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61. 发明授权

US07520313B2 Locking device for heat sink 失效
标题翻译：散热器锁定装置
公开(公告)号：US07520313B2
公开(公告)日：2009-04-21
申请号：US11308332
申请日：2006-03-16
申请人： Cheng-Tien Lai , Zhi-Yong Zhou , Jian Hu
发明人： Cheng-Tien Lai , Zhi-Yong Zhou , Jian Hu
IPC分类号： F28F9/00 , F28F7/00 , H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A locking device (100) used for securing a heat sink (10) to a heat-generating component in accordance with an embodiment includes a pair of retainers (20). The locking device cooperates with a retention frame (30) to secure the heat sink to the heat-generating component. Each retainer (20) includes a handle (22) and a locking leg (24). The handle is pivotably mounted to fins of the heat sink via a pivot (225). The locking leg is made from a unitary sheet member and is connected to the handle at a location spaced apart from the pivot via which the handle is mounted to the heat sink. When the handle is brought to pivot about the pivot, the locking leg is driven to move in a direction to engage with the retention frame whereby the heat sink is firmly secured to the heat-generating component.
摘要翻译：根据实施例的用于将散热器（10）固定到发热部件的锁定装置（100）包括一对保持器（20）。锁定装置与保持框架（30）配合，以将散热器固定到发热部件上。每个保持器（20）包括手柄（22）和锁定腿（24）。手柄通过枢轴（225）可枢转地安装到散热器的翅片上。锁定腿由一体的片状构件制成，并且在与把手安装到散热器的枢轴间隔开的位置处连接到手柄。当手柄围绕枢轴枢转时，锁定腿被驱动以沿与保持框架接合的方向移动，由此散热器牢固地固定到发热部件。

62. 发明授权

US07417860B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07417860B2
公开(公告)日：2008-08-26
申请号：US11621083
申请日：2007-01-08
申请人： Bo-Yong Yang , Zhi-Yong Zhou , Cheng-Tien Lai
发明人： Bo-Yong Yang , Zhi-Yong Zhou , Cheng-Tien Lai
IPC分类号： H05K7/20 , F28D15/00
CPC分类号： H01L23/4093 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly (10) includes a heat sink (12) and a wire clip (14). The heat sink includes a base (120) and a plurality of fins (124) mounted on the base. A channel (126) is defined between two neighboring ones of the fins. A pair of points (1250) are punched on one of the fins and received in the channel. The wire clip includes a main body (140), first and second legs (141, 142) extending from opposite ends of the main body. The wire clip intervenes across the points and extends through the channel such that the main body is received in the channel and the first and second legs are located at opposite ends of the channel. Thus, the wire clip is prevented from dropping from the channel in a direction parallel to the channel.
摘要翻译：散热器组件（10）包括散热器（12）和线夹（14）。散热器包括安装在基座上的基座（120）和多个散热片（124）。在两个相邻的翅片之间限定通道（126）。在一个翅片上冲压一对点（1250），并在通道中接收。线夹包括主体（140），从主体的相对端延伸的第一和第二腿部（141,142）。线夹插入穿过该通道并延伸穿过通道，使得主体被容纳在通道中，并且第一和第二腿位于通道的相对端。因此，防止线夹在与通道平行的方向上从通道落下。

63. 发明授权

US07375964B2 Memory module assembly including a clamp for mounting heat sinks thereon 失效
标题翻译：存储器模块组件，包括用于在其上安装散热器的夹具
公开(公告)号：US07375964B2
公开(公告)日：2008-05-20
申请号：US11309226
申请日：2006-07-13
申请人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
发明人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A memory module assembly includes a pair of heat-dissipation plates (10), a printed circuit board (20) sandwiched between the heat-dissipation plates (10), and four clamps (30) for securing the heat-dissipation plates (10) onto opposite sides of the printed circuit board (20). Each clamp includes a connecting portion (32) and a pair of elastic pressing portions (34) extending from opposite free ends of the connecting portion. Each pressing portion has a pair of hooks (342) extending from opposite lateral sides thereof and an engaging portion extending (344) from a free end thereof and clamping on an end of the heat-dissipation plate. The hooks are inserted into openings (18) defined in the heat-dissipation plates and engage with inner surfaces of the heat-dissipation plates.
摘要翻译：存储模块组件包括一对散热板（10），夹在散热板（10）之间的印刷电路板（20）和用于固定散热板（10）的四个夹具（30）在印刷电路板（20）的相对侧上。每个夹具包括连接部分（32）和从连接部分的相对的自由端延伸的一对弹性按压部分（34）。每个按压部分具有从其相对侧面延伸的一对钩（342）和从其自由端延伸（344）并且夹持在散热板的端部上的接合部。将钩插入到限定在散热板中的开口（18）中，并与散热板的内表面接合。

