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61. 发明授权

US5105773A Method and apparatus for enhancing combustion in an internal combustion engine through electrolysis 失效
标题翻译：通过电解提高内燃机燃烧的方法和装置
公开(公告)号：US5105773A
公开(公告)日：1992-04-21
申请号：US779886
申请日：1991-10-21
申请人： John E. Cunningham , Roland E. Goodenough
发明人： John E. Cunningham , Roland E. Goodenough
IPC分类号： C25B1/02 , F02B43/10 , F02M25/12
CPC分类号： F02B43/10 , C25B1/02 , F02M25/12 , Y02T10/121 , Y02T10/32 , Y10S123/12
摘要： The present invention 10 comprises a hollow main canister 11 having a series of anodes 25 and cathodes 29 interposed therein for the electrolysis of an electrolytic fluid F, such as potassium hydroxide. The electrolytic reaction is powered through the use of a current source 36 which positively charge the anodes immersed in the electrolytic fluid F. The produced ionized oxygen and hydrogen from the electrolytic reaction is directed through the canister through the combustion situs 45 of an internal combustion fuel/air mixture system through the use of a delivery tube 22. A flash arrestor 44 is used to ensure no flame or backfire migrates through the system and the level of fluid is optically monitored through the use of a liquid level sensor 46. The oxygen and hydrogen interposed within the combustion situs enhances combustion and the cleanliness of the same thereby producing a cleaner and more efficient burn of the hydrocarbon fuel.
摘要翻译：本发明10包括具有一系列阳极25和插入其中的阴极29用于电解电解液F如氢氧化钾的中空主体11。通过使用电流源36对电解反应进行动力，电流源36对浸入电解液F中的阳极进行充电。从电解反应中产生的电离氧和氢通过罐通过内燃燃料的燃烧位置45 /空气混合物系统。使用闪络器44来确保没有火焰或反火通过系统迁移，并且通过使用液位传感器46光学监测流体的水平。氧气和插入在燃烧区域内的氢能够增强燃烧和其清洁度，从而产生更清洁和更有效地燃烧烃燃料。

62. 发明授权

US08772920B2 Interconnection and assembly of three-dimensional chip packages 有权
标题翻译：三维芯片封装的互连和组装
公开(公告)号：US08772920B2
公开(公告)日：2014-07-08
申请号：US13182220
申请日：2011-07-13
申请人： Hiren D. Thacker , John E. Cunningham , Ivan Shubin , Ashok V. Krishnamoorthy
发明人： Hiren D. Thacker , John E. Cunningham , Ivan Shubin , Ashok V. Krishnamoorthy
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L25/18 , H01L25/50 , H01L2224/13005 , H01L2224/13017 , H01L2224/13027 , H01L2224/13109 , H01L2224/13111 , H01L2224/13147 , H01L2224/14181 , H01L2224/14183 , H01L2224/16105 , H01L2224/16108 , H01L2224/16111 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/481 , H01L2224/48227 , H01L2224/73103 , H01L2224/81138 , H01L2224/81899 , H01L2225/06551 , H01L2225/06555 , H01L2225/06593 , H01L2924/01327 , H01L2924/07802 , H01L2924/12042 , H01L2924/01082 , H01L2924/00014 , H01L2924/01047 , H01L2924/01029 , H01L2924/00012 , H01L2924/00
摘要： In a chip package, semiconductor dies in a vertical stack of semiconductor dies or chips (which is referred to as a ‘plank stack’) are aligned by positive features that are mechanically coupled to negative features recessed below the surfaces of adjacent semiconductor dies. Moreover, the chip package includes an interposer plate at approximately a right angle to the plank stack, which is electrically coupled to the semiconductor dies along an edge of the plank stack. In particular, electrical pads proximate to a surface of the interposer plate (which are along a stacking direction of the plank stack) are electrically coupled to pads that are proximate to edges of the semiconductor dies by an intervening conductive material, such as solder balls or spring connectors. Note that the chip package may facilitate high-bandwidth communication of signals between the semiconductor dies and the interposer plate.
摘要翻译：在芯片封装中，半导体管芯或芯片（被称为“板堆叠”）的垂直堆叠中的半导体管芯通过机械耦合到相邻半导体管芯的表面下方的负特性的正特征对准。此外，芯片封装包括与板堆叠大致成直角的插入板，其沿着板堆的边缘电耦合到半导体管芯。特别地，靠近插入板的表面（沿着板堆叠的堆叠方向）的电焊盘通过中间导电材料（例如焊料球）电耦合到靠近半导体管芯的边缘的焊盘，弹簧连接器。注意，芯片封装可以促进半导体管芯和插入板之间的信号的高带宽通信。

