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61. 发明授权

US06523255B2 Process and structure to repair damaged probes mounted on a space transformer 失效
公开(公告)号：US06523255B2
公开(公告)日：2003-02-25
申请号：US09886960
申请日：2001-06-21
申请人： Da-Yuan Shih , Keith Edward Fogel , Paul Alfred Lauro , Brian Samuel Beaman
发明人： Da-Yuan Shih , Keith Edward Fogel , Paul Alfred Lauro , Brian Samuel Beaman
IPC分类号： H05K300
CPC分类号： G01R3/00 , Y10T29/49117 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49179
摘要： Method for repairing, reworking or replacing damaged probes that are formed using a flying lead wire bonding process used for testing integrated circuit devices and other electronic devices, with the same column and row spacing as the original probes and using the same height as the original probes.

62. 发明授权

US06452406B1 Probe structure having a plurality of discrete insulated probe tips 有权
标题翻译：探头结构具有多个离散的绝缘探针尖端
公开(公告)号：US06452406B1
公开(公告)日：2002-09-17
申请号：US09254798
申请日：1999-03-11
申请人： Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Yun-Hsin Liao , Daniel Peter Morris , Da-Yuan Shih
发明人： Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Yun-Hsin Liao , Daniel Peter Morris , Da-Yuan Shih
IPC分类号： G01R3102
CPC分类号： G01R1/0675 , G01R1/06711 , G01R1/06761 , G01R1/06772 , G01R1/07342 , G01R3/00 , H01L2224/1134 , H01L2924/00013 , H01L2924/09701 , H01L2224/13099
摘要： The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.
摘要翻译：本发明涉及具有从支撑表面突出的多个分立绝缘细长电导体的结构，其可用作用于测试与电子器件和其它电子部件的电互连的探针，特别是用于测试具有刚性互连焊盘的集成电路器件以及具有高密度互连焊盘的多芯片模块封装及其使用的装置及其制造方法。通过提供高密度同轴探针的方法制造同轴探针结构。

63. 发明授权

US08486250B2 Electrodeposition method of forming a probe structure having a plurality of discrete insulated probe tips projecting from a support surface 失效
标题翻译：形成具有从支撑表面突出的多个离散绝缘探针尖端的探针结构的电沉积方法
公开(公告)号：US08486250B2
公开(公告)日：2013-07-16
申请号：US10066171
申请日：2002-02-01
申请人： Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Yun-Hsin Liao , Daniel Peter Morris , Da-Yuan Shih
发明人： Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Yun-Hsin Liao , Daniel Peter Morris , Da-Yuan Shih
IPC分类号： C25D5/02 , C25D9/02 , C25D13/06 , G01R1/073
CPC分类号： G01R1/0675 , G01R1/06711 , G01R1/06761 , G01R1/06772 , G01R1/07342 , G01R3/00 , H01L2224/1134 , H01L2924/00013 , H01L2924/09701 , H01L2224/13099
摘要： The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.
摘要翻译：本发明涉及具有从支撑表面突出的多个离散绝缘细长电导体的结构，其可用作用于测试电子装置（例如集成电路装置和其它电子部件）的电互连的探针，特别是用于集成具有刚性互连焊盘的电路装置和具有高密度互连焊盘的多芯片模块封装以及其使用的装置及其制造方法。通过提供高密度同轴探针的方法制造同轴探针结构。

64. 发明授权

US07368924B2 Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof 失效
标题翻译：探头结构具有从支撑表面突出的多个离散的绝缘探针尖端，用于其的装置及其制造方法
公开(公告)号：US07368924B2
公开(公告)日：2008-05-06
申请号：US10202069
申请日：2002-07-23
申请人： Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Yun-Hsin Liao , Daniel Peter Morris , Da-Yuan Shih
发明人： Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Yun-Hsin Liao , Daniel Peter Morris , Da-Yuan Shih
IPC分类号： G01R31/02
CPC分类号： G01R1/07307 , G01R1/06711 , G01R1/0675 , G01R1/06772 , G01R1/07342 , G01R1/07371 , G01R1/07378 , G01R3/00 , G01R31/2886 , H01L23/49827 , H01L23/5384 , H01L25/0652 , H01L2224/1134 , H01L2224/13099 , H01L2224/16 , H01L2224/78301 , H01L2924/00013 , H01L2924/00014 , H01L2924/01014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/1627 , H01L2924/3011 , H01L2924/00 , H01L2224/0401
摘要： The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.
摘要翻译：本发明涉及具有从支撑表面突出的多个离散绝缘细长电导体的结构，其可用作用于测试电子装置（例如集成电路装置和其它电子部件）的电互连的探针，特别是用于集成具有刚性互连焊盘的电路装置和具有高密度互连焊盘的多芯片模块封装以及其使用的装置及其制造方法。通过提供高密度同轴探针的方法制造同轴探针结构。

