专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

61. 发明申请

US20100105288A1 MULTIPLE LIBRARIES FOR SPECTROGRAPHIC MONITORING OF ZONES OF A SUBSTRATE DURING PROCESSING 有权
标题翻译：用于在加工过程中基板区域的光谱监测的多个图表
公开(公告)号：US20100105288A1
公开(公告)日：2010-04-29
申请号：US12258923
申请日：2008-10-27
申请人： Jeffrey Drue David , Boguslaw A. Swedek , Harry Q. Lee
发明人： Jeffrey Drue David , Boguslaw A. Swedek , Harry Q. Lee
IPC分类号： B24B49/04 , B24B49/12
CPC分类号： B24B49/12 , B24B37/042 , B24B49/04
摘要： Methods, systems, and apparatus, including computer program products, for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes receiving a first sequence of current spectra of reflected light from a first zone of a substrate. A second sequence of current spectra of reflected light from a second zone of the substrate is received. Each current spectrum from the first sequence of current spectra is compared to a plurality of reference spectra from a first reference spectra library to generate a first sequence of best-match reference spectra. Each current spectrum from the second sequence of current spectra is compared to a plurality of reference spectra from a second reference spectra library to generate a second sequence of best-match reference spectra. The second reference spectra library is distinct from the first reference spectra library.
摘要翻译：描述了用于在化学机械抛光期间对衬底的光谱监测的方法，系统和装置，包括计算机程序产品。在一个方面，计算机实现的方法包括从衬底的第一区域接收反射光的当前光谱的第一序列。接收来自基板的第二区域的反射光的第二序列的电流光谱。将来自当前光谱的第一序列的每个当前光谱与来自第一参考光谱库的多个参考光谱进行比较，以生成最佳匹配参考光谱的第一序列。将来自当前光谱的第二序列的每个当前光谱与来自第二参考光谱库的多个参考光谱进行比较，以生成第二序列的最佳匹配参考光谱。第二个参考光谱库与第一个参考光谱库不同。

62. 发明申请

US20110275167A1 Endpoint Method Using Peak Location Of Modified Spectra 有权
标题翻译：端点方法使用修改光谱的峰位置
公开(公告)号：US20110275167A1
公开(公告)日：2011-11-10
申请号：US13090934
申请日：2011-04-20
申请人： Jeffrey Drue David , Garrett Ho Yee Sin , Harry Q. Lee , Dominic J. Benvegnu
发明人： Jeffrey Drue David , Garrett Ho Yee Sin , Harry Q. Lee , Dominic J. Benvegnu
IPC分类号： H01L21/66
CPC分类号： B24B37/013 , H01L22/12 , H01L22/26
摘要： A method of optically monitoring a substrate during polishing includes receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing, measuring a first spectrum from the substrate during polishing, the first spectrum measured within an initial time following initiation of polishing, measuring a sequence of second spectra from the substrate during polishing, the sequence of second spectra measured after the initial time, for each second spectrum in the sequence of second spectra, removing the first spectrum from the second spectrum to generate a sequence of modified third spectra, determining a value of a characteristic of the selected spectral feature for each third spectrum in the sequence of third spectra to generate a sequence of values for the characteristic, and determining a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.
摘要翻译：在抛光期间光学监测基底的方法包括接收所选择的光谱特征的标识和所选择的光谱特征的特征以在抛光期间监测，在抛光期间测量来自基底的第一光谱，在初始时间之后测量的第一光谱开始抛光，在抛光期间测量来自衬底的第二光谱序列，在初始时间之后测量的第二光谱序列，对于第二光谱序列中的每个第二光谱，从第二光谱去除第一光谱以产生序列修改的第三光谱，确定第三光谱序列中的每个第三光谱的所选光谱特征的特征值，以产生该特征值的序列，并且基于以下步骤确定抛光终点或抛光速率的调整：值序列。

