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61. 发明申请

US20220209480A1 ELECTRODE CONNECTION STRUCTURE AND DETECTION DEVICE 有权
公开(公告)号：US20220209480A1
公开(公告)日：2022-06-30
申请号：US17554244
申请日：2021-12-17
申请人： KELK Ltd.
发明人： Tomonori MURATA
IPC分类号： H01R39/10 , H01R39/34
摘要： An electrode connection structure includes a first electrode unit that includes first electrodes formed concentrically, and a second electrode unit that includes a second electrode formed into a needle shape axially movable forward and rearward and is electrically connectable to the first electrode unit, and in the electrode connection structure, the second electrode unit includes a plurality of the second electrodes that is arranged in a circumferential direction and arranged at different radial positions, and the plurality of the second electrodes is electrically connected to the first electrodes arranged at different radial positions, respectively.

62. 发明申请

US20220115575A1 THERMOELECTRIC POWER-GENERATING DEVICE 有权
公开(公告)号：US20220115575A1
公开(公告)日：2022-04-14
申请号：US16492661
申请日：2018-03-06
申请人： KELK Ltd.
发明人： Kazuya Makino , Hirokuni Hachiuma
IPC分类号： H01L35/32
摘要： A thermoelectric generator includes: a heat-receiving plate (2) having a heat-receiving surface (2A) configured to receive radiant heat; a thermoelectric generation module provided to a surface of the heat-receiving plate (2) opposite from the heat-receiving surface (2A) and having an area smaller than an area of the heat-receiving plate (2); a cooling plate provided to a surface of the thermoelectric generation module opposite from a surface where the heat-receiving plate (2) is provided; and a temperature equalizer (22) provided to the heat-receiving plate (2) and configured to equalize a temperature of the heat-receiving surface (2A).

63. 发明申请

US20220005997A1 THERMOELECTRIC GENERATION MODULE 有权
公开(公告)号：US20220005997A1
公开(公告)日：2022-01-06
申请号：US17360712
申请日：2021-06-28
申请人： KELK Ltd.
发明人： Masakazu OBA
IPC分类号： H01L35/32 , H01L35/34 , H01L35/20
摘要： A thermoelectric generation module includes a first substrate and a second substrate, a plurality of first electrodes and second electrodes that are arranged on the first substrate and the second substrate, a thermoelectric conversion element arranged between the first electrode and the second electrode, and a terminal pin connected to the second electrode. The second substrate includes an insulator layer made of an electrical insulating material, a through-hole that penetrates the insulator layer for insertion of the terminal pin, and an annular metal layer arranged at a peripheral portion of the through-hole. A space between the terminal pin and the through-hole is sealed by solder.

64. 发明申请

US20220005996A1 THERMOELECTRIC POWER GENERATION MODULE 有权
公开(公告)号：US20220005996A1
公开(公告)日：2022-01-06
申请号：US17360608
申请日：2021-06-28
申请人： KELK Ltd.
发明人： Masakazu OBA
IPC分类号： H01L35/08
摘要： A thermoelectric power generation module includes two substrates, a thermoelectric conversion element, a sealing portion sealing peripheral edges of upper and lower surfaces, a first solder between the upper surface and the sealing portion, and a second solder between the lower surface and the sealing portion. At least one of outer and inner edges of the first solder or the sealing portion is deviated from the first solder or the sealing portion. At least one of outer and inner edges of the second solder or the sealing portion is deviated from the second solder or the sealing portion. At least one of the outer and inner edges of the first solder has a fillet shape between the upper surface and the sealing portion. At least one of the outer and inner edges of the second solder has a fillet shape between the lower surface and the sealing portion.

65. 发明申请

US20210358776A1 TEMPERATURE ADJUSTMENT DEVICE AND METHOD FOR MANUFACTURING TEMPERATURE ADJUSTMENT DEVICE 有权
公开(公告)号：US20210358776A1
公开(公告)日：2021-11-18
申请号：US17284228
申请日：2019-10-30
申请人： KELK Ltd.
发明人： Atsushi KOBAYASHI , Hideaki OHKUBO
IPC分类号： H01L21/67 , H01L35/34
摘要： A temperature adjustment device includes a flow path plate that includes a flow path groove, a heat transfer plate that faces the flow path groove, and a thermoelectric module plate that is connected to the heat transfer plate. A surface roughness of the flow path plate is 0.20 μm or more and 0.25 μm or less.

