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51. 发明授权

US07232988B2 Microprocessor based automatically dimmable eye protection device with interruption prevention 有权
标题翻译：基于微处理器的自动可调光眼睛保护装置，具有中断预防
公开(公告)号：US07232988B2
公开(公告)日：2007-06-19
申请号：US11089930
申请日：2005-05-05
申请人： Thomas J. Hamilton , Barry D. Scott
发明人： Thomas J. Hamilton , Barry D. Scott
IPC分类号： H01J5/02 , G02F1/1335
CPC分类号： A61F9/06 , A61F9/067
摘要： An auto darkening eye protection device comprising a shutter assembly adjustable between a clear state and a dark state and a control circuit. The control circuit is provided with a microcontroller, a delivery circuit, a sensing circuit and a weld detect circuit. The microcontroller is switchable between a sleep mode and a wake-up mode. The delivery circuit outputs a dark state drive signal to the shutter assembly to switch the shutter assembly from the clear state to the dark state upon enablement of the delivery circuit. The sensing circuit senses the occurrence of a welding arc and provides an output indicative of the occurrence of the welding arc. The weld detect circuit receives the output of the sensing circuit. The weld detect circuit enables a dark state drive signal to be delivered to the shutter assembly by the delivery circuit, and a signal to be delivered to the microcontroller to switch the microcontroller from the sleep mode to the wake-up mode whereby the shutter assembly is switched to the dark state without the aid of the microcontroller. The microcontroller can compensate for a startup of the microcontroller which was not caused by user power-up by bypassing at least one of a plurality of initialization and calibration routines for the auto darkening eye protection device. The microcontroller also includes a protective casing disposed generally thereabout to substantially prevent electromagnetic fields from interfering with the operation of the microcontroller.
摘要翻译：一种自动变暗眼保护装置，包括可在清除状态和暗状态之间调节的快门组件和控制电路。控制电路设置有微控制器，输送电路，检测电路和焊接检测电路。微控制器可在睡眠模式和唤醒模式之间切换。输送电路将暗状态驱动信号输出到快门组件，以在输送电路启用时将快门组件从清除状态切换到暗状态。感测电路感测焊接电弧的发生，并且提供表示焊接电弧的发生的输出。焊接检测电路接收感测电路的输出。焊接检测电路使得暗态驱动信号能够通过传送电路传送到快门组件，以及要传送到微控制器的信号，以将微控制器从休眠模式切换到唤醒模式，由此快门组件无需微控制器的帮助即可切换到黑暗状态。微控制器可以通过绕过用于自动变暗眼保护装置的多个初始化和校准程序中的至少一个来补偿微控制器的启动，其不是由用户上电引起的。微控制器还包括一般保护壳体，其基本上防止电磁场干扰微控制器的操作。

52. 发明授权

US07205533B2 Cooling apparatus 有权
标题翻译：冷却装置
公开(公告)号：US07205533B2
公开(公告)日：2007-04-17
申请号：US11209313
申请日：2005-08-23
申请人： Uwe Hingst
发明人： Uwe Hingst
IPC分类号： H01J5/02 , F25B41/00 , F28D7/12 , F28D7/02 , G05D16/00 , G05D23/00
CPC分类号： F25B9/02 , F25B2309/023
摘要： A cooling apparatus (10) for cooling a detector (52), the cooling apparatus including an inner and an outer countercurrent heat exchanger (12 and 14, respectively) for a first and a second gas in a thermally insulating housing (16), the inner countercurrent heat exchanger (12) being arranged within a sublength of the outer countercurrent heat exchanger (14), and the inner countercurrent heat exchanger (12) being spatially separated from the outer countercurrent heat exchanger (14) by an outer sleeve (18). In this apparatus, the outer sleeve (18) has a partition plate (32) between an expansion nozzle (28) for the first gas located at the end of the inner countercurrent heat exchanger (12) and the remaining part of the outer countercurrent heat exchanger (14).
摘要翻译：一种用于冷却检测器（52）的冷却装置（10），所述冷却装置包括用于隔热壳体（16）中的第一和第二气体的内部和外部逆流热交换器（12和14），内部逆流热交换器（12）布置在外部逆流热交换器（14）的亚长度内，内部逆流热交换器（12）通过外部套筒（18）与外部逆流热交换器（14）空间分离，。在该装置中，外套筒（18）在位于内逆流热交换器（12）的端部的第一气体的膨胀喷嘴（28）和外逆流热源的剩余部分之间具有隔板（32）交换器（14）。