63. 发明授权

US08202738B2 Endpoint method using peak location of modified spectra 有权
标题翻译：端点方法使用修改光谱的峰位置
公开(公告)号：US08202738B2
公开(公告)日：2012-06-19
申请号：US13090934
申请日：2011-04-20
申请人： Jeffrey Drue David , Garrett Ho Yee Sin , Harry Q. Lee , Dominic J. Benvegnu
发明人： Jeffrey Drue David , Garrett Ho Yee Sin , Harry Q. Lee , Dominic J. Benvegnu
IPC分类号： H01L21/66
CPC分类号： B24B37/013 , H01L22/12 , H01L22/26
摘要： A method of optically monitoring a substrate during polishing includes receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing, measuring a first spectrum from the substrate during polishing, the first spectrum measured within an initial time following initiation of polishing, measuring a sequence of second spectra from the substrate during polishing, the sequence of second spectra measured after the initial time, for each second spectrum in the sequence of second spectra, removing the first spectrum from the second spectrum to generate a sequence of modified third spectra, determining a value of a characteristic of the selected spectral feature for each third spectrum in the sequence of third spectra to generate a sequence of values for the characteristic, and determining a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.
摘要翻译：在抛光期间光学监测基底的方法包括接收所选择的光谱特征的标识和所选择的光谱特征的特征以在抛光期间监测，在抛光期间测量来自基底的第一光谱，在初始时间之后测量的第一光谱开始抛光，在抛光期间测量来自衬底的第二光谱序列，在初始时间之后测量的第二光谱序列，对于第二光谱序列中的每个第二光谱，从第二光谱去除第一光谱以产生序列修改的第三光谱，确定第三光谱序列中的每个第三光谱的所选光谱特征的特征值，以产生该特征值的序列，并且基于以下步骤确定抛光终点或抛光速率的调整：值序列。

64. 发明申请

US20120034845A1 TECHNIQUES FOR MATCHING MEASURED SPECTRA TO REFERENCE SPECTRA FOR IN-SITU OPTICAL MONITORING 审中-公开
标题翻译：将测量光谱匹配到用于现场光学监测的参考光谱的技术
公开(公告)号：US20120034845A1
公开(公告)日：2012-02-09
申请号：US13198635
申请日：2011-08-04
申请人： Xiaoyuan Hu , Zhihong Wang , Harry Q. Lee , Zhize Zhu , Jeffrey Drue David , Dominic J. Benvegnu , Jimin Zhang , Wen-Chiang Tu
发明人： Xiaoyuan Hu , Zhihong Wang , Harry Q. Lee , Zhize Zhu , Jeffrey Drue David , Dominic J. Benvegnu , Jimin Zhang , Wen-Chiang Tu
IPC分类号： B24B49/00 , B24B51/00
CPC分类号： B24B37/013 , B24B37/042 , B24B37/107 , B24B37/205 , B24B49/045 , B24B49/12
摘要： A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum using a matching technique other than sum of squared differences to generate a sequence of best matching reference spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of best matching reference spectra. Finding a best matching reference spectrum may include performing a cross-correlation of the measured spectrum with each of two or more of the plurality of reference spectra from the library and selecting a reference spectrum with the greatest correlation to the measured spectrum as a best matching reference spectrum.
摘要翻译：控制抛光的方法包括：存储具有多个参考光谱的库，抛光衬底，在抛光期间测量来自衬底的光的光谱序列，对于光谱序列的每个测量光谱，使用除了平方差的和以产生最佳匹配参考光谱的序列之外的匹配技术，以及基于最佳匹配参考光谱的序列来确定抛光终点或抛光速率的调整中的至少一个。找到最佳匹配的参考光谱可以包括执行所测量的光谱与来自文库的多个参考光谱中的两个或更多个的互相关，并且选择与所测量的光谱具有最大相关性的参考光谱作为最佳匹配参考光谱。

65. 发明申请

US20140113524A1 ENDPOINTING WITH SELECTIVE SPECTRAL MONITORING 有权
标题翻译：选择性光谱监测
公开(公告)号：US20140113524A1
公开(公告)日：2014-04-24
申请号：US13658737
申请日：2012-10-23
申请人： Jun Qian , Sivakumar Dhandapani , Benjamin Cherian , Thomas H. Osterheld , Jeffrey Drue David , Gregory E. Menk , Boguslaw A. Swedek , Doyle E. Bennett
发明人： Jun Qian , Sivakumar Dhandapani , Benjamin Cherian , Thomas H. Osterheld , Jeffrey Drue David , Gregory E. Menk , Boguslaw A. Swedek , Doyle E. Bennett
IPC分类号： B24B37/013 , B24B49/12
CPC分类号： B24B37/013 , B24B49/12
摘要： A method of controlling polishing includes polishing a substrate, monitoring the substrate during polishing with an in-situ spectrographic monitoring system to generate a sequence of measured spectra, selecting less than all of the measured spectra to generate a sequence of selected spectra, generating a sequence of values from the sequence of selected spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.
摘要翻译：控制抛光的方法包括抛光衬底，用原位光谱监测系统在抛光期间监测衬底以产生测量光谱序列，选择少于所有测量光谱以产生选定光谱序列，产生序列根据所选光谱的序列的值，并且基于所述值序列来确定抛光终点或抛光速率的调整中的至少一个。