66. 发明申请

US20210202820A1 METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION ELEMENT AND THERMOELECTRIC CONVERSION ELEMENT 有权
公开(公告)号：US20210202820A1
公开(公告)日：2021-07-01
申请号：US17273516
申请日：2019-07-11
申请人： KELK Ltd.
发明人： Tetsushi TANAKA , Katsushi FUKUDA , Mikio KOYANO , Tatsuya SHIMODA
IPC分类号： H01L35/32 , H01L35/34
摘要： A method for manufacturing a thermoelectric conversion element includes forming a thermoelectric film containing a thermoelectric material on a surface of a substrate, pressing the thermoelectric film with a mold to form a pattern of the thermoelectric film on the surface of the substrate, and heating the pattern of the thermoelectric film formed on the surface of the substrate to generate the thermoelectric conversion element.

67. 发明申请

US20210076457A1 LIQUID HEATING DEVICE AND CLEANING SYSTEM 有权
公开(公告)号：US20210076457A1
公开(公告)日：2021-03-11
申请号：US16963367
申请日：2019-02-04
申请人： KELK Ltd.
发明人： Kazuhiro MIMURA
IPC分类号： H05B1/02 , B08B3/10
摘要： A liquid heating device includes a circulation flow path that is connected to a branch flow path through which a first liquid supplied to an object flows, a heating device that is disposed in the circulation flow path and heats the first liquid flowing through the circulation flow path, and a cooling device that cools the first liquid flowing through the circulation flow path in a state where supply of the first liquid to the object is stopped.

68. 发明申请

US20200321503A1 THERMOELECTRIC GENERATION DEVICE 审中-公开
公开(公告)号：US20200321503A1
公开(公告)日：2020-10-08
申请号：US16763300
申请日：2018-11-22
申请人： KELK Ltd.
发明人： Toshihiko KISHIZAWA , Yoshitsugu KITSU , Shinichi FUJIMOTO
IPC分类号： H01L35/04
摘要： A thermoelectric generation device includes a thermoelectric generation module, a fan rotatable about a rotation axis and disposed on one side of the thermoelectric generation module in a first axis direction parallel to the rotation axis, a cover member which includes a facing plate disposed on one side of the fan in the first axis direction and facing the fan and a side plate disposed around the fan from the one side of the fan toward the other side thereof, a first intake port in the facing plate, a second intake port which is provided in the side plate and of which at least a portion is disposed on the one side with respect to the fan in the first axis direction, and an exhaust port in the side plate and disposed on the other side with respect to the fan in the first axis direction.

69. 发明授权

US10325788B2 Temperature controller of semiconductor wafer and temperature control method of semiconductor wafer 有权
公开(公告)号：US10325788B2
公开(公告)日：2019-06-18
申请号：US15461610
申请日：2017-03-17
申请人： Kelk Ltd.
发明人： Kazuhiro Mimura
IPC分类号： G05B13/04 , G05D23/19 , H01L21/67
摘要： A manipulated variable calculator having a plurality of control loops and configured to calculate manipulated variables to be respectively given to a plurality of temperature adjusters includes: a reference model output generator configured to generate a reference model that generates a response output until reaching a temperature setpoint when, in the plurality of control loops, a manipulated variable of a control loop having the slowest response speed is defined as 100%; a simulator configured to sequentially search for a switching time to determine a manipulated variable pattern; a reference model configured to generate a reference model output based on the searched switching time; and a reference model selecting unit configured to select the reference model depending on a heating responsiveness and a cooling responsiveness of the temperature adjusters.

70. 发明授权

US10224472B2 Thermoelectric power module 有权
公开(公告)号：US10224472B2
公开(公告)日：2019-03-05
申请号：US14909159
申请日：2014-08-25
申请人： KELK LTD.
发明人： Shinichi Fujimoto , Hiroyuki Matsunami
IPC分类号： H01L35/16 , H01L35/32 , H01L35/04 , H01L35/18 , H01L35/08
摘要： A thermoelectric power module which can be manufactured without spoiling solderability or joining strength when a thermoelectric element and an electrode are joined to each other by using solder, and in which electric resistance does not largely increase in long time use. The thermoelectric power module includes: a thermoelectric element consisting essentially of a thermoelectric material containing at least two kinds of elements of bismuth, tellurium, antimony, and selenium as principal components; at least one diffusion prevention layer and a solder joint layer disposed in sequence on a surface of the thermoelectric element, the at least one diffusion prevention layer not containing nickel, and the solder joint layer consisting essentially of at least one of nickel, tin, and an alloy or compound containing them as principal components; an electrode; an electrode protection layer disposed at least on one principal surface of the electrode, and including a film containing nickel as a principal component and having a thickness of 0.2 μm to 3.0 μm; and a solder layer joining the solder joint layer to a partial area of the electrode protection layer.

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