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    • 62. 发明授权
    • Paper folding device
    • 折纸装置
    • US4518380A
    • 1985-05-21
    • US581696
    • 1984-02-21
    • Masaaki ShimizuAkira Aihara
    • Masaaki ShimizuAkira Aihara
    • B65H45/16B65H45/14B31B1/64
    • B65H45/141
    • A paper folding device wherein two wing members are supported for pivotal movement between an open and a closed position, with a gap formed between the two wing members in the closed position. A sheet of paper to be folded is fed into the gap by rollers until the forward edge of the paper hits an adjustable stopper in the gap, so that as the sheet is farther moved by the rollers, a portion of the sheet outside the gap is bent, and the bent portion is nipped and then folded by the rollers. A sound absorber is so arranged adjacent each of the two wing members so as to absorb the sound caused by the forward edge of the sheet of paper striking the stopper inside the gap.
    • 一种纸折叠装置,其中两个翼构件被支撑用于在打开和关闭位置之间的枢转运动,在处于关闭位置的两个翼构件之间形成间隙。 要折叠的一张纸被辊子送入间隙中,直到纸张的前边缘与间隙中的可调节挡块相撞,使得当纸张被辊子移动得更远时,纸张在间隙外部的一部分是 弯曲,并且弯曲部分被夹持然后由辊折叠。 吸声器被布置成邻近两个翼构件中的每一个,以便吸收由打印在间隙内的止动件的纸张的前边缘引起的声音。
    • 63. 发明授权
    • Method, tool, and apparatus for manufacturing a semiconductor device
    • 用于制造半导体器件的方法,工具和装置
    • US08703626B2
    • 2014-04-22
    • US11889403
    • 2007-08-13
    • Koichi NishikawaMasaaki ShimizuKenichi NonakaSeiichi YokoyamaHideki Hashimoto
    • Koichi NishikawaMasaaki ShimizuKenichi NonakaSeiichi YokoyamaHideki Hashimoto
    • H01L21/00
    • H01L21/67115H01L21/67103H01L21/68721H01L29/1608H01L29/6606Y10T29/49117Y10T29/49124
    • A method of manufacturing a semiconductor device, includes increasing adherence between a susceptor as a heating element, and a semiconductor substrate disposed on the susceptor, by using an adherence increasing mechanism, or increasing heat transmitted to a semiconductor substrate, which is disposed on a susceptor as a heating element, by using a transmitted-heat increasing mechanism; and heating the semiconductor substrate to have a predetermined temperature by heating the susceptor. The adherence increasing mechanism may include the susceptor and one of a heavy-weight stone disposed on the semiconductor substrate, a cap disposed on the semiconductor substrate and engaged with the susceptor, and an adhesive layer provided between the susceptor and the semiconductor substrate. The transmitted-heat increasing mechanism may include the susceptor and small pieces which are disposed on the semiconductor substrate and have radiated-light absorption ability. The susceptor may hold a plurality of the semiconductor substrates in a stacked form.
    • 一种制造半导体器件的方法包括通过使用附着增加机构增加作为加热元件的基座和设置在基座上的半导体基板之间的粘附性,或者增加传输到半导体基板的热量,该半导体基板设置在基座 作为加热元件,通过使用透热增加机构; 并且通过加热所述基座来加热所述半导体衬底以具有预定温度。 附着增加机构可以包括基座和设置在半导体衬底上的重量级的石块之一,设置在半导体衬底上并与基座接合的帽以及设置在基座和半导体衬底之间的粘合剂层。 透热增加机构可以包括设置在半导体衬底上并具有辐射光吸收能力的基座和小片。 基座可以以堆叠的形式保持多个半导体衬底。
    • 64. 发明授权
    • Door trim for vehicle
    • 车门修边
    • US08491033B2
    • 2013-07-23
    • US13286568
    • 2011-11-01
    • Ryousuke SakamakiMasaaki Shimizu
    • Ryousuke SakamakiMasaaki Shimizu
    • B60J5/04
    • B60R13/043
    • A door trim for a vehicle is provided. The vehicle comprises a fixed body including an opening and a movable body that opens and closes the opening. At least one of the fixed body and the movable body includes an attachment portion. The door trim comprises an elongate shape and a cover. The cover is attached along the attachment portion in a manner to cover the attachment portion. The door trim comprises a reinforcing member for reinforcing the cover. The reinforcing member is provided between the cover and the attachment portion to directly oppose the attachment portion. At least one of the cover and the reinforcing member is directly assembled to the attachment portion.
