专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

61. 发明授权

US09035189B2 Circuit board with flexible region and method for production thereof 有权
标题翻译：具有柔性区域的电路板及其制造方法
公开(公告)号：US09035189B2
公开(公告)日：2015-05-19
申请号：US12997867
申请日：2009-06-08
申请人： Wolfgang Pahl , Hans Krueger , Peter Demmer
发明人： Wolfgang Pahl , Hans Krueger , Peter Demmer
IPC分类号： H05K1/00 , H05K1/18 , H05K3/46
CPC分类号： H05K1/189 , H01L2224/16225 , H05K3/4691 , H05K2201/0394 , H05K2201/09081 , H05K2201/09109 , H05K2203/308 , Y10T29/49124 , Y10T428/24322
摘要： A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region.
摘要翻译：一种电路板，包括电路载体，由非导电材料构成的覆盖层，包括布置在电路载体上的有机物质，至少部分地布置在覆盖层上的第一金属化层，其中第一金属化层具有柔性区域。

62. 发明申请

US20130214405A1 Component and Method for Producing a Component 有权
标题翻译：组件和生产组件的方法
公开(公告)号：US20130214405A1
公开(公告)日：2013-08-22
申请号：US13818916
申请日：2011-07-29
申请人： Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl
发明人： Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl
IPC分类号： B81B7/00 , B81C1/00
CPC分类号： B81B7/0077 , B81B2207/093 , B81C1/00269 , B81C1/00333 , B81C2203/0109 , B81C2203/0118 , H01L2224/16225 , H01L2224/8114 , H01L2924/1461 , H01L2924/00
摘要： A component includes a substrate, a chip and a frame. The frame is bonded to the substrate and the chip rests on the frame. A sealing layer on parts of the frame and the chip is designed to hermetically seal a volume enclosed by the substrate, the chip and the metal frame.
摘要翻译：部件包括基板，芯片和框架。框架结合到基板，芯片搁置在框架上。框架和芯片的部件上的密封层被设计成密封由衬底，芯片和金属框架包围的体积。

63. 发明申请

US20130140656A1 MEMS Microphone And Method For Producing The MEMS Microphone 有权
标题翻译： MEMS麦克风及其制造方法
公开(公告)号：US20130140656A1
公开(公告)日：2013-06-06
申请号：US13805630
申请日：2011-07-07
申请人： Wolfgang Pahl , Hans Krueger , Gregor Feiertag , Alois Stelzl , Anton Leidl , Stefan Seitz
发明人： Wolfgang Pahl , Hans Krueger , Gregor Feiertag , Alois Stelzl , Anton Leidl , Stefan Seitz
IPC分类号： B81B7/00 , B81C1/00
CPC分类号： B81B7/0061 , B81B2201/0257 , B81B2207/096 , B81C1/00309 , H01L2224/16225 , H01L2924/15151 , H01L2924/16151 , H04R1/086 , H04R1/38 , H04R19/005 , H04R19/04 , H04R29/004 , H04R31/006
摘要： The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (SO1) is produced in the carrier (TR); a functional test of the microphone is carried out; the first sound inlet opening (SO1) is closed; and a second sound inlet opening (SO2) is created in the cover. The present invention further relates to a microphone resulting from the method, in which the first sound inlet opening (SO1) is prepared but closed.
摘要翻译：本发明涉及一种用于制造麦克风的方法，其中传感器元件（WE）安装在载体（TR）上; 换能器元件（WE）和载体（TR）之间布置有覆盖物，使得换能器元件（WE）被封闭在盖体和载体（TR）之间; 在载体（TR）中产生第一声音入口（SO1）; 进行麦克风的功能测试; 第一声音入口开口（SO1）关闭; 并且在盖中产生第二声音入口开口（SO2）。本发明还涉及一种由该方法产生的麦克风，其中第一声音入口开口（SO1）准备但关闭。

64. 发明申请

US20090001553A1 Mems Package and Method for the Production Thereof 有权
标题翻译： Mems包及其制作方法
公开(公告)号：US20090001553A1
公开(公告)日：2009-01-01
申请号：US12092439
申请日：2006-11-06
申请人： Wolfgang Pahl , Anton Leidl , Stefan Seitz , Hans Krueger , Alois Stelzl
发明人： Wolfgang Pahl , Anton Leidl , Stefan Seitz , Hans Krueger , Alois Stelzl
IPC分类号： H01L23/12 , H01L21/00
CPC分类号： B81B7/0064 , B81B2201/0257 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/07811 , H01L2924/1461 , H01L2924/3025 , H04R1/04 , H04R19/005 , H01L2924/00014 , H01L2924/00
摘要： A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.
摘要翻译：本文描述了微机电系统（MEMS）封装。封装包括具有顶侧的载体衬底，安装在载体衬底的顶侧上的MEMS芯片以及在载体衬底的顶侧上或上方嵌入载体衬底中的至少一个芯片组件。封装还包括覆盖MEMS芯片和芯片部件的薄金属屏蔽层，并与载体基板的顶侧形成密封。

