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51. 发明授权

US08967815B2 Mirror with increased reflectance 有权
标题翻译：反射镜增加
公开(公告)号：US08967815B2
公开(公告)日：2015-03-03
申请号：US13121869
申请日：2009-10-05
申请人： Lionel Ventelon , Bruno Cosijns , Pierre Boulager , Joseph Leclercq
发明人： Lionel Ventelon , Bruno Cosijns , Pierre Boulager , Joseph Leclercq
IPC分类号： G02B5/04 , G02B5/08 , C22C32/00 , C03C17/38 , C03C17/36 , C23C18/16 , C23C18/18
CPC分类号： C03C17/38 , C03C17/3663 , C03C2218/31 , C03C2218/32 , C23C18/165 , C23C18/166 , C23C18/1689 , C23C18/1889 , G02B5/0808
摘要： A process for manufacturing mirrors with increased reflectance includes forming a silver layer on a surface of a glass substrate, during which the surface is contacted with a silvering solution, and painting at least one paint layer to cover the silver layer. Between forming the silver layer and the painting, the process includes reheating the silver layer to a temperature of at least 200° C.
摘要翻译：用于制造具有增加的反射率的反射镜的方法包括在玻璃基板的表面上形成银层，在该表面与镀银溶液接触，并且涂刷至少一个涂料层以覆盖银层。在形成银层和涂料之间，该方法包括将银层再加热至至少200℃的温度

52. 发明授权

US08900998B2 Process for electroless deposition of gold and gold alloys on silicon 有权
标题翻译：金和金合金在硅上无电沉积的工艺
公开(公告)号：US08900998B2
公开(公告)日：2014-12-02
申请号：US14084189
申请日：2013-11-19
申请人： University of Windsor
发明人： Mordechay Schlesinger , Robert Andrew Petro
IPC分类号： H01L21/44 , H01L21/285
CPC分类号： H01L21/28506 , C23C18/1608 , C23C18/1642 , C23C18/1658 , C23C18/166 , C23C18/44 , C23C18/48 , C23C18/54 , H01L21/02491 , H01L21/02521
摘要： A plating bath for electroless deposition of gold and gold alloy layers on such silicon-based substrates, includes Na(AuCl4) and/or other gold (III) chloride salts as a gold ion source. The bath is formed as a binary bath solution formed from mixing first and second bath components. The first bath component includes gold salts in concentrations up to 40 g/L, boric acid, in amounts of up to 30 g/L, and a metal hydroxide in amounts up to 20 g/L. The second bath component includes an acid salt, in amounts up to 25 g/L, sodium thiosulfate in amounts up to 30 g/L, and suitable acid, such as boric acid in amounts up to 20 g/L.
摘要翻译：用于在这种硅基底材上无电沉积金和金合金层的电镀浴包括作为金离子源的Na（AuCl 4）和/或其它金（III）氯化金盐。该浴形成为通过混合第一和第二浴组分形成的二元浴溶液。第一浴组分包括浓度高达40g / L的金盐，最高达30g / L的硼酸，和最高达20g / L的金属氢氧化物。第二浴组分包括高达25g / L的酸盐，最高达30g / L的硫代硫酸钠，和最多达20g / L的合适的酸，如硼酸。

53. 发明申请

US20140284849A1 METHOD FOR MANUFACTURING THREE-DIMENSIONAL INTEGRATED CIRCUIT 有权
标题翻译：制造三维集成电路的方法
公开(公告)号：US20140284849A1
公开(公告)日：2014-09-25
申请号：US14296419
申请日：2014-06-04
申请人： Innetech (Tianjin) Electronics Co., Ltd.
发明人： Dongsheng LIU , Meng WANG
IPC分类号： H01L21/768 , C23C18/18 , C23C18/16 , B29C45/00
CPC分类号： H01L21/768 , B29C45/0053 , B29C2045/0079 , C23C18/1608 , C23C18/1612 , C23C18/1641 , C23C18/1651 , C23C18/166 , C23C18/1868 , C23C18/204 , C23C18/208 , C23C18/32 , C23C18/36 , C23C18/38 , C23C18/405 , H05K3/185 , H05K2201/0129 , H05K2201/0236 , H05K2201/09118 , H05K2203/107
摘要： A method for manufacturing a three-dimensional integrated circuit. The method includes: 1) adding a non-metallic light-induced catalyst including an alcohol and/or an aldehyde to a thermoplastic carrier material, and molding the resulting mixture by an injection molding machine to form a structural component; 2) irradiating a surface of the structural component with a laser ray to form a line pattern thereon; 3) immersing the structural component in a metal ion solution at room temperature for between 5 and 7 minutes; 4) washing the structural component with distilled water, and immersing the structural component in an aqueous solution including a reducing agent for between 5 and 7 minutes to allow the surface of the structural component to form a metal core; and 5) performing electroless copper plating and medium-phosphorus electroless nickel plating on an area comprising the metal core to yield a conductor track.
摘要翻译：一种三维集成电路的制造方法。该方法包括：1）向热塑性载体材料中加入包含醇和/或醛的非金属光诱导催化剂，并通过注塑机成型所得混合物以形成结构组分; 2）用激光照射结构部件的表面以在其上形成线图案; 3）在室温下将结构成分浸入金属离子溶液中5〜7分钟; 4）用蒸馏水洗涤结构组分，并将结构组分浸入包括还原剂的水溶液中5至7分钟以使结构组分的表面形成金属芯; 以及5）在包括所述金属芯的区域上执行无电镀铜和中磷化学镀镍以产生导体轨道。

