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    • 69. 发明申请
    • Three Dimensional Metal Deposition Technique
    • 三维金属沉积技术
    • US20140027274A1
    • 2014-01-30
    • US13560664
    • 2012-07-27
    • Ludovic GodetAdjin Sarajlic
    • Ludovic GodetAdjin Sarajlic
    • C23C14/34
    • H01J37/32422C23C14/046C23C14/3407C23C14/345H01J37/32357H01J37/32403H01J37/32623H01J37/32633H01J37/32642H01J37/3414H01J37/3417H01J37/3467H01J2237/08H01J2237/31701
    • A plasma processing apparatus is disclosed. The plasma processing apparatus includes a source configured to generate a plasma in a process chamber having a plasma sheath adjacent to the front surface of a workpiece, and a plasma sheath modifier. The plasma sheath modifier controls a shape of a boundary between the plasma and the plasma sheath so a portion of the shape of the boundary is not parallel to a plane defined by a front surface of the workpiece facing the plasma. A metal target is affixed to the back surface of the plasma sheath modifier so as to be electrically insulated from the plasma sheath modifier and is electrically biased such that ions exiting the plasma and passing through an aperture in the plasma sheath modifier are attracted toward the metal target. These ions cause sputtering of the metal target, allowing three dimensional metal deposition of the workpiece.
    • 公开了一种等离子体处理装置。 等离子体处理装置包括被配置为在具有与工件的前表面相邻的等离子体鞘的处理室中产生等离子体的源和等离子体护套改性剂。 等离子体护套修改器控制等离子体和等离子体护套之间的边界的形状,使得边界形状的一部分不平行于由面向等离子体的工件的前表面限定的平面。 将金属靶固定到等离子体护套改性剂的背面,以便与等离子体护套改性剂电绝缘,并被电偏置,使得离开等离子体并通过等离子体护套改性剂中的孔的离子被吸引到金属 目标。 这些离子引起金属靶溅射,允许工件的三维金属沉积。