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51. 发明申请

US20130214365A1 MEMS PRESSURE TRANSDUCER ASSEMBLY AND METHOD OF PACKAGING SAME 有权
标题翻译： MEMS压力传感器组件及其包装方法
公开(公告)号：US20130214365A1
公开(公告)日：2013-08-22
申请号：US13400966
申请日：2012-02-21
申请人： Mark E. Schlarmann , Yizhen Lin
发明人： Mark E. Schlarmann , Yizhen Lin
IPC分类号： H01L29/84 , H01L21/02
CPC分类号： B81B7/0048 , B81B3/0021 , B81B3/0072 , B81B7/0058 , B81B2203/0118 , B81B2203/0127 , B81B2203/051 , B81B2207/115 , B81C1/00309 , G01L9/0042 , G01L9/0052 , G01L19/147 , H01L2224/48137
摘要： An assembly (20) includes a MEMS die (22) having a pressure transducer device (40) formed on a substrate (44) and a cap layer (38). A packaging process (74) entails forming the device (40) on the substrate, creating an aperture (70) through a back side (58) of the substrate (44) underlying a diaphragm (46) of the device (40), and coupling a cap layer (38) to the front side of the substrate (44) overlying the device (40). A trench (54) is produced extending through both the cap layer (38) and the substrate (44), and surrounds a cantilevered platform (48) at which the diaphragm (46) resides. The die (22) is suspended above a substrate (26) so that a clearance space (60) is formed between the platform (48) and the substrate (26). The diaphragm (46) is exposed to an external environment (68) via the aperture (70) and the space (60), and an external port.
摘要翻译：组件（20）包括具有形成在基板（44）上的压力传感器装置（40）和盖层（38）的MEMS管芯（22）。包装工艺（74）需要在基板上形成装置（40），通过装置（40）的隔膜（46）下方的基板（44）的后侧（58）产生孔（70），以及将覆盖层（38）耦合到覆盖所述器件（40）的衬底（44）的前侧。制造延伸穿过盖层（38）和基板（44）的沟槽（54），并且围绕隔膜（46）所在的悬臂平台（48）。模具（22）悬挂在基板（26）上方，使得在平台（48）和基板（26）之间形成间隙空间（60）。隔膜（46）经由孔（70）和空间（60）和外部端口暴露于外部环境（68）。

52. 发明申请

US20130130424A1 PROCESS FOR MINIMIZING CHIPPING WHEN SEPARATING MEMS DIES ON A WAFER 审中-公开
标题翻译：当在水平分离MEMS表面时最小化流动的过程
公开(公告)号：US20130130424A1
公开(公告)日：2013-05-23
申请号：US13695980
申请日：2011-05-03
申请人： Roger Horton , Javed Hussain
发明人： Roger Horton , Javed Hussain
IPC分类号： H01L21/78
CPC分类号： B81B7/0058 , B81C1/00888 , B81C2201/053 , G01L9/0055 , H01L21/78
摘要： A method for separating a plurality of dies on a Micro-Electro-Mechanical System (MEMS) wafer comprising scribing a notch on a first side of the wafer between at least two of the plurality of dies on a first surface and depositing a metal on the first surface of the plurality of dies. The method further comprises scribing a second side of the wafer between at least two of the plurality of dies from a second surface thereof through the notch. The first side and second side are substantially parallel and opposite each other and the first surface and the second surface are substantially parallel and opposite each other. In a process in accordance with the present invention, a method to minimize chipping of the bonding portion of a MEMs device during sawing of the wafer is provided, which minimally affects the process steps associated with separating the die on a wafer.
摘要翻译：一种用于在微电子机械系统（MEMS）晶片上分离多个管芯的方法，包括在第一表面上的多个管芯中的至少两个之间划定晶片的第一侧上的缺口并在其上沉积金属多个管芯的第一表面。该方法还包括在多个管芯中的至少两个从其第二表面通过凹口划线晶片的第二侧。第一侧面和第二侧面基本上平行且彼此相对，并且第一表面和第二表面基本上平行且彼此相对。在根据本发明的方法中，提供了一种在晶片锯切期间最小化MEM器件的接合部分的破损的方法，其最小程度地影响与在晶片上分离晶片相关的工艺步骤。