54. 发明申请

US20140072706A1 Direct Electroless Palladium Plating on Copper 审中-公开
标题翻译：在铜上直接无电镀钯
公开(公告)号：US20140072706A1
公开(公告)日：2014-03-13
申请号：US13609705
申请日：2012-09-11
申请人： Ernest Long , Ying Ding
发明人： Ernest Long , Ying Ding
IPC分类号： C23C18/54
CPC分类号： C23C18/44 , C23C18/166 , C23C18/1834 , C23C18/1844
摘要： A method of providing a direct electroless palladium deposit on a copper surface is described. The method comprises the steps of (a) catalyzing the copper surface by applying a pre-dip composition to the copper surface, the pre-dip composition comprising a reducing agent; and thereafter (b) contacting the catalyzed copper surface with an electroless palladium composition to deposit a layer of palladium on the copper surface.
摘要翻译：描述了在铜表面上提供直接无电钯沉积物的方法。该方法包括以下步骤：（a）通过将预浸组合物施加到铜表面催化铜表面，该预浸组合物包含还原剂; 然后（b）使催化的铜表面与无电镀钯组合物接触以在铜表面上沉积一层钯。

55. 发明申请

US20110235203A1 MIRROR 有权
标题翻译：镜子
公开(公告)号：US20110235203A1
公开(公告)日：2011-09-29
申请号：US13121869
申请日：2009-10-05
申请人： Lionel Ventelon , Bruno Cosijns , Pierre Boulager , Joseph Leclercq
发明人： Lionel Ventelon , Bruno Cosijns , Pierre Boulager , Joseph Leclercq
IPC分类号： G02B5/08 , B05D5/06 , B05D3/06 , B05D3/02
CPC分类号： C03C17/38 , C03C17/3663 , C03C2218/31 , C03C2218/32 , C23C18/165 , C23C18/166 , C23C18/1689 , C23C18/1889 , G02B5/0808
摘要： The invention relates to a process for manufacturing mirrors and to mirrors produced in this manner. The process comprises a step fir forming a silver layer on a surface of a glass substrate, during which said surface is brought into contact with a silvering solution, and a painting step, during which the silver layer is covered by at least one paint layer. It is characterised by the fact that between the step for forming the silver layer and the painting step it comprises a step for reheating the silver layer to a temperature of at least 200° C.
摘要翻译：本发明涉及制造镜子和以这种方式制造的镜子的方法。该方法包括在玻璃基板的表面上形成银层的步骤，其中所述表面与镀银溶液接触;以及涂漆步骤，在该步骤中银层被至少一个涂料层覆盖。其特征在于，在形成银层的步骤和涂漆步骤之间，其包括将银层再加热至至少200℃的温度的步骤。

