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61. 发明授权

US06523255B2 Process and structure to repair damaged probes mounted on a space transformer 失效
公开(公告)号：US06523255B2
公开(公告)日：2003-02-25
申请号：US09886960
申请日：2001-06-21
申请人： Da-Yuan Shih , Keith Edward Fogel , Paul Alfred Lauro , Brian Samuel Beaman
发明人： Da-Yuan Shih , Keith Edward Fogel , Paul Alfred Lauro , Brian Samuel Beaman
IPC分类号： H05K300
CPC分类号： G01R3/00 , Y10T29/49117 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49179
摘要： Method for repairing, reworking or replacing damaged probes that are formed using a flying lead wire bonding process used for testing integrated circuit devices and other electronic devices, with the same column and row spacing as the original probes and using the same height as the original probes.

62. 发明授权

US06452406B1 Probe structure having a plurality of discrete insulated probe tips 有权
标题翻译：探头结构具有多个离散的绝缘探针尖端
公开(公告)号：US06452406B1
公开(公告)日：2002-09-17
申请号：US09254798
申请日：1999-03-11
申请人： Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Yun-Hsin Liao , Daniel Peter Morris , Da-Yuan Shih
发明人： Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Yun-Hsin Liao , Daniel Peter Morris , Da-Yuan Shih
IPC分类号： G01R3102
CPC分类号： G01R1/0675 , G01R1/06711 , G01R1/06761 , G01R1/06772 , G01R1/07342 , G01R3/00 , H01L2224/1134 , H01L2924/00013 , H01L2924/09701 , H01L2224/13099
摘要： The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.
摘要翻译：本发明涉及具有从支撑表面突出的多个分立绝缘细长电导体的结构，其可用作用于测试与电子器件和其它电子部件的电互连的探针，特别是用于测试具有刚性互连焊盘的集成电路器件以及具有高密度互连焊盘的多芯片模块封装及其使用的装置及其制造方法。通过提供高密度同轴探针的方法制造同轴探针结构。

63. 发明授权

US08486250B2 Electrodeposition method of forming a probe structure having a plurality of discrete insulated probe tips projecting from a support surface 失效
标题翻译：形成具有从支撑表面突出的多个离散绝缘探针尖端的探针结构的电沉积方法
公开(公告)号：US08486250B2
公开(公告)日：2013-07-16
申请号：US10066171
申请日：2002-02-01
申请人： Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Yun-Hsin Liao , Daniel Peter Morris , Da-Yuan Shih
发明人： Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Yun-Hsin Liao , Daniel Peter Morris , Da-Yuan Shih
IPC分类号： C25D5/02 , C25D9/02 , C25D13/06 , G01R1/073
CPC分类号： G01R1/0675 , G01R1/06711 , G01R1/06761 , G01R1/06772 , G01R1/07342 , G01R3/00 , H01L2224/1134 , H01L2924/00013 , H01L2924/09701 , H01L2224/13099
摘要： The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.
摘要翻译：本发明涉及具有从支撑表面突出的多个离散绝缘细长电导体的结构，其可用作用于测试电子装置（例如集成电路装置和其它电子部件）的电互连的探针，特别是用于集成具有刚性互连焊盘的电路装置和具有高密度互连焊盘的多芯片模块封装以及其使用的装置及其制造方法。通过提供高密度同轴探针的方法制造同轴探针结构。

64. 发明授权

US07368924B2 Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof 失效
标题翻译：探头结构具有从支撑表面突出的多个离散的绝缘探针尖端，用于其的装置及其制造方法
公开(公告)号：US07368924B2
公开(公告)日：2008-05-06
申请号：US10202069
申请日：2002-07-23
申请人： Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Yun-Hsin Liao , Daniel Peter Morris , Da-Yuan Shih
发明人： Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Yun-Hsin Liao , Daniel Peter Morris , Da-Yuan Shih
IPC分类号： G01R31/02
CPC分类号： G01R1/07307 , G01R1/06711 , G01R1/0675 , G01R1/06772 , G01R1/07342 , G01R1/07371 , G01R1/07378 , G01R3/00 , G01R31/2886 , H01L23/49827 , H01L23/5384 , H01L25/0652 , H01L2224/1134 , H01L2224/13099 , H01L2224/16 , H01L2224/78301 , H01L2924/00013 , H01L2924/00014 , H01L2924/01014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/1627 , H01L2924/3011 , H01L2924/00 , H01L2224/0401
摘要： The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.
摘要翻译：本发明涉及具有从支撑表面突出的多个离散绝缘细长电导体的结构，其可用作用于测试电子装置（例如集成电路装置和其它电子部件）的电互连的探针，特别是用于集成具有刚性互连焊盘的电路装置和具有高密度互连焊盘的多芯片模块封装以及其使用的装置及其制造方法。通过提供高密度同轴探针的方法制造同轴探针结构。

