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51. 发明授权

US07975644B2 Batter applicator with adjustable tilt control for submerger or coating mechanism 失效
标题翻译：用于浸没式或涂层机构的可调式倾斜控制器
公开(公告)号：US07975644B2
公开(公告)日：2011-07-12
申请号：US11830267
申请日：2007-07-30
申请人： Jogesh Chandran
发明人： Jogesh Chandran
IPC分类号： B05C3/02
CPC分类号： A23P20/15 , A23P20/17 , A23P20/18
摘要： A batter applicator with an adjustable coating mechanism is disclosed which includes a frame, a main batter tank, a structure comprising at least one of a submerger and an overflow structure that is adapted to be positioned proximate the main batter tank and actuatable means for tilting the structure relative to a reference horizontal surface.
摘要翻译：公开了一种具有可调节涂覆机构的面糊涂抹器，其包括框架，主电池槽，包括浸没器和溢流结构中的至少一个的结构，其适于定位成靠近主电池槽，以及可致动装置，结构相对于参考水平面。

52. 发明申请

US20110165726A1 METHOD AND ARRANGEMENT FOR PRODUCING A FUNCTIONAL LAYER ON A SEMICONDUCTOR COMPONENT 审中-公开
标题翻译：用于在半导体元件上生产功能层的方法和装置
公开(公告)号：US20110165726A1
公开(公告)日：2011-07-07
申请号：US13059383
申请日：2009-08-26
申请人： Knut Vaas , Berthold Schum , Wilfried Schmidt , Dieter Franke , Ingo Schwirtlich
发明人： Knut Vaas , Berthold Schum , Wilfried Schmidt , Dieter Franke , Ingo Schwirtlich
IPC分类号： H01L31/18 , B05C11/00 , B05C3/02 , B05B1/00
CPC分类号： H01L21/316 , H01L21/02164 , H01L21/02167 , H01L21/0217 , H01L21/02271 , H01L21/02282 , H01L21/228 , H01L21/3148 , H01L21/3185 , H01L21/6715 , H01L31/18
摘要： A method for producing at least one functional layer on at least one region of a surface of a semiconductor component by applying a liquid to at least the one region, where the functional layer has a layer thickness d1 and the liquid required for forming the functional layer having the thickness d1 has a layer thickness d2. In order that functional layers having a desired thin and uniform thickness are produced in a reproducible manner, it is proposed that the liquid is applied to the at least one region of the surface in excess with a layer thickness d3 where d3>d2 and that subsequently, either with the semiconductor component moved in translational fashion or with the semiconductor component arranged in stationary fashion, excess liquid is removed from the surface in a contactless manner to an extent such that the liquid layer has the thickness d2 or approximately the thickness d2.
摘要翻译：一种在半导体部件的表面的至少一个区域上形成至少一个功能层的方法，该方法是在至少一个区域上施加液体，其中功能层具有层厚度d1和形成功能层所需的液体厚度d1具有层厚度d2。为了以可再现的方式制造具有期望的薄且均匀厚度的功能层，提出将液体以层厚度d3（d3> d2）施加到表面的至少一个区域，并且随后无论是半导体部件以平移方式移动还是以固定方式布置的半导体部件，以非接触方式将多余的液体从表面移除到使得液体层具有厚度d2或近似厚度d2的程度。