    • 提供了一种车辆的车门装饰。 该车辆包括一个固定体,该固定体包括一开口和一开启和关闭开口的可移动体。 固定体和移动体中的至少一个包括附接部。 门装饰件包括细长形状和盖子。 所述盖沿着所述附接部分以覆盖所述附接部分的方式附接。 门装饰件包括用于加强盖的加强构件。 加强构件设置在盖和附接部之间以与安装部直接相对。 盖和加强构件中的至少一个直接组装到附接部分。
    • 67. 发明授权
    • Direct-current motor with improved branched tooth arrangement
    • 具有改进的分支齿布置的直流马达
    • US08350437B2
    • 2013-01-08
    • US12564703
    • 2009-09-22
    • Yoshiaki DoushitaKeita KawaiKazumitsu MoriyaToshio YamamotoMasaya HorikawaMasaaki Shimizu
    • Yoshiaki DoushitaKeita KawaiKazumitsu MoriyaToshio YamamotoMasaya HorikawaMasaaki Shimizu
    • H02K3/28H02K3/20H02K23/26
    • H02K23/36H02K1/146H02K23/405Y10T29/49012
    • A motor is provided that includes magnetic poles, an armature core, armature coils, a commutator, and power supply brushes. The armature core includes teeth arranged in the circumferential direction to extend in a radial pattern. The armature coils include inner layer coils and outer layer coils. Each of the inner layer coils is wound around radially proximal end portions of two circumferentially adjacent teeth or a radially proximal end portion of one of the teeth. The inner layer coils are arranged in the circumferential direction without overlapping each other in the radial direction. Each of the outer layer coils is wound around radially distal end portions of two circumferentially adjacent teeth by distributed winding. The outer layer coils are arranged radially outward of the inner layer coils and are arranged in the circumferential direction without overlapping each other in the radial direction. The circumferential center of the inner layer coils and the circumferential center of the outer layer coils are displaced in the circumferential direction.
    • 提供一种电动机,其包括磁极,电枢铁芯,电枢线圈,换向器和电源电刷。 电枢铁心包括在圆周方向上布置的以径向图案延伸的齿。 电枢线圈包括内层线圈和外层线圈。 每个内层线圈缠绕在两个周向相邻的齿的径向近端部分或其中一个齿的径向近端部分。 内层线圈沿圆周方向排列而不在径向上彼此重叠。 每个外层线圈通过分布绕组缠绕在两个周向相邻的齿的径向远端部分上。 外层线圈排列在内层线圈的径向外侧,并且沿圆周方向排列而不在径向上彼此重叠。 内层线圈的周向中心和外层线圈的周向中心在圆周方向上位移。
    • 68. 发明授权
    • Pressure sensitive sensor and manufacturing method thereof
    • 压敏传感器及其制造方法
    • US08191427B2
    • 2012-06-05
    • US12974011
    • 2010-12-21
    • Masato HattoriMasaaki Shimizu
    • Masato HattoriMasaaki Shimizu
    • G01L9/00G08B21/00G01R27/26
    • E05F15/44E05Y2900/531Y10T29/49007
    • A molten dielectric resin material is filled in a section of an inside of a hollow dielectric body, in which electrode wires are installed. The molten dielectric resin material is solidified to form filler resin, so that the hollow dielectric body has a sensor portion, in which the filler resin is not filled in the inside of the hollow dielectric body, and a non-sensor portion, in which the filler resin is filled in the inside of the hollow dielectric body. A power supply connector is installed to one end part of the hollow dielectric body located at the non-sensor portion side and includes a plurality of electrically conductive terminals that are electrically connected to the plurality of electrode wires.
    • 熔融的电介质树脂材料填充在其中安装电极线的中空电介质体的内部的一部分中。 熔融的电介质树脂材料被固化以形成填充树脂,使得中空电介质体具有传感器部分,其中填充树脂未填充在中空电介质体的内部,以及非传感器部分,其中 填充树脂填充在中空电介质体的内部。 电源连接器安装在位于非传感器部分侧的中空电介质体的一端部,并且包括多个与多个电极线电连接的导电端子。