64. 发明授权

US07349220B2 Memory module assembly 失效
标题翻译：内存模块装配
公开(公告)号：US07349220B2
公开(公告)日：2008-03-25
申请号：US11308849
申请日：2006-05-15
申请人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
发明人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (50) thereon, a pair of heat-dissipating plates (20) attached on the printed circuit board, and a pair of clamps (30) clamping the heat-dissipating plates and the printed circuit board therebetween. Each heat-dissipating plate includes a pair of supporters (28) and a handle (24) rotatably engaging with the supporters. The heat-dissipating plates are installed on the opposite sides of the printed circuit board by exerting a force to the handles to make them move toward each other wherein the force overcomes the spring force of the clamps.
摘要翻译：存储模块组件包括其上具有发热电子部件（50）的印刷电路板（10），安装在印刷电路板上的一对散热板（20）和夹紧（30）的一对夹具散热板和印刷电路板之间。每个散热板包括一对支撑件（28）和与支撑件可旋转地接合的手柄（24）。散热板通过向手柄施加力使它们彼此移动而安装在印刷电路板的相对侧上，其中力克服了夹具的弹簧力。

65. 发明申请

US20080062694A1 HEAT DISSIPATION DEVICE FOR LIGHT EMITTING DIODE MODULE 审中-公开
标题翻译：用于发光二极管模块的散热装置
公开(公告)号：US20080062694A1
公开(公告)日：2008-03-13
申请号：US11309661
申请日：2006-09-07
申请人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
发明人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
IPC分类号： F21V29/00
CPC分类号： F21V29/56 , F21V29/70 , F21Y2115/10 , F28D1/0478 , F28D1/05366 , F28D15/00 , F28D2021/0029
摘要： A heat dissipation device for a light emitting diode (LED) module includes a liquid cooling system. The liquid cooling system includes a heat-absorbing member, which includes an inlet, an outlet and at least one pipe extending between the inlet and the outlet. The inlet and the outlet are provided for permitting liquid to flow through the at least one pipe, which is in thermal contact with at least one LED of the LED module.
摘要翻译：用于发光二极管（LED）模块的散热装置包括液体冷却系统。液体冷却系统包括吸热构件，其包括入口，出口和在入口和出口之间延伸的至少一个管。入口和出口设置成允许液体流过与LED模块的至少一个LED热接触的至少一个管道。

66. 发明申请

US20070263361A1 MEMORY MODULE ASSEMBLY 失效
标题翻译：内存模块总成
公开(公告)号：US20070263361A1
公开(公告)日：2007-11-15
申请号：US11308849
申请日：2006-05-15
申请人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
发明人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (50) thereon, a pair of heat-dissipating plates (20) attached on the printed circuit board, and a pair of clamps (30) clamping the heat-dissipating plates and the printed circuit board therebetween. Each heat-dissipating plate includes a pair of supporters (28) and a handle (24) rotatably engaging with the supporters. The heat-dissipating plates are installed on the opposite sides of the printed circuit board by exerting a force to the handles to make them move toward each other wherein the force overcomes the spring force of the clamps.
摘要翻译：存储模块组件包括其上具有发热电子部件（50）的印刷电路板（10），安装在印刷电路板上的一对散热板（20）和夹紧（30）的一对夹具散热板和印刷电路板之间。每个散热板包括一对支撑件（28）和与支撑件可旋转地接合的手柄（24）。散热板通过向手柄施加力使它们彼此移动而安装在印刷电路板的相对侧上，其中力克服了夹具的弹簧力。

67. 发明申请

US20070215327A1 HEAT DISSIPATION DEVICE 审中-公开
标题翻译：散热装置
公开(公告)号：US20070215327A1
公开(公告)日：2007-09-20
申请号：US11308282
申请日：2006-03-15
申请人： Cheng-Tien Lai , Zhi-Yong Zhou , Jian Hu
发明人： Cheng-Tien Lai , Zhi-Yong Zhou , Jian Hu
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat sink (30) and a heat pipe (40) thermally attached to the heat sink. The heat sink includes a base (32) with an opening (3262) defined therethrough, and a plurality of fins (36) mounted on the base. The heat pipe comprises an evaporating portion (42) and a condensing portion (44) thermally connecting with the fins. The evaporating portion comprises a flat bottom surface (422) for directly contacting with an electronic unit (50) and an arc-shaped top surface (424) contacting with the fins at the opening of the base.
摘要翻译：散热装置包括散热器（30）和热连接到散热器的热管（40）。散热器包括具有通过其限定的开口（3262）的基座（32）和安装在基座上的多个散热片（36）。热管包括蒸发部分（42）和与翅片热连接的冷凝部分（44）。蒸发部分包括用于与电子单元（50）直接接触的平坦底表面（422）和在基座开口处与翅片接触的弧形顶表面（424）。