65. 发明授权

US06525551B1 Probe structures for testing electrical interconnections to integrated circuit electronic devices 失效
标题翻译：用于测试集成电路电子设备的电互连的探头结构
公开(公告)号：US06525551B1
公开(公告)日：2003-02-25
申请号：US09081342
申请日：1998-05-19
申请人： Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Eugene John O'Sullivan , Da-Yuan Shih
发明人： Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Eugene John O'Sullivan , Da-Yuan Shih
IPC分类号： G01R3102
CPC分类号： G01R1/07307 , G01R1/06738 , H01L2924/00013 , H01L2224/29099
摘要： A probe structure for probing an electronic device. The probe has: a substrate having a substrate surface having a plurality of substrate electrical contact locations;a plurality of elongated electrical conductors having a first and second end; the first end of each of the plurality of elongated electrical conductors is electrically connected to one of the plurality of substrate electrical contact locations; a plate having a first and second side, and having a plurality of openings therein extending from the first side to the second side; the plate is disposed so that the first side thereof faces sad substrate; the second end of each of the plurality of elongated electrical conductors extends through one of the openings in the plate; a support for maintaining the plate at a distance from the substrate surface; the distance is selected so that the second ends project out from the second side of the plate a sufficient amount so that when the probe structure is pressed against a device under test the second ends of the elongated electrical conductors are maintained within a displacement from an original position by the opening so that the second ends of the elongated electrical conductors remain in contact with an electrical contact location on the device under test.
摘要翻译：用于探测电子设备的探头结构。所述探针具有：具有基板表面的基板，所述基板表面具有多个基板电接触位置;多个细长电导体，具有第一端和第二端; 所述多个细长电导体中的每一个的第一端电连接到所述多个基板电接触位置中的一个; 具有第一和第二侧的板，并且具有从所述第一侧延伸到所述第二侧的多个开口; 该板被设置成使其第一侧面向悲伤的基板; 多个细长电导体中的每一个的第二端延伸穿过板中的一个开口; 用于将板保持在离基板表面一定距离处的支撑件; 选择距离使得第二端从板的第二侧突出足够的量，使得当探针结构被压靠在被测设备上时，细长电导体的第二端保持在与原件的位移之内通过开口的位置，使得细长电导体的第二端保持与被测器件上的电接触位置接触。

66. 发明授权

US06332270B2 Method of making high density integral test probe 失效
标题翻译：制作高密度积分测试探针的方法
公开(公告)号：US06332270B2
公开(公告)日：2001-12-25
申请号：US09198179
申请日：1998-11-23
申请人： Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Maurice H. Norcott , Da-Yuan Shih , George Frederick Walker
发明人： Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Maurice H. Norcott , Da-Yuan Shih , George Frederick Walker
IPC分类号： H01R914
CPC分类号： G01R1/07378 , G01R1/07314 , G01R3/00 , H01L2224/16225 , H01L2924/15312 , Y10T29/49004 , Y10T29/49151 , Y10T29/49222
摘要： A high density integrated test probe and method of fabrication is described. A group of wires are ball bonded to contact locations on the surface of a fan out substrate. The wires are sheared off leaving a stub, the end of which is flattened by an anvil. Before flattening a sheet of material having a group of holes is arranged for alignment with the group of stubs is disposed over the stubs. The sheet of material supports the enlarged tip. The substrate with stubs form a probe which is moved into engagement with contact locations on a work piece such as a drip or packaging substrate.
摘要翻译：描述了高密度集成测试探针和制造方法。将一组电线球焊接到扇形外壳的表面上的接触位置。电线被剪断，留下一个短截线，其末端被砧平坦化。在平坦化具有一组孔的材料的片材之前，布置成使一组短截线对准，以便将短截线组放置在短截线上。该材料片支撑放大的尖端。具有短截线的基底形成探针，该探针移动成与诸如滴液或包装基底的工件上的接触位置接合。

