明人： Manoocher Birang , Nicolay Kovarsky , Bernardo Donoso
IPC分类号： C25D21/12
CPC分类号： G01B7/06 , C25D7/123 , C25D17/001 , C25D21/12 , G01B7/287 , H01L21/67253 , Y10T428/24802
摘要： A method and apparatus for measuring differential voltages in an electrolyte of an electrochemical plating cell. Current densities are calculated from the measured differential voltages and correlated to thickness values of plated materials. A real time thickness profile may be generated from the thickness values.
摘要翻译：一种用于测量电化学电镀单元的电解质中的差分电压的方法和装置。电流密度根据测得的差分电压计算，并与电镀材料的厚度值相关。可以从厚度值产生实时厚度分布。

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