53. 发明申请

US20070075237A1 Optical fiber assembly wrapped across gimbal axes 有权
标题翻译：光纤组件缠绕在万向节轴上
公开(公告)号：US20070075237A1
公开(公告)日：2007-04-05
申请号：US11243562
申请日：2005-10-05
申请人： James Mills , David Garrett , Wayne Sunne , David Knapp , Daniel Brunton , David Anthony , Emmet Anderson , Daniel Harrison , Frank Smith , Jim Hicks
发明人： James Mills , David Garrett , Wayne Sunne , David Knapp , Daniel Brunton , David Anthony , Emmet Anderson , Daniel Harrison , Frank Smith , Jim Hicks
IPC分类号： H01J5/02 , H01J40/14
CPC分类号： F41G7/224 , F41H13/0056 , G01S7/4818 , G01S7/495
摘要： A control mechanism pins an optical fiber assembly on and off gimbal and between gimbals to route the assembly from an off-gimbal optical source across the gimbal axis/axes to an on-gimbal optical element so that the fiber assembly moves with the rotation of the gimbals. To accommodate a relatively large range of motion, the control mechanism is suitably configured to route the fiber assembly in a “U-shaped” loop with one end pinned off-gimbal in a stationary guide track and the other end pinned on-gimbal point in a rotating guide track so that the loose fiber assembly is constrained in the concentric tracks on and off gimbal. As the gimbal rotates, the loop seats onto one guiding track and peels off of the other guiding track while always maintaining its U shape. To accommodate a relatively small range of motion in other gimbal configurations, the control mechanism is suitably configured to pin one end of the fiber assembly off-gimbal and pass the fiber assembly directly over the gimbal where it is pinned on the other side of the gimbal. In a multi-gimbal pointer, the fiber assembly preferably exhibits different mechanical stresses as it crosses the different gimbals.
摘要翻译：控制机构将光纤组件插入和关闭万向节和万向节之间，以将组件从万向节光源穿过万向节轴/轴线到达万向节光学元件，使得光纤组件随着万向节为了适应相对较大的运动范围，控制机构被适当地构造成将光纤组件以“U形”形环路路线固定在固定导轨中，另一端固定在万向节上旋转的导轨，使得松散的纤维集合体被限制在同步轨道上和/或从万向节关闭。当万向架旋转时，环路将位于一个引导轨道上并从另一个引导轨道剥离，同时始终保持其U形。为了适应其他万向架构中的相对较小的运动范围，控制机构适当地构造成将纤维组件的一端分离成万向节，并将纤维组件直接通过万向节，将其固定在万向节的另一侧。在多万向节指针中，纤维组件优选地在穿过不同的万向节时表现出不同的机械应力。

54. 发明申请

US20070069105A1 Camera module with position detecting mechanism 失效
标题翻译：相机模块带位置检测机构
公开(公告)号：US20070069105A1
公开(公告)日：2007-03-29
申请号：US11438007
申请日：2006-05-19
申请人： Jhy-Chain Lin
发明人： Jhy-Chain Lin
IPC分类号： H01J5/02 , G02B27/40 , G02B7/04
CPC分类号： G02B7/08 , G03B3/10
摘要： An exemplary camera module includes a lens holder (10), a lens module (20), a position detecting mechanism (30), and an image pick-up module (40). The lens module includes a lens barrel (11) and one lens received in the lens barrel. The lens barrel is axially movable received in the lens holder. The position detecting mechanism includes a conductive strip (32) disposed on outer periphery of the lens barrel along an axial direction, a number of conductive terminals (36), a number of electrical sources (34), and a processor (38). The conductive terminals are securely arranged on an inner periphery of the lens holder parallel to each other. A cathode of each electrical source is electrically connected to a corresponding conductive terminal. The processor is electrically connected with an anode of each electrical source. The image pick-up module is arranged so as to receive the light from the lens module.
摘要翻译：示例性相机模块包括透镜保持器（10），透镜模块（20），位置检测机构（30）和图像拾取模块（40）。透镜模块包括镜筒（11）和容纳在镜筒中的一个镜片。透镜筒可轴向移动，容纳在透镜保持器中。位置检测机构包括沿轴向设置在镜筒外周上的导电条（32），多个导电端子（36），多个电源（34）和处理器（38）。导电端子彼此平行地牢固地布置在透镜保持器的内周上。每个电源的阴极电连接到相应的导电端子。处理器与每个电源的阳极电连接。图像拾取模块被布置成接收来自透镜模块的光。

