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61. 发明授权

US4716370A Coil arrangement for producing static magnetic field 失效
标题翻译：用于产生静磁场的线圈布置
公开(公告)号：US4716370A
公开(公告)日：1987-12-29
申请号：US778368
申请日：1985-09-20
申请人： Yuji Inoue , Hideto Iwaoka , Tadashi Sugiyama
发明人： Yuji Inoue , Hideto Iwaoka , Tadashi Sugiyama
IPC分类号： G01R33/20 , A61B5/055 , A61B10/00 , G01R33/381 , G01R33/3875 , H01F5/00 , H01F7/20
CPC分类号： H01F7/20 , G01R33/3875
摘要： A coil arrangement for producing a static magnetic field comprising a central coil and two outer coils disposed on opposite sides of the central coil. The positions and dimensions of the coils are so selected that each term contained in the Taylor series of the function of the magnetic field in the axial direction (z axis) of the coil arrangement in minimized. The current density in the central portion of the central coil is made to be higher than at other portions. The inventive coil arrangement is smaller in size, lighter in weight, and consumers a smaller amount of power than the prior art for the same magnetic strength and with a better homogeneous magnetic field.
摘要翻译：一种用于产生静磁场的线圈装置，包括中心线圈和设置在中心线圈的相对侧上的两个外部线圈。线圈的位置和尺寸如此选择，使得包含在线圈装置的轴向（z轴）上的磁场的函数的泰勒级数中的每个项目最小化。使中心线圈的中心部分的电流密度高于其它部分的电流密度。本发明的线圈装置的尺寸更小，重量更轻，并且对于相同的磁强度和更好的均匀的磁场，消耗了比现有技术更少的功率。

62. 发明授权

US4651097A Examination method and apparatus utilizing nuclear magnetic resonance 失效
标题翻译：使用核磁共振的检查方法和装置
公开(公告)号：US4651097A
公开(公告)日：1987-03-17
申请号：US659409
申请日：1984-10-10
申请人： Hideto Iwaoka , Tadashi Sugiyama , Hiroyuki Matsuura
发明人： Hideto Iwaoka , Tadashi Sugiyama , Hiroyuki Matsuura
IPC分类号： G01R33/54 , G01R33/20
CPC分类号： G01R33/482
摘要： In an examination method and apparatus utilizing nuclear magnetic resonance, high frequency pulses for producing nuclear magnetic resonance are applied by successively imposing a first 90.degree. pulse, a first 180.degree. pulse, a second 90.degree. pulse, and a second 180.degree. pulse substantially immediately after the second 90.degree. pulse, and a next pulse sequence is initiated upon elapse of a wait time after the second 180.degree. pulse has been applied. The wait time is rendered much shorter than the conventional prior art wait times for high speed scanning operation, by forcibly aligning magnetization M first with the direction of a -Z direction axis and then with the direction of a +Z direction axis, using the second 90.degree. pulse and the second 180.degree. pulse. By applying a number of first 180.degree. pulses, a number of nuclear magentic resonance signals are produced for additionally shortening the overall measurement time.
摘要翻译：在使用核磁共振的检查方法和装置中，通过依次施加第一个90°脉冲，第一个180°脉冲，第二个90°脉冲和第二个180°脉冲，基本上立即产生用于产生核磁共振的高频脉冲在第二个90度脉冲之后，并且在施加第二个180度脉冲之后经过等待时间后开始下一个脉冲序列。通过将磁化M首先与-Z方向轴的方向，然后与+ Z方向轴的方向强制对准，等待时间比传统现有技术的高速扫描操作等待时间短得多，使用第二个 90度脉冲和第二个180度脉冲。通过应用多个第一180度脉冲，产生许多核磁共振信号以额外缩短整个测量时间。