68. 发明申请

US20060278372A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20060278372A1
公开(公告)日：2006-12-14
申请号：US11164282
申请日：2005-11-17
申请人： Cheng-Tien Lai , Zhi-Yong Zhou , Jiang-Jian Wen
发明人： Cheng-Tien Lai , Zhi-Yong Zhou , Jiang-Jian Wen
IPC分类号： H05K7/20 , F28D15/00
CPC分类号： H01L23/467 , F28D2021/0029 , F28F3/12 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a liquid cooling system and a heat exchanger. The liquid cooling system includes a cold plate (20) having an inlet (244) and an outlet (246) to permit liquid to flow through the cold plate. The heat exchanger includes a heat conductive member (10) thermally connecting with the cold plate to fins (60).
摘要翻译：散热装置包括液体冷却系统和热交换器。液体冷却系统包括具有入口（244）和出口（246）的冷板（20），以允许液体流过冷板。热交换器包括与冷板热连接到翅片（60）的导热构件（10）。

69. 发明授权

US07147043B2 Integratied liquid cooling system for electrical components 失效
标题翻译：电气元件集成液体冷却系统
公开(公告)号：US07147043B2
公开(公告)日：2006-12-12
申请号：US10900815
申请日：2004-07-27
申请人： Hsieh Kun Lee , Cheng-Tien Lai , Shi Wen Zhou
发明人： Hsieh Kun Lee , Cheng-Tien Lai , Shi Wen Zhou
IPC分类号： F28D15/00
CPC分类号： H01L23/473 , F28F3/12 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system includes a cooling body (1) defining an hollow portion receiving a pump (3) and a number of cooling fins (18) therein, and a contact portion for contacting an electrical component. The cooling body defines a passageway therein filled with liquid coolant, and an inlet (124) and an outlet (125) both in communication with the passageway. The pump defines an exit (31) and an entrance (32) connected to the inlet and the outlet of the cooling body respectively by two tubes (5). Heat is transferred from the electrical component to the contact portion, and then conducted to the coolant, and conducted to other portions of the cooling body as the coolant flows through the passageway. The heat is then conducted to the cooling fins for dissipation.
摘要翻译：液体冷却系统包括限定中空部分的冷却体（1），所述冷却体容纳泵（3）和其中的多个冷却翅片（18），以及用于接触电气部件的接触部分。冷却体限定了其中填充有液体冷却剂的通道，以及与通道连通的入口（124）和出口（125）。泵分别由两个管（5）分别连接到冷却体的入口和出口的出口（31）和入口（32）。热从电气部件传递到接触部分，然后传导到冷却剂，并且随着冷却剂流过通道而传导到冷却体的其它部分。然后将热量传导到散热片以进行散热。

70. 发明授权

US06924984B2 Heat sink clip with pivoting locking portions 失效
标题翻译：具有枢转锁定部分的散热片夹
公开(公告)号：US06924984B2
公开(公告)日：2005-08-02
申请号：US10660425
申请日：2003-09-10
申请人： Hsieh Kun Lee , Cheng-Tien Lai , Tony Zhou
发明人： Hsieh Kun Lee , Cheng-Tien Lai , Tony Zhou
IPC分类号： H01L23/40 , H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/308 , Y10T24/44026 , H01L2924/00
摘要： A heat sink clip comprises a connecting member (12), two pressing members (14) connecting to the connection member, each of the pressing members comprising a pressing portion (141) and two spring portions (142, 143) extending from opposite ends of the pressing portion, a first locking portion (144) depending from one of the spring portions of each pressing member, two operating members (16) each having spaced first and second pivot means, the second pivot means being below the first pivot means, the operating members respectively pivotably connected to the other one of the spring portions, and two second locking portions (18) respectively pivotably connected to the operating members. When the operating members are rotated downwardly, the first and second locking portions are raised, adapted for engaging with a retention frame and securing a heat sink to an electronic package.
摘要翻译：散热片夹包括连接构件（12），连接到连接构件的两个按压构件（14），每个按压构件包括按压部分（141）和两个弹簧部分（142,143），两个弹簧部分所述按压部分，从每个按压构件的一个弹簧部分悬垂的第一锁定部分（144），每个具有间隔开的第一和第二枢转装置的两个操作构件（16），所述第二枢转装置位于所述第一枢转装置的下方，分别可枢转地连接到另一个弹簧部分的操作构件和分别可枢转地连接到操作构件的两个第二锁定部分（18）。当操作构件向下旋转时，第一和第二锁定部分被升高，适于与保持框架接合并将散热器固定到电子封装件上。

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