66. 发明授权

US09221147B2 Endpointing with selective spectral monitoring 有权
标题翻译：以选择性光谱监测为终点
公开(公告)号：US09221147B2
公开(公告)日：2015-12-29
申请号：US13658737
申请日：2012-10-23
申请人： Jun Qian , Sivakumar Dhandapani , Benjamin Cherian , Thomas H. Osterheld , Jeffrey Drue David , Gregory E. Menk , Boguslaw A. Swedek , Doyle E. Bennett
发明人： Jun Qian , Sivakumar Dhandapani , Benjamin Cherian , Thomas H. Osterheld , Jeffrey Drue David , Gregory E. Menk , Boguslaw A. Swedek , Doyle E. Bennett
IPC分类号： G06F19/00 , B24B37/013 , B24B49/12
CPC分类号： B24B37/013 , B24B49/12
摘要： A method of controlling polishing includes polishing a substrate, monitoring the substrate during polishing with an in-situ spectrographic monitoring system to generate a sequence of measured spectra, selecting less than all of the measured spectra to generate a sequence of selected spectra, generating a sequence of values from the sequence of selected spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.
摘要翻译：控制抛光的方法包括抛光衬底，用原位光谱监测系统在抛光期间监测衬底以产生测量光谱序列，选择少于所有测量光谱以产生选定光谱序列，产生序列根据所选光谱的序列的值，并且基于所述值序列来确定抛光终点或抛光速率的调整中的至少一个。

67. 发明申请

US20160020157A1 POLISHING WITH EDDY CURRENT FEED MEAUREMENT PRIOR TO DEPOSITION OF CONDUCTIVE LAYER 有权
标题翻译：在导电层沉积之前用EDDY电流进料抛光
公开(公告)号：US20160020157A1
公开(公告)日：2016-01-21
申请号：US14800246
申请日：2015-07-15
申请人： Tomohiko Kitajima , Jeffrey Drue David , Jun Qian , Taketo Sekine , Garlen C. Leung , Sidney P. Huey
发明人： Tomohiko Kitajima , Jeffrey Drue David , Jun Qian , Taketo Sekine , Garlen C. Leung , Sidney P. Huey
IPC分类号： H01L21/66 , H01L21/3105 , H01L21/67 , H01L21/321
CPC分类号： H01L22/26 , B24B37/013 , B24B49/105 , H01L21/31053 , H01L21/31055 , H01L21/31111 , H01L21/31116 , H01L21/3212 , H01L21/67075 , H01L21/67092 , H01L21/67253 , H01L22/14 , H01L22/20 , H01L22/34 , H01L27/11556 , H01L27/11582
摘要： A method of controlling polishing includes storing a base measurement, the base measurement being an eddy current measurement of a substrate after deposition of at least one layer overlying a semiconductor wafer and before deposition of a conductive layer over the at least one layer, after deposition of the conductive layer over the at least one layer and during polishing of the conductive layer on substrate, receiving a sequence of raw measurements of the substrate from an in-situ eddy current monitoring system, normalizing each raw measurement in the sequence of raw measurement to generate a sequence of normalized measurements using the raw measurement and the base measurement, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least the sequence of normalized measurements.
摘要翻译：控制抛光的方法包括：在淀积位于半导体晶片上方的至少一层之后，以及在沉积导电层之后，至少沉积一层之后，存储基底测量，基底测量是衬底的涡流测量，在至少一层上的导电层和在衬底上的导电层的抛光期间，从原位涡流监测系统接收衬底的原始测量序列，使原始测量序列中的每个原始测量标准化以产生使用原始测量和基础测量的归一化测量序列，以及至少基于归一化测量的序列来确定抛光终点或抛光速率的调整中的至少一个。

68. 发明授权

US08467896B2 Feedback for polishing rate correction in chemical mechanical polishing 有权
标题翻译：化学机械抛光抛光率校正的反馈
公开(公告)号：US08467896B2
公开(公告)日：2013-06-18
申请号：US13480434
申请日：2012-05-24
申请人： Jun Qian , Charles C. Garretson , Sivakumar Dhandapani , Jeffrey Drue David , Harry Q. Lee
发明人： Jun Qian , Charles C. Garretson , Sivakumar Dhandapani , Jeffrey Drue David , Harry Q. Lee
IPC分类号： G06F19/00 , B24B49/04 , B24B49/12
CPC分类号： B24B49/04 , B24B49/12
摘要： A substrate having a plurality of zones is polished and spectra are measured. For each zone, a first linear function fits a sequence of index values associated with reference spectra that best match the measured spectra. A projected time at which a reference zone will reach the target index value is determined based on the first linear function, and for at least one adjustable zone, a polishing parameter adjustment is calculated such that the adjustable zone has closer to the target index at the projected time than without such adjustment. The adjustment is calculated based on a feedback error calculated for a previous substrate. The feedback error for a subsequent substrate is calculated based on a second linear function that fits a sequence of index values associated with reference spectra that best match spectra measured after the polishing parameter is adjusted.
摘要翻译：研磨具有多个区域的基板并测量光谱。对于每个区域，第一个线性函数拟合与参考光谱相关联的索引值序列，该参考光谱与测量的光谱最匹配。基于第一线性函数确定参考区域将达到目标指标值的预计时间，并且对于至少一个可调整区域，计算抛光参数调整，使得可调节区域更接近目标索引处的目标索引预计时间比没有这样的调整。基于对先前基板计算的反馈误差来计算调整。基于适合与调整抛光参数之后测量的最佳匹配光谱的参考光谱相关联的索引值序列的第二线性函数来计算后续衬底的反馈误差。