63. 发明授权

US08453323B2 Printed circuit board manufacturing method 有权
标题翻译：印刷电路板制造方法
公开(公告)号：US08453323B2
公开(公告)日：2013-06-04
申请号：US13234721
申请日：2011-09-16
申请人： Hajime Sakamoto , Tadashi Sugiyama , Dongdong Wang , Takashi Kariya
发明人： Hajime Sakamoto , Tadashi Sugiyama , Dongdong Wang , Takashi Kariya
IPC分类号： H01K3/10 , H05K1/16 , H05K7/10 , H01L21/00
CPC分类号： H01L24/29 , H01L21/4846 , H01L21/4857 , H01L23/13 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L23/544 , H01L24/19 , H01L24/24 , H01L24/32 , H01L24/83 , H01L25/03 , H01L25/18 , H01L2223/54426 , H01L2223/54473 , H01L2223/5448 , H01L2223/54486 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16 , H01L2224/16227 , H01L2224/20 , H01L2224/24227 , H01L2224/32225 , H01L2224/45144 , H01L2224/73267 , H01L2224/83192 , H01L2224/92 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01052 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/18162 , H01L2924/30107 , H05K1/185 , H05K3/4602 , H05K2201/09036 , H05K2201/09563 , H05K2201/096 , H05K2201/09918 , H05K2201/10674 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49147 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2224/83 , H01L2224/82 , H01L2924/3512 , H01L2924/00
摘要： A method for manufacturing a printed circuit board, including providing a core substrate having an electronic component accommodated in the core substrate; forming a positioning mark on the core substrate; forming an interlayer insulating layer over the core substrate, the positioning mark and the electronic component; forming a via hole opening connecting to the electronic component through the interlayer insulating layer in accordance with the positioning mark on the core substrate; and forming a via hole structure in the via hole opening in the interlayer insulating layer such that the via hole structure is electrically connected to the electronic component.
摘要翻译：一种印刷电路板的制造方法，其特征在于，提供具有容纳在所述芯基板中的电子部件的芯基板，在芯基板上形成定位标记; 在芯基板，定位标记和电子部件之上形成层间绝缘层; 根据芯基板上的定位标记，通过层间绝缘层形成连接到电子部件的通孔开口; 以及在所述层间绝缘层的通孔开口中形成通孔结构，使得所述通孔结构电连接到所述电子部件。

64. 发明授权

US08438727B2 Multilayer printed circuit board and multilayer printed circuit board manufacturing method 有权
标题翻译：多层印刷电路板和多层印刷电路板制造方法
公开(公告)号：US08438727B2
公开(公告)日：2013-05-14
申请号：US12571973
申请日：2009-10-01
申请人： Hajime Sakamoto , Tadashi Sugiyama , Dongdong Wang , Takashi Kariya
发明人： Hajime Sakamoto , Tadashi Sugiyama , Dongdong Wang , Takashi Kariya
IPC分类号： H01K3/10 , H05K3/30
CPC分类号： H01L24/29 , H01L21/4846 , H01L21/4857 , H01L23/13 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L23/544 , H01L24/19 , H01L24/24 , H01L24/32 , H01L24/83 , H01L25/03 , H01L25/18 , H01L2223/54426 , H01L2223/54473 , H01L2223/5448 , H01L2223/54486 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16 , H01L2224/16227 , H01L2224/20 , H01L2224/24227 , H01L2224/32225 , H01L2224/45144 , H01L2224/73267 , H01L2224/83192 , H01L2224/92 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01052 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/18162 , H01L2924/30107 , H05K1/185 , H05K3/4602 , H05K2201/09036 , H05K2201/09563 , H05K2201/096 , H05K2201/09918 , H05K2201/10674 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49147 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2224/83 , H01L2224/82 , H01L2924/3512 , H01L2924/00
摘要： A method of manufacturing a multilayer printed circuit board having interlayer insulating layers and conductor layers repeatedly formed on a substrate, via holes formed in the interlayer insulating layers, and establishing electrical connection through the via holes, including containing an electronic component in said substrate, forming a positioning mark on said substrate based on a positioning mark of said electronic component, and conducting working or formation based on the positioning mark of said substrate.
摘要翻译：一种制造多层印刷电路板的方法，所述多层印刷电路板具有层间绝缘层和导体层，所述多层印刷电路板重复地形成在基板上，通过形成在所述层间绝缘层中的孔，并且通过所述通孔建立与所述基板中包含电子部件的电连接，基于所述电子部件的定位标记在所述基板上的定位标记，并且基于所述基板的定位标记进行加工或形成。

65. 发明授权

US08100770B2 Game controller, storage medium storing game program, and game apparatus 有权
标题翻译：游戏控制器，存储媒体存储游戏程序和游戏装置
公开(公告)号：US08100770B2
公开(公告)日：2012-01-24
申请号：US12073327
申请日：2008-03-04
申请人： Hitoshi Yamazaki , Takao Sawano , Tadashi Sugiyama
发明人： Hitoshi Yamazaki , Takao Sawano , Tadashi Sugiyama
IPC分类号： A63F9/24
CPC分类号： A63F13/245 , A63F13/06 , A63F13/212 , A63F13/214 , A63F13/218 , A63F13/235 , A63F2300/1006 , A63F2300/1025 , A63F2300/1056 , A63F2300/1068 , A63F2300/6045
摘要： A game controller includes at least four load sensors for detecting a load applied on a support board on which player's legs are ridden, and the game controller transmits a load value detected as manipulation data by the four load sensors to a game machine. The game machine determines a necessary quantity of load values, and the game machine computes the necessary quantity of load values based on the detected load value from the game controller. Then, game processing is performed based on the necessary quantity of computed load values.
摘要翻译：游戏控制器包括至少四个负载传感器，用于检测施加在玩家腿部的支撑板上的负载，游戏控制器将由四个负载传感器检测为操作数据的负载值发送到游戏机。游戏机确定必要数量的负载值，游戏机根据检测到的来自游戏控制器的负载值，计算必要的负荷值。然后，基于所计算的载荷值的必要量进行游戏处理。