55. 发明申请

US20070057148A1 Digital camera module package fabrication method 有权
标题翻译：数码相机模块封装制造方法
公开(公告)号：US20070057148A1
公开(公告)日：2007-03-15
申请号：US11453454
申请日：2006-06-14
申请人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu
发明人： Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu
IPC分类号： H01J5/02 , H01L27/00
CPC分类号： H01L27/14625 , H01L27/14618 , H01L27/14683 , H01L27/14685 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H01L2224/92247 , H01L2924/16195 , H01L2924/00014
摘要： A digital camera module package method includes the steps of: firstly, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces (322); Secondly, mounting an image sensor chip (34) on the base and received in the cavity, the image sensor having a photosensitive area. Thirdly, providing a plurality of wires (36), each electrically connecting the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourthly, applying an adhesive means (3262) around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover (38) on the carrier, where an adhesive means fixes the cover in place.
摘要翻译：数字照相机模块封装方法包括以下步骤：首先，提供一种包括基座（24）和引线框架（320）的载体（30）。基座在其中具有空腔，引线框架包括多个导电片（322）; 其次，将图像传感器芯片（34）安装在基座上并容纳在空腔中，图像传感器具有感光区域。第三，提供多个电线（36），每个电线电连接图像传感器芯片和载体的相应导电片之一。第四，在图像传感器芯片周围施加至少部分地覆盖所有电线的粘合装置（3262）。最后，将透明盖（38）安装在载体上，其中粘合剂将盖固定到位。

56. 发明授权

US07176436B2 Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header 有权
标题翻译：用于制造晶体管轮廓（TO）的方法和装置可以具有陶瓷头
公开(公告)号：US07176436B2
公开(公告)日：2007-02-13
申请号：US10732938
申请日：2003-12-11
申请人： Tieyu Zheng , Eric J. Zbinden
发明人： Tieyu Zheng , Eric J. Zbinden
IPC分类号： H01J40/14 , H01J5/02 , H01L23/12
CPC分类号： G02B6/4206
摘要： A transponder comprises a first TO having a first insulating base, a photodetector mounted on a first side of the first insulating base, and a metal cap hermetically sealed to the first side of the first insulating base to enclose the photodetector. The transponder also comprises a second TO can having a second insulating base, a light generation device mounted on a first side of the second insulating base, and a metal cap hermetically sealed to the first side of the second insulating base to enclose the light generation device. In one embodiment, the transponder operates at 10 GB/s.
摘要翻译：应答器包括具有第一绝缘基座的第一TO，安装在第一绝缘基座的第一侧上的光电检测器和密封到第一绝缘基座的第一侧以包围光电检测器的金属盖。应答器还包括具有第二绝缘基座的第二TO罐，安装在第二绝缘基座的第一侧上的发光装置和密封到第二绝缘基座的第一侧的金属盖，以封闭光产生装置。在一个实施例中，应答器以10GB / s运行。

57. 发明申请

US20070029472A1 Light emitting and receiving integrated device and optical disk apparatus 审中-公开
标题翻译：发光和接收集成装置和光盘装置
公开(公告)号：US20070029472A1
公开(公告)日：2007-02-08
申请号：US11438377
申请日：2006-05-22
申请人： Kiyoshi Yamauchi
发明人： Kiyoshi Yamauchi
IPC分类号： H01J5/02
CPC分类号： G11B7/123 , G11B7/121
摘要： A light emitting and receiving integrated device is disclosed wherein a light emitting element can be sealed with a sufficiently high degree of air-tightness. The light emitting and receiving integrated device includes a package body, a light emitting element mounted on a first face side of the package body, and a light receiving element mounted on a second face side of the package body remote from the first face. A sealing member seals only the light emitting element on the first face side of the package body.
摘要翻译：公开了一种发光和接收集成装置，其中可以以足够高的气密度密封发光元件。发光和接收集成装置包括封装体，安装在封装体的第一面侧的发光元件和安装在远离第一面的封装体的第二面侧的光接收元件。密封构件只密封包装体的第一面侧上的发光元件。