53. 发明申请

US20110162578A1 FLIP-CHIP MOUNTING METHOD AND BUMP FORMATION METHOD 有权
标题翻译： FLIP-CHIP安装方法和BUMP形成方法
公开(公告)号：US20110162578A1
公开(公告)日：2011-07-07
申请号：US13046151
申请日：2011-03-11
申请人： Koichi Hirano , Seiji Karashima , Takashi Ichiryu , Yoshihiro Tomita , Seiichi Nakatani
发明人： Koichi Hirano , Seiji Karashima , Takashi Ichiryu , Yoshihiro Tomita , Seiichi Nakatani
IPC分类号： H01L21/70 , B05C3/02 , B05C9/14 , B05C13/02 , B05C11/00 , B05C11/10 , H01L21/687
CPC分类号： H01L21/563 , B23K35/0244 , H01L21/67144 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/75 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/1131 , H01L2224/13099 , H01L2224/1319 , H01L2224/133 , H01L2224/16 , H01L2224/75 , H01L2224/83192 , H01L2224/8321 , H01L2224/83815 , H01L2224/83886 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/18161 , H01L2924/30105 , H05K3/323 , H05K3/3436 , H05K3/3484 , H05K2201/10977 , H05K2203/1361 , Y02P70/613 , Y10T29/53178 , H01L2224/05599
摘要： [Problem] To provide a flip-chip mounting method and a bump formation method applicable to flip-chip mounting of a next generation LSI and having high productivity and high reliability.[Means for Solving Problem] A semiconductor chip 20 having a plurality of electrode terminals 12 is held to oppose a circuit board 21 having a plurality of connection terminals 11 with a given gap provided therebetween, and the semiconductor chip 20 and the circuit board 21 in this state are dipped in a dipping bath 40 containing a melted resin 14 including melted solder particles for a given period of time. In this dipping process, the melted solder particles self-assemble between the connection terminals 11 of the circuit board 21 and the electrode terminals 12 of the semiconductor chip 20, so as to form connectors 22 between these terminals. Thereafter, the semiconductor chip 20 and the circuit board 21 are taken out of the dipping bath 40, and the melted resin 14 having permeated into the gap between the semiconductor chip 20 and the circuit board 21 is cured, so as to complete a flip-chip mounting body.
摘要翻译： [问题]提供一种适用于下一代LSI的倒装安装并具有高生产率和高可靠性的倒装芯片安装方法和凸块形成方法。解决问题的手段具有多个电极端子12的半导体芯片20被保持为具有多个连接端子11的电路板21，其间设置有给定的间隙，半导体芯片20和电路板21 将该状态浸渍在包含熔融的焊料颗粒的熔融树脂14的浸渍浴40中一段给定的时间。在该浸渍过程中，熔融的焊料颗粒自组装在电路板21的连接端子11和半导体芯片20的电极端子12之间，从而在这些端子之间形成连接器22。此后，半导体芯片20和电路板21从浸渍浴40中取出，并且已经渗透到半导体芯片20和电路板21之间的间隙中的熔融树脂14固化，芯片安装体。

54. 发明申请

US20110159170A1 APPARATUS FOR AND A METHOD OF DETERMINING CONDITION OF HOT MELT ADHESIVE FOR BINDING OF A PERFECT BOUND BOOK 失效
标题翻译：用于确定热熔粘合剂条件的方法和装置，用于结合完整的书签
公开(公告)号：US20110159170A1
公开(公告)日：2011-06-30
申请号：US12970552
申请日：2010-12-16
申请人： Jeffrey D. Marsh
发明人： Jeffrey D. Marsh
IPC分类号： B05D5/10 , B05C11/00 , B05C3/02 , B05D1/18 , G05D9/12
CPC分类号： G05D24/02
摘要： Apparatus is disclosed for monitoring and signaling when a hot melt adhesive contained in a heated adhesive reservoir should be changed. A wheel is at least partially immersed in the adhesive in the reservoir and is rotated by a motor and a computer controls system controls the operation of the motor. From time to time, the computer control system operates the motor and compares the running current supplied to the motor at which the motor stalls to a predetermined stall running current corresponding to a predetermined viscosity level of the adhesive at which the adhesive exhibits a minimum level of binding characteristics and thus generates a signal to change the adhesive. A method of determining when the adhesive should be changed is also disclosed.
摘要翻译：公开了当包含在加热的粘合剂储存器中的热熔粘合剂应当改变时，用于监测和信号传递的装置。车轮至少部分地浸没在储存器中的粘合剂中并且通过电动机旋转，并且计算机控制系统控制电动机的操作。计算机控制系统不时地操作电动机，并将提供给电动机的电机的运行电流与粘合剂的预定粘度等级相对应的预定失速运行电流进行比较，从而产生改变粘合剂的信号。还公开了确定何时改变粘合剂的方法。

