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51. 发明授权

US07476037B2 Apparatus for coupling a fiber optic cable to an optoelectronic device, a system including the apparatus, and a method of forming the same 有权
公开(公告)号：US07476037B2
公开(公告)日：2009-01-13
申请号：US11461656
申请日：2006-08-01
申请人： Suresh Golwalkar , Noah Davis , John Burns , Kannan Raj , Phil McClay , Wuchun Chou , Jonathan McFarland
发明人： Suresh Golwalkar , Noah Davis , John Burns , Kannan Raj , Phil McClay , Wuchun Chou , Jonathan McFarland
IPC分类号： G02B6/36 , H01R33/945 , B29D11/00
CPC分类号： G02B6/4231 , G02B6/3817 , G02B6/4201 , G02B6/4212 , G02B6/4249 , G02B6/4284 , G02B6/4292
摘要： A device for forming an optical connection between an optoelectronic device and an optical fiber and for forming an electrical connection between the optoelectronic device and a substrate, a system including the device and materials, and methods of forming the device and system are disclosed. The device for forming an optical connection includes a—light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes guide grooves configured to receive guide pins from a fiber ribbon connector, such that when the fiber ribbon connector is attached to the device, fibers of the ribbon align with the optoelectronic device via the light transmission medium.

52. 发明申请

US20080277571A1 Optoelectronic component 有权
标题翻译：光电元件
公开(公告)号：US20080277571A1
公开(公告)日：2008-11-13
申请号：US12079248
申请日：2008-03-25
申请人： David W. Sherrer , Noel A. Heiks
发明人： David W. Sherrer , Noel A. Heiks
IPC分类号： H01J40/14
CPC分类号： G02B6/4292 , G02B6/4201 , G02B6/4204 , G02B6/4214 , G02B6/4231 , G02B6/4232 , G02B6/4246 , G02B6/4249 , G02B6/4257 , G02B6/4274
摘要： Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.
摘要翻译：提供了包括光电子器件和用于自对准光电器件的结构的光电子部件。还提供了光电子模块和形成光电子部件的方法。

53. 发明授权

US07364368B2 Optoelectronic coupling arrangement and transceiver with such an optoelectronic coupling arrangement 有权
标题翻译：具有这种光电耦合装置的光电耦合布置和收发器
公开(公告)号：US07364368B2
公开(公告)日：2008-04-29
申请号：US11035789
申请日：2005-01-13
申请人： Jorg-Reinhardt Kropp
发明人： Jorg-Reinhardt Kropp
IPC分类号： G02B6/36
CPC分类号： G02B6/4246 , G02B6/4201 , G02B6/4206 , G02B6/4231 , G02B6/4292 , H01L2224/48247 , H01L2224/49171 , H01L2924/00
摘要： An optoelectronic coupling arrangement including a package with electrical terminals, integrated in which are at least one optoelectronic transmitting component and at least one optoelectronic receiving component, which are encapsulated in the package with a non-transparent casting material; and an optomechanical coupling block, which includes a transparent plastic and integrated in which are mechanical aligning structure for attaching an optical connector. In this case, the optomechanical coupling block is connected to the package and at least two optical channels are provided in the package and the optomechanical coupling block for coupling light on the one hand between the at least one optoelectronic transmitting component and an optical connector to be attached and on the other hand between the at least one optoelectronic receiving component and an optical connector to be attached. Furthermore, the invention relates a transceiver with such an optoelectronic coupling arrangement.
摘要翻译：一种光电耦合装置，其包括具有电端子的封装，其中集成有至少一个光电传输部件和至少一个光电接收部件，其被封装在具有非透明铸造材料的封装中; 以及光学机械耦合块，其包括透明塑料并且其中集成有用于附接光学连接器的机械对准结构。在这种情况下，光学机械耦合块连接到封装，并且至少两个光通道设置在封装中，并且光学机械耦合块用于将一方面的光耦合在至少一个光电传输部件与光连接器之间另一方面在所述至少一个光电接收部件和要连接的光连接器之间。此外，本发明涉及具有这种光电耦合装置的收发器。

54. 发明授权

US07355166B2 Optoelectronic component having electrical connection and formation method thereof 有权
标题翻译：具有电连接的光电元件及其形成方法
公开(公告)号：US07355166B2
公开(公告)日：2008-04-08
申请号：US11220884
申请日：2005-09-07
申请人： David W. Sherrer , Noel A. Heiks
发明人： David W. Sherrer , Noel A. Heiks
IPC分类号： H01J5/02
CPC分类号： G02B6/4292 , G02B6/4201 , G02B6/4204 , G02B6/4214 , G02B6/4231 , G02B6/4232 , G02B6/4246 , G02B6/4249 , G02B6/4257 , G02B6/4274
摘要： Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.
摘要翻译：提供了包括光电子器件和用于自对准光电器件的结构的光电子部件。还提供了光电子模块和形成光电子部件的方法。