63. 发明授权

US08670671B2 Energy-efficient optical source 有权
标题翻译：节能光源
公开(公告)号：US08670671B2
公开(公告)日：2014-03-11
申请号：US13361866
申请日：2012-01-30
申请人： Ashok V. Krishnamoorthy , Xuezhe Zheng , John E. Cunningham
发明人： Ashok V. Krishnamoorthy , Xuezhe Zheng , John E. Cunningham
IPC分类号： H04J14/00 , H04J14/02
CPC分类号： H04J14/02 , H04B10/506 , H04J14/0221
摘要： An optical source includes a set of N light sources that provide a corresponding set of N optical signals having N carrier wavelengths. These optical signals are combined into a seed optical signal and transported to a substrate using an optical fiber. This substrate includes a set of K optical amplifiers that amplify the seed optical signal and provide a set of M output optical signals on a corresponding set of M output optical waveguides (where M is less than K). In this way, a total power of the set of M output optical signals may be significantly larger than that of the seed optical signal, thereby ensuring that a majority of a power efficiency of the optical source is associated with power efficiencies of the set of K optical amplifiers instead of power efficiencies of the set of N light sources.
摘要翻译：光源包括一组N个光源，其提供具有N个载波波长的相应的一组N个光信号。这些光信号被组合成种子光信号，并使用光纤传输到基板。该衬底包括一组放大种子光信号的K个放大器，并在相应的一组M个输出光波导（其中M小于K）上提供一组M个输出光信号。以这种方式，一组M个输出光信号的总功率可以显着大于种子光信号的总功率，从而确保光源的大部分功率效率与该组K的功率效率相关联光放大器而不是N组光源的功率效率。

64. 发明授权

US08548287B2 Direct interlayer optical coupler 有权
标题翻译：直接层间光耦合器
公开(公告)号：US08548287B2
公开(公告)日：2013-10-01
申请号：US13293624
申请日：2011-11-10
申请人： Hiren D. Thacker , Xuezhe Zheng , Ivan Shubin , Kannan Raj , John E. Cunningham , Ashok V. Krishnamoorthy
发明人： Hiren D. Thacker , Xuezhe Zheng , Ivan Shubin , Kannan Raj , John E. Cunningham , Ashok V. Krishnamoorthy
IPC分类号： G02B6/12
CPC分类号： G02B6/26 , Y10T29/49826
摘要： In an MCM, an optical signal is conveyed by an optical waveguide disposed on a surface of a first substrate to an optical coupler having a vertical facet. This optical coupler has an optical mode that is different than the optical mode of the optical waveguide. For example, the spatial extent of the optical mode associated with the optical coupler may be larger, thereby reducing optical losses and sensitivity to alignment errors. Then, the optical signal is directly coupled from the vertical facet to a facing vertical facet of an identical optical coupler on another substrate, and the optical signal is conveyed in another optical waveguide disposed on the other substrate.
摘要翻译：在MCM中，光信号由设置在第一基板的表面上的光波导传送到具有垂直面的光耦合器。该光耦合器具有与光波导的光学模式不同的光学模式。例如，与光耦合器相关联的光学模式的空间范围可能更大，从而减少光学损耗和对准误差的灵敏度。然后，光信号从另一基板上的垂直面到同一光耦合器的面向垂直面直接耦合，并且光信号在设置在另一基板上的另一光波导中传送。

65. 发明申请

US20130207261A1 MAINTAINING ALIGNMENT IN A MULTI-CHIP MODULE USING A COMPRESSIBLE STRUCTURE 有权
标题翻译：使用可压缩结构在多芯片模块中维护对齐
公开(公告)号：US20130207261A1
公开(公告)日：2013-08-15
申请号：US13397593
申请日：2012-02-15
申请人： Hiren D. Thacker , Hyung Suk Yang , Ivan Shubin , John E. Cunningham
发明人： Hiren D. Thacker , Hyung Suk Yang , Ivan Shubin , John E. Cunningham
IPC分类号： H01L23/498 , H01L21/50 , H01L23/488
CPC分类号： H01L25/0652 , H01L23/48 , H01L24/16 , H01L24/72 , H01L24/73 , H01L24/90 , H01L24/91 , H01L25/50 , H01L2224/131 , H01L2224/16227 , H01L2224/73201 , H01L2224/73251 , H01L2224/81138 , H01L2224/81815 , H01L2224/9211 , H01L2225/06517 , H01L2225/06527 , H01L2225/06531 , H01L2225/06562 , H01L2225/06593 , H01L2924/15153 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/3511 , H01L2924/37001 , H01L2924/00 , H01L2924/014 , H01L2224/16 , H01L2224/72 , H01L2224/81 , H01L2224/90 , H01L2924/00014 , H01L2924/00012
摘要： An MCM includes a two-dimensional array of facing chips, including island chips and bridge chips that communicate with each other using overlapping connectors. In order to maintain the relative vertical spacing of these connectors, compressible structures are in cavities in a substrate, which house the bridge chips, provide a compressive force on back surfaces of the bridge chips. These compressible structures include a compliant material with shape and volume compression. In this way, the MCM may ensure that facing surfaces of the island chips and the bridge chips, as well as connectors on these surfaces, are approximately coplanar without bending the bridge chips.
摘要翻译： MCM包括面向芯片的二维阵列，包括使用重叠连接器彼此通信的岛芯片和桥芯片。为了保持这些连接器的相对垂直间隔，可压缩结构位于衬底中的空腔中，其容纳桥芯片，在桥芯片的后表面上提供压缩力。这些可压缩结构包括具有形状和体积压缩的柔性材料。以这种方式，MCM可以确保岛芯片和桥芯片的面对表面以及这些表面上的连接器在不弯曲桥接芯片的情况下大致共面。

