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    • 61. 发明授权
    • Cooling apparatus using boiling and condensing refrigerant
    • 使用沸腾和冷凝制冷剂的冷却装置
    • US06575230B1
    • 2003-06-10
    • US09467003
    • 1999-12-20
    • Shigeru KadotaKiyoshi KawaguchiTetsuya TakeutiKazuo KobayashiTakahide OharaMasahiko SuzukiHajime SugitoJunichi Semura
    • Shigeru KadotaKiyoshi KawaguchiTetsuya TakeutiKazuo KobayashiTakahide OharaMasahiko SuzukiHajime SugitoJunichi Semura
    • F28D1500
    • F28D15/0266F28D15/0233F28F1/126F28F13/00F28F2270/00
    • According to the present invention, a cooling apparatus using boiling and condensing refrigerant, includes a fluid separating plate for separating a high-temperature fluid from a low-temperature fluid, a refrigerant tank disposed on the side of the high-temperature fluid from the fluid separating plate, a refrigerant sealed into the refrigerant tank, a pair of communication pipes, one end of which is communicated with the refrigerant tank hermetically, a condensing portion communicated with the other end of the communication pipes and disposed on the side of the low-temperature fluid from the fluid separating plate, and a heat insulating material as a high-temperature portion-side heat insulating material coated on the outer periphery of the high-temperature-side communication pipe. In this way, it is possible to suppress a heat conduction from a high-temperature portion (high-temperature air) to the high-temperature-side communication pipe. As a result, it is possible to prevent the descending refrigerant which has been condensed and liquefied in the radiator from receiving heat from the high-temperature portion through the high-temperature-side communication pipe to receive an ascending force in the high-temperature-side communication pipe.
    • 根据本发明,使用沸腾冷凝制冷剂的冷却装置包括用于从低温流体分离高温流体的流体分离板,设置在来自流体的高温流体侧的制冷剂箱 分离板,密封在制冷剂罐中的制冷剂,一端连接在制冷剂罐上的一对连通管,与连通管的另一端连通并设置在低压侧的冷凝部, 来自流体分离板的温度流体和涂覆在高温侧连通管的外周上的作为高温部分侧绝热材料的绝热材料。 以这种方式,可以抑制从高温部分(高温空气)到高温侧连通管的热传导。 结果,可以防止散热器中冷凝和液化的下降的制冷剂通过高温侧连通管从高温部分接收热量,以在高温侧连通管中承受上升力。 侧通信管。
    • 63. 发明授权
    • IC module and smart card
    • IC模块和智能卡
    • US06378774B1
    • 2002-04-30
    • US09568977
    • 2000-05-11
    • Susumu EmoriHidemi NakajimaSusumu IgarashiKazuo Kobayashi
    • Susumu EmoriHidemi NakajimaSusumu IgarashiKazuo Kobayashi
    • G06K1906
    • G06K19/06G06K7/10178G06K19/077G06K19/07747G06K19/07749G06K19/07756G06K19/07769G06K19/07775G06K19/07779G06K19/07783G06K19/07784
    • A smart card comprises an IC module and an antenna for non-contact transmission. The IC module has both a contact-type function and a non-contact-type function. In the contact-type function, power reception and signal transmission/reception is effected via an electrical contact. In the non-contact-type function, power reception and signal transmission/reception is effected in a non-contact state by an electromagnetic coupling system without providing the IC card with an electrical contact. The IC module and the antenna comprise first and second coupler coils, respectively, which are disposed to be closely coupled to each other, and the IC module and the antenna are coupled in a non-contact state by transformer coupling. An antenna coil is disposed so as not to overlap an engagement portion for the IC module, which is a region of an external terminal electrode serving as a contact-type electrode, an embossing region, or a magnetic stripe region.
    • 智能卡包括IC模块和用于非接触式传输的天线。 IC模块具有接触式功能和非接触式功能。 在接触式功能中,电力接收和信号发送/接收通过电接触进行。 在非接触式功能中,通过电磁耦合系统在非接触状态下进行功率接收和信号发送/接收,而不向IC卡提供电接触。 IC模块和天线分别包括彼此紧密耦合的第一和第二耦合线圈,并且IC模块和天线通过变压器耦合以非接触状态耦合。 天线线圈设置成不与作为用作接触型电极的外部端子电极的区域,压花区域或磁条区域的IC模块的接合部分重叠。
    • 65. 发明授权
    • Cooling apparatus boiling and condensing refrigerant
    • 冷却装置沸腾冷凝制冷剂
    • US5998863A
    • 1999-12-07
    • US893927
    • 1997-07-15
    • Kazuo KobayashiKiyoshi Kawaguchi
    • Kazuo KobayashiKiyoshi Kawaguchi
    • F28D15/02H01L23/427H01L23/34
    • F28F3/12F28D15/0266H01L23/427H01L2924/0002
    • According to the present invention, the cooling apparatus includes a refrigerant tank to which a semiconductor device is attached, a connection chamber which is open to the central portion of the refrigerant tank on the side opposite to the side where the semiconductor device is mounted, a first tube (a first radiator) having one end in communication with the connection chamber and the other end in communication with one end of the refrigerant tank, a second tube (a second radiator) having one end in communication with the connection chamber and the other end in communication with the other end of the refrigerant tank, and refrigerant contained in the refrigerant tank. Even when the cooling apparatus is inclined, at least one of the other end of the first tube and the other end of the second tube can be immersed below the liquid level of the refrigerant so that the refrigerant can circulate within the refrigerant tank efficiently.
    • 根据本发明,冷却装置包括安装有半导体装置的制冷剂罐,在与安装半导体装置的一侧相反的一侧与制冷剂罐的中心部分开口的连接室, 第一管(第一散热器),其一端与连接室连通,另一端与制冷剂罐的一端连通;一端与连接室连通的第二管(第二散热器)和另一端 与制冷剂罐的另一端连通,以及容纳在制冷剂罐中的制冷剂。 即使当冷却装置倾斜时,第一管的另一端和第二管的另一端中的至少一个可以浸没在制冷剂的液面之下,使得制冷剂可以有效地在制冷剂罐内循环。