55. 发明授权

US07221829B2 Substrate assembly for supporting optical component and method of producing the same 有权
标题翻译：用于支撑光学部件的基板组件及其制造方法
公开(公告)号：US07221829B2
公开(公告)日：2007-05-22
申请号：US10782865
申请日：2004-02-23
申请人： Takeshi Oono , Toshikatsu Takada , Mitsugu Onoda , Toshifumi Kojima , Toshikazu Horio , Ayako Kawamura
发明人： Takeshi Oono , Toshikatsu Takada , Mitsugu Onoda , Toshifumi Kojima , Toshikazu Horio , Ayako Kawamura
IPC分类号： G02B6/36
CPC分类号： G02B6/4201 , G02B6/4206 , G02B6/4214 , G02B6/4231 , G02B6/4236 , G02B6/43
摘要： A substrate assembly for supporting an optical component includes a substrate having a front surface and a first recess, a second recess formed portion disposed in the first recess and having a second recess smaller in diameter than the first recess and having an open end at least at a side corresponding to the front surface, the second recess formed portion being made of a material having a machinability better than a material forming the substrate, and an alignment guide member fitted in the second recess and having a protruded portion protruding from the front surface of the ceramic substrate and fittingly engageable in an alignment hole of the optical component. A method of producing such a substrate assembly is also provided.
摘要翻译：用于支撑光学部件的基板组件包括具有前表面和第一凹部的基板，设置在第一凹部中的第二凹陷形成部分，并且具有直径小于第一凹部的第二凹部，并且具有至少在与前表面对应的一侧，所述第二凹部形成部分由具有比形成所述基底的材料更好的可切削性的材料制成;以及对准引导构件，其安装在所述第二凹部中并具有从所述第一凹部的前表面突出的突出部分陶瓷基板并且可配合地接合在光学部件的对准孔中。还提供了一种制造这种基板组件的方法。

56. 发明授权

US07160035B2 Optical module, method of manufacturing the same, optical communication device and electronic device using the same 失效
标题翻译：光模块及其制造方法，光通信装置及使用其的电子装置
公开(公告)号：US07160035B2
公开(公告)日：2007-01-09
申请号：US10844418
申请日：2004-05-13
申请人： Akira Miyamae , Kimio Nagasaka
发明人： Akira Miyamae , Kimio Nagasaka
IPC分类号： G02B6/36
CPC分类号： G02B6/4214 , G02B6/4212 , G02B6/4231 , G02B6/43 , H01L24/97 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83001 , H01L2924/00014 , H01L2924/12042 , H01L2924/12043 , H01L2924/00 , H01L2224/0401
摘要： The invention provides an optical module that can reduce its cost. An optical module to which an optical fiber is detachably inserted, includes: a substrate with an aperture to which the optical fiber is inserted; a flexible printed circuit board disposed on one surface of the substrate and including: a base member with an opening in a corresponding location to the aperture; an interconnection layer disposed on at least one surface of the base member); and a connection section including a part of the interconnection layer exposed through the opening; and an optical element disposed within the opening of the flexible printed circuit board, and connected to the connection section, the optical element performing one of transmission and reception of an optical signal with the optical fiber.
摘要翻译：本发明提供了可以降低成本的光学模块。光纤可拆卸地插入其中的光学模块包括：具有插入光纤的孔的基板; 设置在所述基板的一个表面上的柔性印刷电路板，包括：在所述孔的相应位置具有开口的基底构件; 布置在所述基底构件的至少一个表面上的互连层）; 以及连接部，其包括通过所述开口露出的所述互连层的一部分; 以及光学元件，其设置在所述柔性印刷电路板的开口内，并且连接到所述连接部，所述光学元件执行与所述光纤的光信号的发送和接收之一。