56. 发明申请

US20110162870A1 METAL NANOWIRE THIN-FILMS 有权
标题翻译：金属纳米薄膜
公开(公告)号：US20110162870A1
公开(公告)日：2011-07-07
申请号：US13061745
申请日：2009-09-01
申请人： Gil Markovich , Daniel Azulai , Olga Krichevski
发明人： Gil Markovich , Daniel Azulai , Olga Krichevski
IPC分类号： H01B5/00 , B05D5/12 , B05D3/06
CPC分类号： H05K1/09 , C23C18/14 , C23C18/166 , C23C18/1667 , C23C18/1676 , C23C18/34 , C23C18/40 , C23C18/44 , C23C18/48 , H01B1/02 , H01L29/786 , H05K1/0274 , H05K3/105 , H05K3/182 , H05K2201/0108 , H05K2201/0257 , H05K2201/026 , H05K2201/10121 , H05K2201/10128 , H05K2201/10166 , H05K2203/013 , H05K2203/1157 , H05K2203/125
摘要： A conductive nanowire film based on a high aspect-ratio metal is disclosed. The nanowire film is produced by inducing metal reduction in a concentrated surfactant solution containing metal precursor ions, a surfactant and a reducing agent. The metal nanostructures demonstrate utility in a great variety of applications.
摘要翻译：公开了一种基于高纵横比金属的导电纳米线膜。通过在含有金属前体离子，表面活性剂和还原剂的浓缩表面活性剂溶液中诱导金属还原来制造纳米线膜。金属纳米结构在各种应用中表现出实用性。

57. 发明申请

US20110083785A1 ELECTRODE FORMING METHOD 审中-公开
标题翻译：电极成型方法
公开(公告)号：US20110083785A1
公开(公告)日：2011-04-14
申请号：US12975873
申请日：2010-12-22
申请人： Kazuo Onishi , Shingo Sewa
发明人： Kazuo Onishi , Shingo Sewa
IPC分类号： B05D5/12 , B31B1/60
CPC分类号： C23C18/1648 , C23C18/1658 , C23C18/166 , C23C18/31 , C23C26/02 , Y10T156/10
摘要： The present invention provides an electrode forming method in which an electrode layer is formed on a solid electrolyte, capable of obtaining an electrode layer having a large electrode surface area, decreasing the number of steps required in formation of the electrode layer and reducing a human labor and time. The electrode forming method of the invention is an electrode forming method, in which a metal salt solution and a reducing agent solution are disposed on respective both sides of a solid electrolyte form and the metal salt solution is caused to pass through the solid electrolyte form by osmosis to thereby deposit a metal near the interface on the reducing agent solution side of the solid electrolyte form to thereby form the electrode on the solid electrolyte form.
摘要翻译：本发明提供一种电极形成方法，其中电极层形成在固体电解质上，能够获得具有大的电极表面积的电极层，减少形成电极层所需的步骤数量并减少人力和时间。本发明的电极形成方法是电极形成方法，其中金属盐溶液和还原剂溶液设置在固体电解质形式的两侧，并且使金属盐溶液通过固体电解质形式通过从而在固体电解质形式的还原剂溶液侧的界面附近沉积金属，从而在固体电解质形式上形成电极。

58. 发明申请

US20070148547A1 Modification of an anode material and a preperation method thereof 审中-公开
标题翻译：阳极材料的改性及其制备方法
公开(公告)号：US20070148547A1
公开(公告)日：2007-06-28
申请号：US11313792
申请日：2005-12-22
申请人： Jenq-Gong Duh , Li-Yin Hsiao
发明人： Jenq-Gong Duh , Li-Yin Hsiao
IPC分类号： H01M4/58 , B05D5/12
CPC分类号： C23C18/166 , C23C18/1662 , C23C18/1692 , C23C18/48 , H01M4/02 , H01M4/133 , H01M4/1393 , H01M4/366 , H01M4/587 , H01M10/0525 , H01M2004/021 , H01M2004/027
摘要： A modification of an anode material, which is used as a carbonaceous material of an anode of a Lithium-ion secondary battery, is characterized in that the surface of the carbonaceous material is plated with Sn—P or Ni—Sn—P nanoparticles. The preparation method comprises the steps of mixing a reductant solution containing phosphorus ions and an oxidant solution containing stannous ions or nickel and stannous ions to form a plating liquid, disposing a carbonaceous material into said plating liquid with pH between 3-5, and heating the environmental temperature up to 80° C.- 85° C. for 2 hours for performing an electroless plating reaction. After the carbonaceous material is cooled to room temperature, cleaning the carbonaceous material by using deionzied water. Finally, baking and drying the carbonaceous material, and a carbonaceous material with surface thereof plated with Sn—P or Ni—Sn—P nanoparticles is obtained.
摘要翻译：用作锂离子二次电池的阳极的碳质材料的阳极材料的改性的特征在于，碳质材料的表面镀有Sn-P或Ni-Sn-P纳米颗粒。该制备方法包括以下步骤：将含有磷离子的还原剂溶液和含有亚锡离子或镍和亚锡离子的氧化剂溶液混合以形成电镀液，将碳质材料设置在pH在3-5之间的镀液中，并加热环境温度高达80℃-85℃，进行无电镀反应2小时。将碳质材料冷却至室温后，用去离子水清洗碳质材料。最后，对碳质材料进行烘烤和干燥，得到表面镀Sn-P或Ni-Sn-P纳米颗粒的碳质材料。