66. 发明授权

US07988142B2 Sheet feeder, shutter opening and closing method, and image forming apparatus 有权
标题翻译：送纸器，快门打开和关闭方法以及图像形成装置
公开(公告)号：US07988142B2
公开(公告)日：2011-08-02
申请号：US12371291
申请日：2009-02-13
申请人： Tadashi Sugiyama
发明人： Tadashi Sugiyama
IPC分类号： B65H3/44 , B65H1/26
CPC分类号： B65H1/266 , B65H1/28 , B65H31/3081 , B65H2301/4222 , B65H2301/422548 , B65H2301/42266
摘要： An image forming apparatus according to the present invention includes: a first sheet feeding unit; a second sheet feeding unit provided adjacent to the first sheet feeding unit; one or plural first shutter(s) provided in the first sheet feeding unit; a driving unit that drives the first shutter(s); and one or plural second shutter(s) provided in the second sheet feeding unit, the second shutter(s) opening and closing in association with the opening and closing of the first shutter(s) driven by the driving unit. According to the present invention, when plural shutters for designating a stacking range of sheets are provided, an operation of any one of the shutters can be suitably associated with operations of the other shutters.
摘要翻译：根据本发明的图像形成装置包括：第一片材进给单元; 与所述第一供纸单元相邻设置的第二供纸单元; 设置在第一供纸单元中的一个或多个第一快门; 驱动所述第一挡板的驱动单元; 以及设置在第二送纸单元中的一个或多个第二挡板，第二挡板与由驱动单元驱动的第一挡板的打开和关闭相关联地打开和关闭。根据本发明，当设置用于指定纸张的堆叠范围的多个快门时，任何一个挡板的操作可以适当地与其他快门的操作相关联。

67. 发明授权

US07842887B2 Multilayer printed circuit board 有权
标题翻译：多层印刷电路板
公开(公告)号：US07842887B2
公开(公告)日：2010-11-30
申请号：US11757750
申请日：2007-06-04
申请人： Hajime Sakamoto , Tadashi Sugiyama , Dongdong Wang , Takashi Kariya
发明人： Hajime Sakamoto , Tadashi Sugiyama , Dongdong Wang , Takashi Kariya
IPC分类号： H05K1/16
CPC分类号： H01L24/29 , H01L21/4846 , H01L21/4857 , H01L23/13 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L23/544 , H01L24/19 , H01L24/24 , H01L24/32 , H01L24/83 , H01L25/03 , H01L25/18 , H01L2223/54426 , H01L2223/54473 , H01L2223/5448 , H01L2223/54486 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16 , H01L2224/16227 , H01L2224/20 , H01L2224/24227 , H01L2224/32225 , H01L2224/45144 , H01L2224/73267 , H01L2224/83192 , H01L2224/92 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01052 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/18162 , H01L2924/30107 , H05K1/185 , H05K3/4602 , H05K2201/09036 , H05K2201/09563 , H05K2201/096 , H05K2201/09918 , H05K2201/10674 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49147 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2224/83 , H01L2224/82 , H01L2924/3512 , H01L2924/00
摘要： A multilayer printed circuit board has an IC chip (20) included in a core substrate (30) in advance and a transition layer (38) provided on a pad (24) of the IC chip (20). Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the transition layer (38) made of copper on the die pad (24), it is possible to prevent resin residues on the pad (24) and to improve connection characteristics between the pad (24) and a via hole (60) and reliability.
摘要翻译：多层印刷电路板预先包括在芯基板（30）中的IC芯片（20）和设置在IC芯片（20）的焊盘（24）上的过渡层（38）。由此，可以在不使用引线部件和密封树脂的情况下将IC芯片电连接到多层印刷电路板。此外，通过在芯片焊盘（24）上设置由铜制成的过渡层（38），可以防止焊盘（24）上的树脂残留物，并且改善焊盘（24）和通孔（24）之间的连接特性 60）和可靠性。