67. 发明授权

US6054651A Foamed elastomers for wafer probing applications and interposer connectors 失效
标题翻译：用于晶圆探测应用和插入式连接器的发泡弹性体
公开(公告)号：US6054651A
公开(公告)日：2000-04-25
申请号：US752469
申请日：1996-11-19
申请人： Keith Edward Fogel , James Lupton Hedrick , Paul Alfred Lauro , Yun-Hsin Liao , Da-Yuan Shih
发明人： Keith Edward Fogel , James Lupton Hedrick , Paul Alfred Lauro , Yun-Hsin Liao , Da-Yuan Shih
IPC分类号： H01B3/46 , H01B7/00
CPC分类号： H01B3/46
摘要： The present invention is directed to a new foamed elastomer composition including elastomer, hollow fillers, and reinforced fillers for supporting the conducting wires in the test probes for wafer level testing and burn in and interposer connector applications. The thermally stable elastomer resin is mixed with hollow fillers and reinforced fillers before filling into the probe or connector mold with an array of elongated conducting wires, then is crosslinked by a crosslinking agent and a catalyst. The use of compressible hollow fillers to foam the elastomer has been successful to enhance the compliance and resilience, and to reduce the thermal expansion, density, and dielectric constant of the elastomer.
摘要翻译：本发明涉及一种新的泡沫弹性体组合物，其包括弹性体，中空填料和增强填料，用于在用于晶片级测试和烧录和插入件连接器应用的测试探针中支撑导线。将热稳定的弹性体树脂与中空填料和增强填料混合，然后用细长的导线阵列填充到探针或连接器模具中，然后通过交联剂和催化剂进行交联。使用可压缩中空填料来弹性弹性体已经成功地提高了弹性体的顺应性和弹性，并降低了弹性体的热膨胀，密度和介电常数。

68. 发明授权

US06286208B1 Interconnector with contact pads having enhanced durability 失效
标题翻译：具有接触垫的互连器具有增强的耐用性
公开(公告)号：US06286208B1
公开(公告)日：2001-09-11
申请号：US08739343
申请日：1996-10-28
申请人： Da-Yuan Shih , Paul Lauro , Keith Edward Fogel , Brian Beaman , Maurice Norcott
发明人： Da-Yuan Shih , Paul Lauro , Keith Edward Fogel , Brian Beaman , Maurice Norcott
IPC分类号： H01R4302
CPC分类号： H01R13/2414 , H01L2224/16 , H01L2224/45144 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/16195 , H01R12/714 , H05K3/325 , Y10S29/029 , Y10T29/49158 , Y10T29/49162 , Y10T29/49213 , H01L2924/00
摘要： A structure of an enhanced durability interconnector to reliably interconnect modules having high density type contacts, such as found in modules having solder ball connections (SBC), to a connecting article such as a printed circuit board. The structure comprising a means to provide the SBC type contact a mating surface having a wide contact area. Furthermore, the electrical connecting medium within the interconnector, which is embedded in an elastomeric material to provide compliance, is strengthened by using two or more embedded wires in combination for each wide contact area contact. The interconnector is incorporated into a fixture to compress the interconnector between the SBC module and the connecting article. The fixture having further capability to align the connections, control the compression pressure and to prevent over-compression.
摘要翻译：一种增强耐久性互连器的结构，用于将诸如在具有焊球连接（SBC）的模块中发现的具有高密度类型触点的模块可靠地互连到诸如印刷电路板的连接件。所述结构包括提供SBC型接触具有宽接触面积的配合表面的装置。此外，嵌入在弹性体材料中以提供顺应性的互连器内的电连接介质通过组合使用两个或更多个嵌入式线来加强每个宽接触区域接触。互连器被并入夹具中以压缩SBC模块和连接件之间的互连器。夹具具有进一步的对接连接的能力，控制压缩压力并防止过度压缩。