59. 发明授权

US06942351B2 Forming a silver coating on a vitreous substrate 失效
标题翻译：在玻璃质基材上形成银涂层
公开(公告)号：US06942351B2
公开(公告)日：2005-09-13
申请号：US10855364
申请日：2004-05-28
申请人： Pierre Laroche , Pierre Boulanger , Christian Dauby
发明人： Pierre Laroche , Pierre Boulanger , Christian Dauby
IPC分类号： C03C17/38 , C23C18/18 , G02B5/08 , A47G1/00
CPC分类号： C03C17/38 , C23C18/1651 , C23C18/1658 , C23C18/166 , C23C18/1855 , C23C18/1879 , C23C18/1889 , G02B5/0808 , Y10S359/90
摘要： A process for forming a silver coating on a surface of a vitreous substrate is described. The process comprises an activating step in which said surface is contacted with an activating solution, a sensitising step in which said surface is contacted with a sensitising solution, and a subsequent silvering step in which said surface is contacted with a silvering solution comprising a source of silver to form the silver coating. The process is characterised in that said activating solution comprises ions of at least one of bismuth (III), chromium (II), gold (III), indium (III), nickel (II), palladium (II), platinum (II), rhodium (III), ruthenium (III), titanium (III), vanadium (III) and zinc (II).
摘要翻译：描述了在玻璃质基材的表面上形成银涂层的方法。该方法包括活化步骤，其中所述表面与活化溶液接触，其中所述表面与敏化溶液接触的敏化步骤，以及随后的镀银步骤，其中所述表面与含有源的银形成银涂层。该方法的特征在于所述活化溶液包含铋（III），铬（II），金（III），铟（III），镍（II），钯（II），铂（II））中的至少一种的离子，，铑（III），钌（III），钛（III），钒（III）和锌（II）。

60. 发明申请

US20050136185A1 Post rinse to improve selective deposition of electroless cobalt on copper for ULSI application 审中-公开
标题翻译：后冲洗以改善无电钴在铜上的选择性沉积，用于ULSI应用
公开(公告)号：US20050136185A1
公开(公告)日：2005-06-23
申请号：US10979078
申请日：2004-10-29
申请人： Sivakami Ramanathan , Deenesh Padhi , Srinivas Gandikota , Girish Dixit
发明人： Sivakami Ramanathan , Deenesh Padhi , Srinivas Gandikota , Girish Dixit
IPC分类号： B05D1/40 , B05D3/00 , C23C18/16 , C23C18/31 , C23C18/44 , C23C18/50 , C23G1/10 , H01L21/288 , H01L21/302 , H01L21/31 , H01L21/44 , H01L21/461 , H01L21/768
CPC分类号： H01L21/76877 , C23C18/166 , C23C18/1831 , C23C18/1834 , C23C18/1879 , C23C18/1882 , C23C18/34 , C23C18/36 , C23C18/44 , C23C18/50 , C23G1/10 , H01L21/288 , H01L21/76814 , H01L21/76849 , H01L21/76865 , H01L21/76873 , H01L21/76874 , H01L21/76883
摘要： A method for depositing a passivation layer on a substrate surface using one or more electroplating techniques is provided. Embodiments of the method include selectively depositing an initiation layer on a conductive material by exposing the substrate surface to a first electroless solution, depositing a passivating material on the initiation layer by exposing the initiation layer to a second electroless solution, and cleaning the substrate surface with an acidic solution. In another aspect, the method includes applying ultrasonic or megasonic energy to the substrate surface during the application of the acidic solution. In still another aspect, the method includes using the acidic solution to remove between about 100 Å and about 200 Å of the passivating material. In yet another aspect, the method includes cleaning the substrate surface with a first acidic solution prior to the deposition of the initiation layer.
摘要翻译：提供了使用一种或多种电镀技术在衬底表面上沉积钝化层的方法。该方法的实施例包括通过将衬底表面暴露于第一无电解溶液来选择性地沉积引发层，通过将引发层暴露于第二无电解溶液来沉积起始层上的钝化材料，并用酸性溶液。在另一方面，该方法包括在施加酸性溶液期间将超声波或兆声波能量施加到基底表面。在另一方面，该方法包括使用酸性溶液去除大约至大约200埃的钝化材料。在另一方面，该方法包括在沉积起始层之前用第一酸性溶液清洗基底表面。

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