69. 发明授权

US08666665B2 Automatic initiation of reference spectra library generation for optical monitoring 有权
标题翻译：用于光学监测的自动启动参考光谱库生成
公开(公告)号：US08666665B2
公开(公告)日：2014-03-04
申请号：US13088144
申请日：2011-04-15
申请人： Jeffrey Drue David , Harry Q. Lee , Jun Qian , Jimin Zhang
发明人： Jeffrey Drue David , Harry Q. Lee , Jun Qian , Jimin Zhang
IPC分类号： G06F19/00 , H01L21/00
CPC分类号： G01J3/46 , B24B37/013 , B24B37/042 , B24B49/12
摘要： A method of generating reference spectra includes polishing a first substrate in a polishing apparatus, measuring a sequence of spectra from the first substrate during polishing with an in-situ optical monitoring system, for each spectrum in the sequence of spectra, determining a best matching reference spectrum from a first plurality of first reference spectra to generate a sequence of reference spectra, calculating a value of a metric of fit of the sequence of spectra to the sequence of reference spectra, comparing the value of the metric of fit to a threshold value and determining whether to generate a second library based on the comparison, and if the second library is determined to be generated, storing the sequence of spectra as a second plurality of reference spectra.
摘要翻译：产生参考光谱的方法包括抛光抛光装置中的第一衬底，在光谱序列中的每个光谱下，用原位光学监测系统在抛光期间测量来自第一衬底的光谱序列，确定最佳匹配参考频谱从第一多个第一参考光谱生成参考光谱序列，计算光谱序列的拟合度量与参考光谱序列的值，将拟合度量的值与阈值进行比较，以及基于所述比较确定是否生成第二库，以及如果确定要生成所述第二库，则将所述光谱序列存储为第二多个参考光谱。

70. 发明授权

US08190285B2 Feedback for polishing rate correction in chemical mechanical polishing 有权
标题翻译：化学机械抛光抛光率校正的反馈
公开(公告)号：US08190285B2
公开(公告)日：2012-05-29
申请号：US12781644
申请日：2010-05-17
申请人： Jun Qian , Charles C. Garretson , Sivakumar Dhandapani , Jeffrey Drue David , Harry Q Lee
发明人： Jun Qian , Charles C. Garretson , Sivakumar Dhandapani , Jeffrey Drue David , Harry Q Lee
IPC分类号： G06F19/00 , B24B49/04 , B24B49/12
CPC分类号： B24B49/04 , B24B49/12
摘要： A substrate having a plurality of zones is polished and spectra are measured. For each zone, a first linear function fits a sequence of index values associated with reference spectra that best match the measured spectra. A projected time at which a reference zone will reach the target index value is determined based on the first linear function, and for at least one adjustable zone, a polishing parameter adjustment is calculated such that the adjustable zone has closer to the target index at the projected time than without such adjustment. The adjustment is calculated based on a feedback error calculated for a previous substrate. The feedback error for a subsequent substrate is calculated based on a second linear function that fits a sequence of index values associated with reference spectra that best match spectra measured after the polishing parameter is adjusted.
摘要翻译：研磨具有多个区域的基板并测量光谱。对于每个区域，第一个线性函数拟合与参考光谱相关联的索引值序列，该参考光谱与测量的光谱最匹配。基于第一线性函数确定参考区域将达到目标指标值的预计时间，并且对于至少一个可调整区域，计算抛光参数调整，使得可调节区域更接近目标索引处的目标索引预计时间比没有这样的调整。基于对先前基板计算的反馈误差来计算调整。基于适合与调整抛光参数之后测量的最佳匹配光谱的参考光谱相关联的索引值序列的第二线性函数来计算后续衬底的反馈误差。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式