55. 发明申请

US20110091642A1 Apparatus and Method for Transporting Contact Lenses Through Dipping Baths 有权
标题翻译：通过浸浴传送隐形眼镜的装置和方法
公开(公告)号：US20110091642A1
公开(公告)日：2011-04-21
申请号：US12904179
申请日：2010-10-14
申请人： Roger Biel , Katrin Sylke Lorenz , Adrian Michael Woodward , Stephen George Fleck
发明人： Roger Biel , Katrin Sylke Lorenz , Adrian Michael Woodward , Stephen George Fleck
IPC分类号： B05D5/06 , B05C3/02
CPC分类号： B29D11/00125 , B05C3/10 , B05C13/02 , B05D1/18
摘要： There is described an apparatus and method for transporting contact lenses through dipping baths (2, 3, 4) for e.g. rinsing, extraction, coating or loading purposes. The lenses are individually accommodated in respective containers (5) which are capable of enabling a flow of treatment fluid (S) into and out of the container (5). During their automatic transport through the dipping baths (2, 3, 4) the containers (5) are held in carriers (6). Lifters (9) are provided for automatically lowering and raising the carriers (6) in a reciprocating manner along their travel through the dipping bath (2, 3, 4). The reciprocating lowering and raising of the containers (5) is accomplished such, that a portion of each container which accommodates a contact lens remains immersed in the treatment fluid (S) which is contained in the dipping bath (2, 3, 4) while the container (5) suspended from the carrier (6) is advanced through the dipping bath (2, 3, 4) from a starting end to a leaving end thereof.
摘要翻译：描述了通过浸渍浴（2,3,4）输送隐形眼镜的装置和方法，冲洗，萃取，涂装或装载。透镜分别容纳在能够使处理流体（S）流入和流出容器（5）的相应容器（5）中。在通过浸浴（2,3,4）的自动运输过程中，容器（5）保持在托架（6）中。升降器（9）被设置成沿其行进通过浸渍浴（2,3,4）以往复运动的方式自动降低和升高载体（6）。容器（5）的往复式降低和升高是这样实现的：容纳隐形眼镜的每个容器的一部分保持浸没在包含在浸渍浴（2,3,4）中的处理流体（S）中，同时从载体（6）悬挂的容器（5）从起始端到其离开端前进通过浸渍浴（2,3,4）。

56. 发明申请

US20110088615A1 DIP COATING APPARATUS 失效
标题翻译： DIP涂装装置
公开(公告)号：US20110088615A1
公开(公告)日：2011-04-21
申请号：US12758037
申请日：2010-04-12
申请人： SHAO-KAI PEI
发明人： SHAO-KAI PEI
IPC分类号： B05C9/14 , B05C3/02
CPC分类号： B05C3/09 , B05C3/005
摘要： A dip coating apparatus includes a housing and a workpiece holder movably and rotatably received in the housing. The housing includes an immersing portion configured for carrying out immersion process and a drying portion configured for carrying out drying process. The inner spaces of the immersing portion and the drying portion are communicated with each other. The lifting workpiece holder is configured for fixed workpieces thereon and moving and rotating relative to the immersing portion and the drying portion of the housing. The workpieces is driven by the lifting-rotating to carry out the immersion process and the drying process.
摘要翻译：浸涂装置包括壳体和可移动和可旋转地容纳在壳体中的工件保持件。壳体包括构造成用于进行浸渍处理的浸渍部分和构造成进行干燥处理的干燥部分。浸渍部分和干燥部分的内部空间彼此连通。提升工件保持器构造成用于其上的固定工件，并相对于壳体的浸渍部分和干燥部分移动和旋转。工件由提升旋转驱动，进行浸渍处理和干燥处理。

57. 发明授权

US07913644B2 Electroless deposition system 有权
标题翻译：无电沉积系统
公开(公告)号：US07913644B2
公开(公告)日：2011-03-29
申请号：US11537643
申请日：2006-09-30
申请人： Ron Rulkens , Robert D. Tas , Shashank Ravindra Kulkarni , Artur Kolics , Nancy E. Gilbert
发明人： Ron Rulkens , Robert D. Tas , Shashank Ravindra Kulkarni , Artur Kolics , Nancy E. Gilbert
IPC分类号： B05C3/02
CPC分类号： C23C18/1682 , C23C18/1617 , C23C18/1619 , H05K3/187
摘要： An electroless deposition system includes a deposition solution, and saturating the deposition solution with an oxygen concentration in a range from about two thousand parts per million to about twenty thousand parts per million.
摘要翻译：无电解沉积系统包括沉积溶液，并使沉积溶液饱和，氧浓度在约百万分之几到百万分之一的范围内。

58. 发明授权

US07908997B2 Hybrid hot melt adhesive or other thermoplastic material dispensing system 有权
标题翻译：混合热熔胶或其他热塑性材料分配系统
公开(公告)号：US07908997B2
公开(公告)日：2011-03-22
申请号：US11806792
申请日：2007-06-04
申请人： Mel Steven Lessley , Daniel D. Bourget
发明人： Mel Steven Lessley , Daniel D. Bourget
IPC分类号： B05C3/02
CPC分类号： B05C5/0279 , B05C5/0225
摘要： A new and improved hybrid hot melt adhesive or other thermoplastic material dispensing system wherein two or more different hot melt adhesive or other thermoplastic material depositions, comprising, for example, two or more different types of patterns, two or more different types of application techniques or processes, or two or more different types of cyclical operations, can effectively be simultaneously achieved at substantially two or more different locations relative to an underlying substrate. The hybrid system comprises a metering station upon which is mounted a metering head comprising a plurality of metering head dispensing modules, and a pair or remote applicator heads comprising a pair of applicator head dispensing modules.
摘要翻译：一种新的和改进的混合热熔粘合剂或其它热塑性材料分配系统，其中两种或更多种不同的热熔粘合剂或其它热塑性材料沉积物，包括例如两种或多种不同类型的图案，两种或多种不同类型的施用技术或过程或两种或更多种不同类型的循环操作可以在基本上相对于下面的衬底的基本上两个或更多个不同位置同时实现。混合动力系统包括计量站，在该计量站上安装有包括多个计量头分配模块的计量头，以及包括一对施用器头分配模块的一对或远程施用器头。