66. 发明授权

US08467632B2 Waveguide electro-absorption modulator 有权
标题翻译：波导电吸收调制器
公开(公告)号：US08467632B2
公开(公告)日：2013-06-18
申请号：US12986062
申请日：2011-01-06
申请人： Xuezhe Zheng , John E. Cunningham , Ashok V. Krishnamoorthy
发明人： Xuezhe Zheng , John E. Cunningham , Ashok V. Krishnamoorthy
IPC分类号： G02F1/01
CPC分类号： G02F1/025 , G02F2001/0157
摘要： During operation of an electro-absorption modulator, an optical signal is conveyed, using an optical waveguide in the electro-absorption modulator, to a semiconductor layer that substantially fills a gap between two portions of the optical waveguide. Then, the optical signal is electro-absorption modulated by selectively applying a voltage to electrodes that produces an electric field, approximately perpendicular to the midline of the optical waveguide, in the semiconductor layer. These electrodes are coupled to the edges of the semiconductor layer at the periphery along the width of the semiconductor layer by intervening layers. Furthermore, the intervening layers include a material that has a lower index of refraction than the semiconductor layer, and a lower optical absorption than the electrodes.
摘要翻译：在电吸收调制器的操作期间，使用电吸收调制器中的光波导将光信号传送到基本上填充光波导的两个部分之间的间隙的半导体层。然后，通过选择性地向在半导体层中产生大致垂直于光波导的中线的电场的电极施加电压来对光信号进行电吸收调制。这些电极通过中间层沿半导体层的宽度在周边连接到半导体层的边缘。此外，中间层包括具有比半导体层低的折射率的材料，并且具有比电极更低的光学吸收。

67. 发明授权

US08267583B2 Three-dimensional macro-chip including optical interconnects 有权
标题翻译：三维宏片包括光互连
公开(公告)号：US08267583B2
公开(公告)日：2012-09-18
申请号：US12581709
申请日：2009-10-19
申请人： Jin Yao , Xuezhe Zheng , Ashok V. Krishnamoorthy , John E. Cunningham
发明人： Jin Yao , Xuezhe Zheng , Ashok V. Krishnamoorthy , John E. Cunningham
IPC分类号： G02B6/26 , G02B6/34 , G02B6/12
CPC分类号： G02B6/13 , G02B6/12002
摘要： A multi-chip module (MCM), which includes a three-dimensional (3D) stack of chips that are coupled using optical interconnects, is described. In this MCM, disposed on a first surface of a middle chip in the 3D stack, there are: a first optical coupler, an optical waveguide, which is coupled to the first optical coupler, and a second optical coupler, which is coupled to the optical waveguide. The first optical coupler redirects an optical signal from the optical waveguide to a first direction (which is not in the plane of the first surface), or from the first direction to the optical waveguide. Moreover, the second optical coupler redirects the optical signal from the optical waveguide to a second direction (which is not in the plane of the first surface), or from the second direction to the optical waveguide. Note that an optical path associated with the second direction passes through an opening in a substrate in the middle chip.
摘要翻译：描述了包括使用光学互连耦合的三维（3D）芯片堆叠的多芯片模块（MCM）。在该MCM中，设置在3D堆叠中的中间芯片的第一表面上，存在：耦合到第一光耦合器的第一光耦合器，光波导和耦合到第三光耦合器的第二光耦合器，光波导。第一光学耦合器将来自光波导的光信号重定向到第一方向（其不在第一表面的平面中）或从第一方向到光波导。此外，第二光学耦合器将来自光波导的光信号重定向到第二方向（其不在第一表面的平面）或从第二方向到光波导。注意，与第二方向相关联的光路通过中间芯片中的衬底中的开口。