65. 发明授权

US06982380B2 Encapsulated component which is small in terms of height and method for producing the same 有权
标题翻译：高度小的密封部件及其制造方法
公开(公告)号：US06982380B2
公开(公告)日：2006-01-03
申请号：US10500371
申请日：2002-12-11
申请人： Christian Hoffmann , Jürgen Portmann , Hans Krueger
发明人： Christian Hoffmann , Jürgen Portmann , Hans Krueger
IPC分类号： H01L23/28 , H05K5/06
CPC分类号： H03H9/1078 , H01L24/31 , H01L29/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/16225 , H01L2224/16237 , H01L2224/291 , H01L2224/29111 , H01L2224/73203 , H01L2224/83136 , H01L2224/83951 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01068 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/0133 , H01L2924/09701 , H01L2924/10157 , H01L2924/12042 , H01L2924/1517 , H01L2924/15787 , H01L2924/3025 , H01L2924/351 , H03H9/059 , H01L2924/0105 , H01L2224/13111 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： For simpler and safer encapsulation of components, it is proposed to generate the connection between a chip and a carrier substrate by means of bump connections that are sunk into recesses on the carrier substrate. The component thereby lies directly on the carrier substrate, in particular on a frame circumscribing the component structures on the chip.
摘要翻译：为了更简单和更安全地封装组件，建议通过沉积在载体衬底上的凹陷中的凸块连接来产生芯片和载体衬底之间的连接。因此，该部件直接位于载体基板上，特别是在限定芯片上的部件结构的框架上。

66. 发明申请

US20050121785A1 Method for the hermetic encapsulation of a component 有权
标题翻译：组件气密封装的方法
公开(公告)号：US20050121785A1
公开(公告)日：2005-06-09
申请号：US10500279
申请日：2002-12-18
申请人： Alois Stelzl , Hans Krueger , Ernst Christl
发明人： Alois Stelzl , Hans Krueger , Ernst Christl
IPC分类号： H01L23/04 , H01L21/56 , H03H9/10 , H03H9/25 , H01L21/48 , H01L23/48
CPC分类号： H03H9/1078 , H01L21/561 , H01L24/97 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01052 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/12042 , H01L2924/15174 , H01L2224/81 , H01L2924/00
摘要： For hermetic encapsulation of a component, which includes a chip with component structures applied on a substrate in a flip-chip construction, a material is applied onto the lower edge of the chip and regions of the substrate abutting the chip, and then a first continuous metal layer is applied on the back side of the chip and on the material, as well as on edge regions of the substrate abutting the material. For hermetic encapsulation, a second sealing metal layer is subsequently applied by a solvent-free process at least on those regions of the first metal layer that cover the material.
摘要翻译：对于包括具有以倒装芯片结构施加在基板上的部件结构的芯片的部件的气密封装，将材料施加到芯片的下边缘和邻接芯片的基板的区域，然后施加第一连续金属层被施加在芯片的背面和材料上，以及与衬底邻接的材料的边缘区域上。为了气密封装，随后通过无溶剂工艺至少在覆盖材料的第一金属层的那些区域上施加第二密封金属层。

67. 发明授权

US06722030B1 Process for manufacturing an electronic component, in particular a surface-wave component working with acoustic surface waves 有权
标题翻译：用于制造电子部件的工艺，特别是用声表面波工作的表面波部件
公开(公告)号：US06722030B1
公开(公告)日：2004-04-20
申请号：US09622351
申请日：2000-11-13
申请人： Alois Stelzl , Hans Krueger , Peter Demmer
发明人： Alois Stelzl , Hans Krueger , Peter Demmer
IPC分类号： H05K330
CPC分类号： H01L24/97 , H01L23/552 , H01L2224/16225 , H01L2224/73253 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01052 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/3025 , H03H3/08 , Y10T29/4913 , Y10T29/49139 , Y10T29/49142 , Y10T29/49146 , Y10T29/49171 , Y10T29/49789 , H01L2224/81
摘要： A method is provided for manufacturing a saw filter in which a carrier plate 10 that can be separated into base plates 2 is respectively provided with interconnects in the base plate regions A and these are contacted to the active structures of SAW chips 1 in flip-chip technique. A metal foil 3 or plastic film 4 is placed onto the chip-equipped carrier plate 10 and, for example, is pressure and heat treated such that it envelopes each chip 1 (except for the chip surface facing toward the carrier plate 10) and lies hermetically tight on the carrier plate surface in regions between the chips.
摘要翻译：提供了一种用于制造锯切式过滤器的方法，其中可分离成基板2的承载板10在基板区域A中分别设置有互连，并且这些接触件与倒装芯片中的SAW芯片1的有源结构接触技术。将金属箔3或塑料膜4放置在装有芯片的承载板10上，并且例如进行压力和热处理，使得其包围每个芯片1（除了面向载体板10的芯片表面）并且位于在芯片之间的区域中，在承载板表面上气密地密封。