69. 发明授权

US5810607A Interconnector with contact pads having enhanced durability 失效
标题翻译：具有接触垫的互连器具有增强的耐用性
公开(公告)号：US5810607A
公开(公告)日：1998-09-22
申请号：US527733
申请日：1995-09-13
申请人： Da-Yuan Shih , Paul Lauro , Keith Edward Fogel , Brian Beaman , Maurice Norcott
发明人： Da-Yuan Shih , Paul Lauro , Keith Edward Fogel , Brian Beaman , Maurice Norcott
IPC分类号： H01L23/50 , H01R12/71 , H01R13/24 , H05K3/32 , H01R9/09
CPC分类号： H01R13/2414 , H01R12/714 , H01L2224/16 , H01L2224/45144 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/16195 , H05K3/325 , Y10S29/029 , Y10T29/49158 , Y10T29/49162 , Y10T29/49213
摘要： A structure of an enhanced durability interconnector to reliably interconnect modules having high density type contacts, such as found in modules having solder ball connections (SBC), to a connecting article such as a printed circuit board. The structure comprising a means to provide the SBC type contact a mating surface having a wide contact area. Furthermore, the electrical connecting medium within the interconnector, which is embedded in an elastomeric material to provide compliance, is strengthened by using two or more embedded wires in combination for each wide contact area contact. The interconnector is incorporated into a fixture to compress the interconnector between the SBC module and the connecting article. The fixture having further capability to align the connections, control the compression pressure and to prevent over-compression.
摘要翻译：一种增强耐久性互连器的结构，用于将诸如在具有焊球连接（SBC）的模块中发现的具有高密度类型触点的模块可靠地互连到诸如印刷电路板的连接件。所述结构包括提供SBC型接触具有宽接触面积的配合表面的装置。此外，嵌入在弹性体材料中以提供顺应性的互连器内的电连接介质通过组合使用两个或更多个嵌入式线来加强每个宽接触区域接触。互连器被并入夹具中以压缩SBC模块和连接件之间的互连器。夹具具有进一步的对接连接的能力，控制压缩压力并防止过度压缩。

70. 发明授权

US07960263B2 Amorphization/templated recrystallization method for hybrid orientation substrates 有权
标题翻译：混合取向基板的非晶化/模板重结晶方法
公开(公告)号：US07960263B2
公开(公告)日：2011-06-14
申请号：US12767261
申请日：2010-04-26
申请人： Keith Edward Fogel , Katherine L. Saenger , Chun-Yung Sung , Haizhou Yin
发明人： Keith Edward Fogel , Katherine L. Saenger , Chun-Yung Sung , Haizhou Yin
IPC分类号： H01L21/20
CPC分类号： H01L21/02675 , H01L21/02532 , H01L21/2022 , H01L21/76224 , H01L21/823807
摘要： The present invention provides an improved amorphization/templated recrystallization (ATR) method for fabricating low-defect-density hybrid orientation substrates. ATR methods for hybrid orientation substrate fabrication generally start with a Si layer having a first orientation bonded to a second Si layer or substrate having a second orientation. Selected regions of the first Si layer are amorphized and then recrystallized into the orientation of the second Si layer by using the second Si layer as a template. The process flow of the present invention solves two major difficulties not disclosed by prior art ATR methods: the creation of “corner defects” at the edges of amorphized Si regions bounded by trenches, and undesired orientation changes during a high temperature post-recrystallization defect-removal annealing of non-ATR'd regions not bounded by trenches. In particular, this invention provides a process flow comprising the steps of (i) amorphization and low-temperature recrystallization performed in substrate regions free of trenches, (ii) formation of trench isolation regions that subsume the defective regions at the edge of the ATR'd regions, and (iii) a high-temperature defect-removal anneal performed with the trench isolation regions in place.
摘要翻译：本发明提供了用于制造低缺陷密度混合取向基材的改进的非晶化/模板重结晶（ATR）方法。用于混合取向衬底制造的ATR方法通常从具有第一取向键合到具有第二取向的第二Si层或衬底的Si层开始。第一Si层的选定区域是非晶化的，然后通过使用第二Si层作为模板将其再结晶成第二Si层的取向。本发明的工艺流程解决了现有技术ATR方法未公开的两个主要困难：在由沟槽限定的非晶化Si区域的边缘产生“角部缺陷”，以及在高温后再结晶缺陷 - 未被沟槽限定的非ATR区域的去除退火。特别地，本发明提供了一种工艺流程，其包括以下步骤：（i）在没有沟槽的衬底区域中进行非晶化和低温重结晶，（ii）形成在ATR'边缘处的缺陷区域的沟槽隔离区域的形成， d区域，以及（iii）在沟槽隔离区域中进行的高温缺陷去除退火。

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