68. 发明授权

US08207752B2 Fault-tolerant multi-chip module 有权
标题翻译：容错多芯片模块
公开(公告)号：US08207752B2
公开(公告)日：2012-06-26
申请号：US12685159
申请日：2010-01-11
申请人： Kannan Raj , Xuezhe Zheng , Ashok V. Krishnamoorthy , Ronald Ho , Michael O. McCracken , David K. McElfresh , John E. Cunningham
发明人： Kannan Raj , Xuezhe Zheng , Ashok V. Krishnamoorthy , Ronald Ho , Michael O. McCracken , David K. McElfresh , John E. Cunningham
IPC分类号： H03K19/003
CPC分类号： H03K19/177
摘要： A multi-chip module (MCM) is described. This MCM includes multiple sites, where a given site in the multiple sites includes multiple chips with proximity connectors that communicate information through proximity communication within the MCM via multiple components associated with the given site. Note that the MCM includes global redundancy and local redundancy at the given site. In particular, the global redundancy involves providing one or more redundant sites in the multiple sites. Furthermore, the local redundancy involves providing one or more redundant chips in the multiple chips and one or more redundant components in the multiple components.
摘要翻译：描述了多芯片模块（MCM）。该MCM包括多个站点，其中多个站点中的给定站点包括具有邻近连接器的多个芯片，其通过与给定站点相关联的多个组件在MCM内通过邻近通信传递信息。请注意，MCM包括给定站点的全局冗余和本地冗余。特别地，全局冗余涉及在多个站点中提供一个或多个冗余站点。此外，本地冗余包括在多个芯片中提供一个或多个冗余芯片以及在多个组件中提供一个或多个冗余组件。

69. 发明授权

US08089995B2 Structures and methods for adjusting the wavelengths of lasers via temperature control 有权
标题翻译：通过温度控制调节激光波长的结构和方法
公开(公告)号：US08089995B2
公开(公告)日：2012-01-03
申请号：US11485594
申请日：2006-07-12
申请人： Ashok V. Krishnamoorthy , John E. Cunningham , Bruce M. Guenin , Howard L. Davidson
发明人： Ashok V. Krishnamoorthy , John E. Cunningham , Bruce M. Guenin , Howard L. Davidson
IPC分类号： H01S3/04
CPC分类号： H01S5/423 , H01S5/005 , H01S5/02453 , H01S5/02461 , H01S5/0261 , H01S5/0422 , H01S5/0612 , H01S5/18305 , H01S5/18327 , H01S5/4087
摘要： One embodiment of the present invention provides a system that facilitates adjusting the wavelengths of lasers via temperature control. This system includes a chip with an active face upon which active circuitry and signal pads reside. A thermal-control mechanism provides localized thermal control of two lasers mounted upon the active face of the chip. By individually controlling the temperature of the lasers, the thermal-control mechanism controls the wavelengths emitted by each respective laser. By creating a temperature gradient that causes a temperature difference between two or more lasers, the system can cause the lasers to emit different wavelengths.
摘要翻译：本发明的一个实施例提供一种通过温度控制有助于调节激光器的波长的系统。该系统包括具有有源电路和信号焊盘所在的有源面的芯片。热控制机构提供安装在芯片的主动面上的两个激光器的局部热控制。通过单独控制激光器的温度，热控制机构控制由各个激光器发射的波长。通过产生导致两个或更多个激光器之间的温度差的温度梯度，该系统可以使激光器发射不同的波长。

70. 发明授权

US08076178B2 Self-assembly of micro-structures 有权
标题翻译：微结构的自组装
公开(公告)号：US08076178B2
公开(公告)日：2011-12-13
申请号：US11864369
申请日：2007-09-28
申请人： Ashok V. Krishnamoorthy , John E. Cunningham , James G. Mitchell
发明人： Ashok V. Krishnamoorthy , John E. Cunningham , James G. Mitchell
IPC分类号： H01L21/00 , H01L21/20
CPC分类号： H01L23/48 , H01L25/0657 , H01L25/50 , H01L2224/16 , H01L2225/06513 , H01L2225/06531 , H01L2225/06534 , H01L2225/06593 , H01L2924/01079 , H01L2924/10253 , H01L2924/00
摘要： Embodiments of a method for assembling a multi-chip module (MCM) are described. During this method, a fluid that includes coupling elements is applied to a surface of a base plate in the MCM. Then, at least some of the coupling elements are positioned into negative features on the surface of the base plate using fluidic assembly. Note that a given coupling element selects a given negative feature using chemical-based selection and/or geometry-based selection. Next, the fluid and excess coupling elements (which reside in regions outside of the negative features on the surface) are removed.
摘要翻译：描述了用于组装多芯片模块（MCM）的方法的实施例。在该方法中，包括耦合元件的流体被施加到MCM中的基板的表面。然后，使用流体组件将至少一些联接元件定位在基板的表面上的负特征中。注意，给定的耦合元件使用基于化学的选择和/或基于几何的选择来选择给定的负特征。接下来，去除流体和过量的耦合元件（其位于表面上的负特征之外的区域中）。

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