59. 发明授权

US07895969B2 Method and apparatus for forming outer electrode of electronic component 有权
标题翻译：电子元件外电极形成方法及装置
公开(公告)号：US07895969B2
公开(公告)日：2011-03-01
申请号：US11946526
申请日：2007-11-28
申请人： Katsunori Ogata , Kenichi Aoki
发明人： Katsunori Ogata , Kenichi Aoki
IPC分类号： B05C11/00 , B05C3/00 , B05C3/02
CPC分类号： H01G4/005 , H01C1/14 , H01C1/144 , H01C17/281 , H01G4/228 , H01G9/008 , H01G13/006
摘要： A method for forming an outer electrode capable of reducing a tact time when electrode paste is applied to end surfaces of electronic components a plurality of times. A paste tank 4 having a squeegee blade that is vertically slidable is disposed on a flat board 1 having an area being a plurality of times as large as that of a holding plate in a longitudinal direction of the flat board. A paste film is spread on the flat board by moving the flat board 1 by a length corresponding to the length of one holding plate while a predetermined gap is maintained between the squeegee blade and the flat board. The electrode paste is applied to first end surfaces of electronic components C held by the holding plate H by dipping the first end surfaces of the electronic components C in this paste film. The electrode paste is applied to the first end surfaces of the electronic components a plurality of times by repeating the spreading step and the applying step.
摘要翻译：一种用于形成外电极的方法，其能够在将电极糊剂多次施加到电子部件的端面时减少生产时间。具有可垂直滑动的刮板的糊料罐4设置在平板1上，该平板1的平面板的长度方向的面积为保持板的面积的多倍。通过使平板1移动与一个保持板的长度相对应的长度，同时在刮板和平板之间保持预定的间隙，将糊状物膜分散在平板上。通过将电子部件C的第一端面浸渍在该糊状膜中，将电极浆料涂敷到由保持板H保持的电子部件C的第一端面上。通过重复扩展步骤和施加步骤，将电极浆料多次施加到电子部件的第一端面。

60. 发明申请

US20100312007A1 Solution component recovery method, solution component recovery apparatus, and impregnation process/impregnation component recovery system 有权
标题翻译：溶液成分回收方法，溶液成分回收装置，浸渍工艺/浸渍成分回收系统
公开(公告)号：US20100312007A1
公开(公告)日：2010-12-09
申请号：US12662689
申请日：2010-04-28
申请人： Hiroyuki Kawatsu , Naoshi Ito , Yasuhiko Sugino , Mitsuo Yamamoto , Hideo Noda , Goro Nishimura
发明人： Hiroyuki Kawatsu , Naoshi Ito , Yasuhiko Sugino , Mitsuo Yamamoto , Hideo Noda , Goro Nishimura
IPC分类号： C07C67/48 , B01D17/00 , B05D3/10 , B05C3/02
CPC分类号： B08B3/04 , B01D17/0214 , B08B3/102 , B08B3/14
摘要： A solution component recovery method, a solution component recovery apparatus, and an impregnation process/impregnation component recovery system for separating a first component from a second component. The separation between the first and second components is accomplished by reducing the pressure on a solution that contains the first component, which results in the solidification of the first component in the solution at a temperature that is equal to or higher than a predetermined solidification temperature. The second component, in which the first component is dissolved, is evaporated at a temperature range that is less than the predetermined solidification temperature. The evaporated second component is then recovered by a cooling step.
摘要翻译：溶液成分回收方法，溶液成分回收装置，以及用于从第二成分分离第一成分的浸渍处理/浸渍成分回收系统。通过降低包含第一组分的溶液上的压力来实现第一和第二组分之间的分离，这导致溶液中第一组分在等于或高于预定凝固温度的温度下固化。第一组分溶解的第二组分在小于预定凝固温度的温度范围内蒸发。然后通过冷却步骤回收蒸发的第二组分。

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