57. 发明授权

US07073961B2 Optical sub-assembly packaging techniques that incorporate optical lenses 有权
标题翻译：包含光学透镜的光学子组件封装技术
公开(公告)号：US07073961B2
公开(公告)日：2006-07-11
申请号：US11050073
申请日：2005-02-01
申请人： William Paul Mazotti , Jia Liu , Luu Thanh Nguyen , Haryanto Chandra , Peter Deane , Todd Thyes , Brian Huss , John Rukavina , Glenn Woodhouse
发明人： William Paul Mazotti , Jia Liu , Luu Thanh Nguyen , Haryanto Chandra , Peter Deane , Todd Thyes , Brian Huss , John Rukavina , Glenn Woodhouse
IPC分类号： G02B6/36
CPC分类号： G02B6/4292 , G02B6/4201 , G02B6/4204 , G02B6/4231 , G02B6/4239 , G02B6/4249 , G02B6/4251
摘要： Techniques for manufacturing an optical transmission device in a manner so that the photonic device is protected from damage that can be caused by exposure to the environment and physical handling are described. The invention involves placing a lens or a lens array over a photonic device, either with or without the use of a receptacle device, such that the photonic device is contained within a sealed cavity. The invention has three main embodiments in which the photonic device can be hermetically sealed, quasi-hermetically sealed, or non-hermetically sealed. The optical transmission device can be configured to serve as an optical receiver, detector, or a transceiver device.
摘要翻译：描述了以使得光子器件免受可能由于暴露于环境和物理处理引起的损害的方式制造光传输装置的技术。本发明涉及将透镜或透镜阵列放置在光子器件上，无论是否使用插座器件，使得光子器件被包含在密封腔内。本发明具有三个主要实施例，其中光子器件可被气密密封，准气密密封或非气密密封。光传输设备可以被配置为用作光接收器，检测器或收发器设备。

58. 发明授权

US07049704B2 Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board 失效
标题翻译：整合光学和电气设备并耦合到板上波导的倒装芯片封装
公开(公告)号：US07049704B2
公开(公告)日：2006-05-23
申请号：US10840017
申请日：2004-05-06
申请人： Kishore K. Chakravorty , Johanna Swan , Brandon C. Barnett , Joseph F. Ahadian , Thomas P. Thomas , Ian Young
发明人： Kishore K. Chakravorty , Johanna Swan , Brandon C. Barnett , Joseph F. Ahadian , Thomas P. Thomas , Ian Young
IPC分类号： H01L29/40
CPC分类号： G02B6/42 , G02B6/4206 , G02B6/4212 , G02B6/4214 , G02B6/4231 , G02B6/43 , H05K1/0274 , H05K3/3436 , H05K2201/10121 , H05K2201/10734
摘要： A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has an optical waveguide structure in addition to electrical connections. An optically active device is flip-chip bonded directly to an integrated circuit using solder bump technology. The optically active device has a lens directly attached to it to facilitate optical coupling to the optical waveguide. The integrated circuit is flip-chip bonded to a Ball Grid Array (BGA) package. The BGA package is bonded to the PCB using solder reflow technology.
摘要翻译：允许一个或多个集成电路和印刷电路板（PCB）之间的电和光耦合的封装除了电连接之外还具有光波导结构。使用焊料凸块技术将光学有源器件直接贴合到集成电路上。光学器件具有直接连接到其上的透镜，以便于光耦合到光波导。集成电路倒装芯片结合到球栅阵列（BGA）封装。使用焊锡回流技术将BGA封装结合到PCB。

59. 发明申请

US20060006320A1 Optoelectronic component 有权
公开(公告)号：US20060006320A1
公开(公告)日：2006-01-12
申请号：US11223402
申请日：2005-09-09
申请人： David Sherrer , Noel Heiks
发明人： David Sherrer , Noel Heiks
IPC分类号： H01J3/14 , H01J40/14
CPC分类号： G02B6/4292 , G02B6/4201 , G02B6/4204 , G02B6/4214 , G02B6/4231 , G02B6/4232 , G02B6/4246 , G02B6/4249 , G02B6/4257 , G02B6/4274
摘要： Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.

60. 发明申请

US20050218317A1 Optoelectronic component 有权
标题翻译：光电元件
公开(公告)号：US20050218317A1
公开(公告)日：2005-10-06
申请号：US11139270
申请日：2005-05-27
申请人： David Sherrer , Noel Heiks
发明人： David Sherrer , Noel Heiks
IPC分类号： C30B1/00 , G02B6/42 , H01J5/02 , H01J40/14
CPC分类号： G02B6/4292 , G02B6/4201 , G02B6/4204 , G02B6/4214 , G02B6/4231 , G02B6/4232 , G02B6/4246 , G02B6/4249 , G02B6/4257 , G02B6/4274
摘要： Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.
摘要翻译：提供了包括光电子器件和用于自对准光电器件的结构的光电子部件。还提供了光电子模块和形成光电子部件的方法。

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