65. 发明授权

US06525551B1 Probe structures for testing electrical interconnections to integrated circuit electronic devices 失效
标题翻译：用于测试集成电路电子设备的电互连的探头结构
公开(公告)号：US06525551B1
公开(公告)日：2003-02-25
申请号：US09081342
申请日：1998-05-19
申请人： Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Eugene John O'Sullivan , Da-Yuan Shih
发明人： Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Eugene John O'Sullivan , Da-Yuan Shih
IPC分类号： G01R3102
CPC分类号： G01R1/07307 , G01R1/06738 , H01L2924/00013 , H01L2224/29099
摘要： A probe structure for probing an electronic device. The probe has: a substrate having a substrate surface having a plurality of substrate electrical contact locations;a plurality of elongated electrical conductors having a first and second end; the first end of each of the plurality of elongated electrical conductors is electrically connected to one of the plurality of substrate electrical contact locations; a plate having a first and second side, and having a plurality of openings therein extending from the first side to the second side; the plate is disposed so that the first side thereof faces sad substrate; the second end of each of the plurality of elongated electrical conductors extends through one of the openings in the plate; a support for maintaining the plate at a distance from the substrate surface; the distance is selected so that the second ends project out from the second side of the plate a sufficient amount so that when the probe structure is pressed against a device under test the second ends of the elongated electrical conductors are maintained within a displacement from an original position by the opening so that the second ends of the elongated electrical conductors remain in contact with an electrical contact location on the device under test.
摘要翻译：用于探测电子设备的探头结构。所述探针具有：具有基板表面的基板，所述基板表面具有多个基板电接触位置;多个细长电导体，具有第一端和第二端; 所述多个细长电导体中的每一个的第一端电连接到所述多个基板电接触位置中的一个; 具有第一和第二侧的板，并且具有从所述第一侧延伸到所述第二侧的多个开口; 该板被设置成使其第一侧面向悲伤的基板; 多个细长电导体中的每一个的第二端延伸穿过板中的一个开口; 用于将板保持在离基板表面一定距离处的支撑件; 选择距离使得第二端从板的第二侧突出足够的量，使得当探针结构被压靠在被测设备上时，细长电导体的第二端保持在与原件的位移之内通过开口的位置，使得细长电导体的第二端保持与被测器件上的电接触位置接触。

66. 发明授权

US06332270B2 Method of making high density integral test probe 失效
标题翻译：制作高密度积分测试探针的方法
公开(公告)号：US06332270B2
公开(公告)日：2001-12-25
申请号：US09198179
申请日：1998-11-23
申请人： Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Maurice H. Norcott , Da-Yuan Shih , George Frederick Walker
发明人： Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Maurice H. Norcott , Da-Yuan Shih , George Frederick Walker
IPC分类号： H01R914
CPC分类号： G01R1/07378 , G01R1/07314 , G01R3/00 , H01L2224/16225 , H01L2924/15312 , Y10T29/49004 , Y10T29/49151 , Y10T29/49222
摘要： A high density integrated test probe and method of fabrication is described. A group of wires are ball bonded to contact locations on the surface of a fan out substrate. The wires are sheared off leaving a stub, the end of which is flattened by an anvil. Before flattening a sheet of material having a group of holes is arranged for alignment with the group of stubs is disposed over the stubs. The sheet of material supports the enlarged tip. The substrate with stubs form a probe which is moved into engagement with contact locations on a work piece such as a drip or packaging substrate.
摘要翻译：描述了高密度集成测试探针和制造方法。将一组电线球焊接到扇形外壳的表面上的接触位置。电线被剪断，留下一个短截线，其末端被砧平坦化。在平坦化具有一组孔的材料的片材之前，布置成使一组短截线对准，以便将短截线组放置在短截线上。该材料片支撑放大的尖端。具有短截线的基底形成探针，该探针移动成与诸如滴液或包装基底的工件上的接触位置接合。

67. 发明申请

US20140158404A1 Printed Circuit Board Edge Connector 有权
公开(公告)号：US20140158404A1
公开(公告)日：2014-06-12
申请号：US14106220
申请日：2013-12-13
申请人： Brian Samuel Beaman
发明人： Brian Samuel Beaman
IPC分类号： H05K1/11
CPC分类号： H05K1/117 , H01R12/721 , H05K3/403 , H05K2201/09145 , H05K2201/09909 , H05K2201/10863 , Y10T29/49124 , Y10T29/49155 , Y10T29/49156
摘要： A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact pad located on the top surface and extending over the edge portion rounded surface to a point below the top surface.