68. 发明申请

US20080265499A1 IMAGE FORMING APPARATUS 审中-公开
标题翻译：图像形成装置
公开(公告)号：US20080265499A1
公开(公告)日：2008-10-30
申请号：US11741050
申请日：2007-04-27
申请人： Tadashi Sugiyama
发明人： Tadashi Sugiyama
IPC分类号： B65H7/12 , B41F13/00
CPC分类号： B65H5/062 , B65H2402/54 , B65H2403/514 , B65H2407/21 , B65H2511/13 , B65H2801/06 , G03G15/235 , G03G15/6561 , G03G2215/00409 , G03G2215/00738 , B65H2220/01
摘要： The paper thickness of a medium to be recorded is detected, and the pressurization force of a conveyance roller is controlled. When a thick paper is detected, the pressurization force of the conveyance roller is made high. When a normal paper or a thin paper is detected, the pressurization force of the conveyance roller is decreased or the pressurization is released.
摘要翻译：检测要记录的介质的纸张厚度，并且控制输送辊的加压力。当检测到厚纸时，输送辊的加压力变高。当检测到普通纸或薄纸时，传送辊的加压力降低或释放加压。

69. 发明申请

US20070227765A1 MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURING METHOD 有权
标题翻译：多层印刷电路板和多层印刷电路板制造方法
公开(公告)号：US20070227765A1
公开(公告)日：2007-10-04
申请号：US11757750
申请日：2007-06-04
申请人： Hajime SAKAMOTO , Tadashi Sugiyama , Dongdong Wang , Takashi Kariya
发明人： Hajime SAKAMOTO , Tadashi Sugiyama , Dongdong Wang , Takashi Kariya
IPC分类号： H05K1/16
CPC分类号： H01L24/29 , H01L21/4846 , H01L21/4857 , H01L23/13 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L23/544 , H01L24/19 , H01L24/24 , H01L24/32 , H01L24/83 , H01L25/03 , H01L25/18 , H01L2223/54426 , H01L2223/54473 , H01L2223/5448 , H01L2223/54486 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16 , H01L2224/16227 , H01L2224/20 , H01L2224/24227 , H01L2224/32225 , H01L2224/45144 , H01L2224/73267 , H01L2224/83192 , H01L2224/92 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01052 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/18162 , H01L2924/30107 , H05K1/185 , H05K3/4602 , H05K2201/09036 , H05K2201/09563 , H05K2201/096 , H05K2201/09918 , H05K2201/10674 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49147 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2224/83 , H01L2224/82 , H01L2924/3512 , H01L2924/00
摘要： A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on the die pad 24, it is possible to prevent resin residues on the pad 24 and to improve connection characteristics between the pad 24 and a via hole 60 and reliability.
摘要翻译：多层印刷电路板预先包括在芯基板30中的IC芯片20和设置在IC芯片20的焊盘24上的过渡层38。由此，可以在不使用引线部件和密封树脂的情况下将IC芯片电连接到多层印刷电路板。此外，通过在芯片焊盘24上设置由铜制成的过渡层38，可以防止焊盘24上的树脂残留，并且改善焊盘24和通孔60之间的连接特性以及可靠性。

70. 发明申请

US20070180861A1 Optical glass element molding method 审中-公开
标题翻译：光学玻璃元件成型方法
公开(公告)号：US20070180861A1
公开(公告)日：2007-08-09
申请号：US11656160
申请日：2007-01-22
申请人： Shunichi Hayamizu , Tadafumi Sakata , Tadashi Sugiyama
发明人： Shunichi Hayamizu , Tadafumi Sakata , Tadashi Sugiyama
IPC分类号： C03B23/00 , C03B29/00
CPC分类号： C03B19/02 , C03B7/12 , C03B11/08 , C03B19/101 , C03B19/1055 , C03B2215/49
摘要： A preform is supplied between a pair of molding dies, followed by heating, softening and pressing. A smallest radius of curvature in the preform is smaller than a radius of a globular member having a volume equal to that of the preform. In this fabricating method, -an abutment portion between the molding die and the preform is located at a curved surface or the center of the molding die, thereby preventing any local abutment of the preform against the molding die.
摘要翻译：在一对模具之间提供预制件，然后进行加热，软化和压制。预制件中最小的曲率半径小于体积与预制件的体积相等的球形构件的半径。在这种制造方法中，成型模和预制件之间的邻接部分位于成型模具的弯曲表面或中心处，从而防止预成型件与成型模具的任何局部邻接。

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