58. 发明申请

US20070001102A1 Circuit device and method of manufacturing the same 有权
标题翻译：电路装置及其制造方法
公开(公告)号：US20070001102A1
公开(公告)日：2007-01-04
申请号：US11474300
申请日：2006-06-23
申请人： Hiroshi Inoguchi
发明人： Hiroshi Inoguchi
IPC分类号： H01J40/14 , H01L31/00 , H01J5/02
CPC分类号： H01L31/0203 , H01L24/32 , H01L24/73 , H01L33/483 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83191 , H01L2224/83385 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/07802 , H01L2924/12041 , H01L2924/15151 , H01L2924/15311 , H01L2924/16195 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/01026 , H01L2924/01028 , H01L2924/00012
摘要： In a circuit device having a circuit element housed in a case, a rise of air pressure and occurrence of condensation in the case are prevented. A circuit device of the present invention includes a case formed of a bottom part and a side part, and a cover part covering an upper surface of the side part. In an internal space of the case, a circuit element such as a semiconductor element is housed. In a bottom part of the case, a land and leads are buried. A communicating part which causes the internal space of the case to communicate with an outside of the case is provided in the land. By providing the communicating part, the rise of air pressure and occurrence of condensation in the internal space due to change in temperature are suppressed. Furthermore, in the land made of metal, the communicating part can be easily formed by etching or the like.
摘要翻译：在具有容纳在壳体中的电路元件的电路装置中，防止了空气压力的上升和在该情况下发生冷凝。本发明的电路装置包括由底部和侧部形成的壳体和覆盖侧部的上表面的盖部。在壳体的内部空间中容纳诸如半导体元件的电路元件。在这个案件的底部，土地和铅被埋葬。在该地面设置有使壳体的内部空间与壳体外部通信的通信部。通过设置连通部，抑制由于温度变化引起的空气压力的上升和内部空间的冷凝的发生。此外，在由金属制成的地面中，可以通过蚀刻等容易地形成连通部。

59. 发明申请

US20060289733A1 Stack-type image sensor module 审中-公开
标题翻译：堆叠型图像传感器模块
公开(公告)号：US20060289733A1
公开(公告)日：2006-12-28
申请号：US11226223
申请日：2005-09-15
申请人： Peter Zung , Tzu-Han Lin , Fang-Chang Liu
发明人： Peter Zung , Tzu-Han Lin , Fang-Chang Liu
IPC分类号： H01J5/02
CPC分类号： H01L27/14618 , H01L24/20 , H01L24/24 , H01L2224/04105 , H01L2224/12105 , H01L2224/32145 , H01L2224/73267
摘要： An image sensor module includes an image-sensing unit having a first surface, a second surface and a plurality of first conductive contacts arranged at the second surface, a signal processing unit mounted on the first surface of the image-sensing unit and provided with a plurality of second conductive contacts respectively electrically connected to the first conductive contacts of the image-sensing unit, a plurality of solder balls respectively electrically connected to the second conductive contacts of the signal processing unit for mounting in an external circuit board, and a lens set mounted on the second surface of the image-sensing unit and covering the first conductive contacts of the image-sensing unit.
摘要翻译：图像传感器模块包括具有第一表面，第二表面和布置在第二表面处的多个第一导电触点的图像感测单元，信号处理单元安装在图像感测单元的第一表面上并且具有分别电连接到图像感测单元的第一导电触点的多个第二导电触点，分别电连接到信号处理单元的第二导电触点的多个焊球，用于安装在外部电路板中，以及透镜组安装在图像感测单元的第二表面上并且覆盖图像感测单元的第一导电触点。

60. 发明申请

US20060266938A1 Optical Die-Down Quad Flat Non-Leaded Package 有权
公开(公告)号：US20060266938A1
公开(公告)日：2006-11-30
申请号：US11381827
申请日：2006-05-05
申请人： Jonathan Abela
发明人： Jonathan Abela
IPC分类号： H01J5/02
CPC分类号： H01L27/14618 , H01L2224/16245 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： An optical sensor package that includes an optical sensor die is mounted by flip chip interconnect onto a lead frame in a “die-down” orientation, that is, with the active side of the optical sensor die facing the lead frame. An opening is provided in the lead frame die paddle (pad), and light passes from outside the package through the opening in the lead frame die pad onto light collection elements on the active side of the chip.

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