68. 发明授权

US07442049B2 Electrical connecting device and method of forming same 失效
标题翻译：电连接装置及其形成方法
公开(公告)号：US07442049B2
公开(公告)日：2008-10-28
申请号：US11194790
申请日：2005-08-01
申请人： Gareth Geoffrey Hougham , Brian Samuel Beaman , Claudius Feger
发明人： Gareth Geoffrey Hougham , Brian Samuel Beaman , Claudius Feger
IPC分类号： H01R4/58
CPC分类号： H01R12/7005 , H01R12/7076 , H01R12/714 , H01R13/2414
摘要： Techniques for providing electrical connections are provided. In one aspect, an electrical connecting device is provided which comprises a plurality of compressible contacts; and a downstop structure surrounding at least a portion of one or more of the contacts, limiting compression of the contacts, and being configured to limit interaction between the contacts. The electrical connecting device may be further configured to have the plurality of compressible contacts have a first coefficient of thermal expansion and the downstop structure have a second coefficient of thermal expansion, the first coefficient of thermal expansion being substantially similar to the second coefficient of thermal expansion.
摘要翻译：提供了提供电连接的技术。一方面，提供一种电连接装置，其包括多个可压缩触点; 以及围绕一个或多个触点的至少一部分的下降结构，限制触点的压缩，并且被配置为限制触点之间的相互作用。电连接装置还可以被配置成具有多个可压缩触点具有第一热膨胀系数，并且下降结构具有第二热膨胀系数，第一热膨胀系数基本上类似于第二热膨胀系数。

69. 发明授权

US07632127B2 Socket and method for compensating for differing coefficients of thermal expansion 失效
标题翻译：用于补偿不同热膨胀系数的插座和方法
公开(公告)号：US07632127B2
公开(公告)日：2009-12-15
申请号：US12100480
申请日：2008-04-10
申请人： Brian Samuel Beaman , Joseph Kuczynski , Theron Lee Lewis , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
发明人： Brian Samuel Beaman , Joseph Kuczynski , Theron Lee Lewis , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
IPC分类号： H01R13/62
CPC分类号： H01R12/7052 , H01R12/714 , Y10T29/49144 , Y10T29/49149 , Y10T29/49208 , Y10T29/53174 , Y10T29/53265
摘要： The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for differing coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises at least two members that are coupled together and disposed to form an aperture in between the at least two members, wherein the surface mounted contacts extend from the aperture, and wherein at least one dimension of the at least two members is selected to compensate for a difference between the coefficients of thermal expansion between the socket and a printed circuit board.
摘要翻译：说明性实施例提供插座，用于制造插座的方法，装置和用于补偿插座和印刷电路板之间的不同热膨胀系数的方法。插座包括表面安装的触点和细长的外壳。所述细长壳体包括至少两个联接在一起并设置成在所述至少两个构件之间形成孔的构件，其中所述表面安装的触点从所述孔延伸，并且其中所述至少两个构件的至少一个尺寸被选择以补偿插座和印刷电路板之间的热膨胀系数之间的差异。

70. 发明申请

US20080182443A1 Socket and Method for Compensating for Differing Coefficients of Thermal Expansion 失效
标题翻译：用于补偿不同热膨胀系数的插座和方法
公开(公告)号：US20080182443A1
公开(公告)日：2008-07-31
申请号：US12100480
申请日：2008-04-10
申请人： Brian Samuel Beaman , Joseph Kuczynski , Theron Lee Lewis , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
发明人： Brian Samuel Beaman , Joseph Kuczynski , Theron Lee Lewis , Amanda Elisa Ennis Mikhail , Arvind Kumar Sinha
IPC分类号： H01R13/15
CPC分类号： H01R12/7052 , H01R12/714 , Y10T29/49144 , Y10T29/49149 , Y10T29/49208 , Y10T29/53174 , Y10T29/53265
摘要： The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for differing coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises at least two members that are coupled together and disposed to form an aperture in between the at least two members, wherein the surface mounted contacts extend from the aperture, and wherein at least one dimension of the at least two members is selected to compensate for a difference between the coefficients of thermal expansion between the socket and a printed circuit board.
摘要翻译：说明性实施例提供插座，用于制造插座的方法，装置和用于补偿插座和印刷电路板之间的不同热膨胀系数的方法。插座包括表面安装的触点和细长的外壳。所述细长壳体包括至少两个联接在一起并设置成在所述至少两个构件之间形成孔的构件，其中所述表面安装的触点从所述孔延伸，并且其中所述至少两个构件的至少一个尺寸被选择以补偿插座和印刷电路板之间的热膨胀系数之间的差异。

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