68. 发明授权

US5271029A Waveguide laser for use at high laser power 失效
标题翻译：波导激光器用于高激光功率
公开(公告)号：US5271029A
公开(公告)日：1993-12-14
申请号：US916030
申请日：1992-07-17
申请人： Werner Seiffarth , Hans Krueger
发明人： Werner Seiffarth , Hans Krueger
IPC分类号： H01S3/03
CPC分类号： H01S3/0315
摘要： A waveguide laser having a pair of electrodes mounted opposite one another in the gas discharge space is provided with a spacer extending between the two electrodes. The spacer prevents movement of the electrodes from a mutually parallel position which may otherwise occur due to mechanical stresses in the laser. Beam quality is thereby maintained. The spacer has only a limited extent in the direction transverse to beam travel and/or is of a material transmissive to laser light to prevent detrimental effects on the laser. The spacer is particularly useful in CO.sub.2 lasers, such as pulsed lasers.
摘要翻译：具有在气体放电空间中彼此相对安装的一对电极的波导激光器设置有在两个电极之间延伸的间隔物。间隔件防止电极从相互平行的位置移动，否则可能由于激光器中的机械应力而发生。从而保持光束质量。间隔物在横向于光束移动的方向上仅具有有限的程度和/或具有透射于激光的材料，以防止对激光器的不利影响。间隔器在二氧化碳激光器（例如脉冲激光器）中特别有用。

69. 发明授权

US5268923A Mirror mount for lasers 失效
标题翻译：激光镜镜座
公开(公告)号：US5268923A
公开(公告)日：1993-12-07
申请号：US929132
申请日：1992-08-13
申请人： Wolfgang Welsch , Hans Krueger , Klemens Huener , Guenter Kellerer , Rudolf Haeusler , Joerg Moehnle , Peter Geschka
发明人： Wolfgang Welsch , Hans Krueger , Klemens Huener , Guenter Kellerer , Rudolf Haeusler , Joerg Moehnle , Peter Geschka
IPC分类号： H01S3/034 , H01S3/08
CPC分类号： H01S3/034
摘要： A mirror mount for a resonator mirror of a gas laser which is cost-beneficial and simple to manufacture is composed of a tube of easily-workable material, for example steel, and a mirror receptacle that has a coefficient of thermal expansion matched to that of the mirror being supported in the receptacle. The mirror receptacle has a holding region that embraces the resonator mirror and has a spacer region that defines the minimum distance of the mirror from the end of the tube, whereby the mirror receptacle is deformable in a radial direction so that stresses caused by temperature fluctuations will not produce any damage to the mirror.
摘要翻译：一种成本低廉且易于制造的气体激光共振镜的反射镜安装件由易于加工的材料管（例如钢）和反射镜容器组成，该容器的热膨胀系数与镜子被支撑在容器中。反射镜容器具有包围谐振镜的保持区域，并且具有限定反射镜与管的端部的最小距离的间隔区域，由此反射镜容器可沿径向方向变形，使得由温度波动引起的应力将不会对镜子造成任何损坏。

70. 发明授权

US5220576A Slab or stripline laser 失效
标题翻译： SLAB或条纹激光
公开(公告)号：US5220576A
公开(公告)日：1993-06-15
申请号：US751556
申请日：1991-08-29
申请人： Hans Krueger , Walter Kirschner
发明人： Hans Krueger , Walter Kirschner
IPC分类号： H01S3/03 , H01S3/038 , H01S3/041 , H01S3/06
CPC分类号： H01S3/038 , H01S3/0315
摘要： Slab or stripline laser. In a slab or stripline laser that contains two electrodes (1, 26) and two resonator mirrors (2, 3), the electrodes (1, 26) are executed shape-stable and the mirrors (2, 3) and a second electrode (26) are secured to and carried by the first electrode (1). The invention is suitable for compact stripline lasers.
摘要翻译：平板或带状线激光。在包含两个电极（1,26）和两个谐振镜（2,3）的平板或带状线激光器中，电极（1,26）被执行形状稳定，并且反射镜（2,3）和第二电极 26）固定并由第一电极（1）承载。本发明适用于紧凑型带状线激光器。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式