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    • 64. 发明授权
    • Method of fabricating systems including heat-sensitive memory devices
    • 制造包括热敏记忆装置的系统的方法
    • US08166234B2
    • 2012-04-24
    • US12631267
    • 2009-12-04
    • Jun-Ho JangWoonjae ChungHungjun An
    • Jun-Ho JangWoonjae ChungHungjun An
    • G06F13/00
    • G06F9/4401H01L27/115
    • A system code is stored in a first nonvolatile memory. The first nonvolatile memory and a second nonvolatile memory are heated during assembly of an electronic device including the first nonvolatile memory and a second nonvolatile memory. The heating is to a temperature sufficient to change a state of at least some memory cells in the second nonvolatile memory device. After the heating, the system code stored in the first nonvolatile memory is copied into the second nonvolatile memory. The first nonvolatile memory may he less vulnerable to temperature-related data alteration than the second nonvolatile memory. For example, the first nonvolatile memory may include a NAND flash memory and the second nonvolatile memory may include a variable resistance memory.
    • 系统码存储在第一非易失性存储器中。 在包括第一非易失性存储器和第二非易失性存储器的电子设备的组装期间,第一非易失性存储器和第二非易失性存储器被加热。 加热到足以改变第二非易失性存储器件中的至少一些存储单元的状态的温度。 在加热之后,存储在第一非易失性存储器中的系统代码被复制到第二非易失性存储器中。 与第二非易失性存储器相比,第一非易失性存储器可能不太容易受到与温度有关的数据改变的影响。 例如,第一非易失性存储器可以包括NAND闪存,并且第二非易失性存储器可以包括可变电阻存储器。
    • 70. 发明申请
    • METHOD OF FABRICATING SYSTEMS INCLUDING HEAT-SENSITIVE MEMORY DEVICES
    • 包含热敏记忆体装置的制造方法
    • US20100153628A1
    • 2010-06-17
    • US12631267
    • 2009-12-04
    • Jun-Ho JangWoonjae ChungHungjun An
    • Jun-Ho JangWoonjae ChungHungjun An
    • G06F12/02G11C11/00G11C7/00G11C16/06G11C7/10
    • G06F9/4401H01L27/115
    • A system code is stored in a first nonvolatile memory. The first nonvolatile memory and a second nonvolatile memory are heated during assembly of an electronic device including the first nonvolatile memory and a second nonvolatile memory. The heating is to a temperature sufficient to change a state of at least some memory cells in the second nonvolatile memory device. After the heating, the system code stored in the first nonvolatile memory is copied into the second nonvolatile memory. The first nonvolatile memory may he less vulnerable to temperature-related data alteration than the second nonvolatile memory. For example, the first nonvolatile memory may include a NAND flash memory and the second nonvolatile memory may include a variable resistance memory.
    • 系统代码存储在第一非易失性存储器中。 在包括第一非易失性存储器和第二非易失性存储器的电子设备的组装期间,第一非易失性存储器和第二非易失性存储器被加热。 加热到足以改变第二非易失性存储器件中的至少一些存储单元的状态的温度。 在加热之后,存储在第一非易失性存储器中的系统代码被复制到第二非易失性存储器中。 与第二非易失性存储器相比,第一非易失性存储器可能不太容易受到与温度有关的数据改变的影响。 例如,第一非易失性存储器可以包括NAND闪存,并且第二非易失性存储器可以包括可变电阻存储器。