53. 发明申请

US20120267732A1 MEMS PACKAGE STRUCTURE 有权
标题翻译： MEMS封装结构
公开(公告)号：US20120267732A1
公开(公告)日：2012-10-25
申请号：US13535682
申请日：2012-06-28
申请人： Hsin-Hui HSU , Sheng-Ta LEE , Chuan-Wei WANG
发明人： Hsin-Hui HSU , Sheng-Ta LEE , Chuan-Wei WANG
IPC分类号： H01L29/84
CPC分类号： B81B7/0058 , B81B7/0006 , B81B2201/0264 , B81C1/00246 , B81C1/00293 , B81C2203/0136 , B81C2203/0145 , B81C2203/0714 , B81C2203/0735
摘要： A MEMS package structure, including a substrate, an interconnecting structure, an upper metallic layer, a deposition element and a packaging element is provided. The interconnecting structure is disposed on the substrate. The MEMS structure is disposed on the substrate and within a first cavity. The upper metallic layer is disposed above the MEMS structure and the interconnecting structure, so as to form a second cavity located between the upper metallic layer and the interconnecting structure and communicates with the first cavity. The upper metallic layer has at least a first opening located above the interconnecting structure and at least a second opening located above the MEMS structure. Area of the first opening is greater than that of the second opening. The deposition element is disposed above the upper metallic layer to seal the second opening. The packaging element is disposed above the upper metallic layer to seal the first opening.
摘要翻译：提供了包括基板，互连结构，上金属层，沉积元件和封装元件的MEMS封装结构。互连结构设置在基板上。 MEMS结构设置在基板上并在第一腔内。上金属层设置在MEMS结构和互连结构之上，以便形成位于上金属层和互连结构之间的第二腔，并与第一腔连通。上金属层具有位于互连结构上方的至少第一开口和位于MEMS结构上方的至少第二开口。第一开口的面积大于第二开口的面积。沉积元件设置在上金属层上方以密封第二开口。包装元件设置在上金属层上方以密封第一开口。

54. 发明申请

US20120098074A1 MEMS DEVICE WITH RELEASE APERTURE 有权
标题翻译：具有释放孔径的MEMS器件
公开(公告)号：US20120098074A1
公开(公告)日：2012-04-26
申请号：US12908985
申请日：2010-10-21
申请人： Chung-Hsien Lin , Chia-Hua Chu , Chun-Wen Cheng
发明人： Chung-Hsien Lin , Chia-Hua Chu , Chun-Wen Cheng
IPC分类号： H01L23/04 , H01L21/50
CPC分类号： B81B7/0058 , B81C1/00333 , B81C1/0038 , B81C2203/0136 , B81C2203/0145 , H01L2924/0002 , H01L2924/00
摘要： The present disclosure provides a method of fabricating a micro-electro-mechanical systems (MEMS) device. In an embodiment, a method includes providing a substrate including a first sacrificial layer, forming a micro-electro-mechanical systems (MEMS) structure above the first sacrificial layer, and forming a release aperture at substantially a same level above the first sacrificial layer as the MEMS structure. The method further includes forming a second sacrificial layer above the MEMS structure and within the release aperture, and forming a first cap over the second sacrificial layer and the MEMS structure, wherein a leg of the first cap is disposed between the MEMS structure and the release aperture. The method further includes removing the first sacrificial layer, removing the second sacrificial layer through the release aperture, and plugging the release aperture. A MEMS device formed by such a method is also provided.
摘要翻译：本公开提供了一种制造微机电系统（MEMS）装置的方法。在一个实施例中，一种方法包括提供包括第一牺牲层的衬底，在第一牺牲层之上形成微电子机械系统（MEMS）结构，以及在第一牺牲层之上的基本上相同的水平面上形成释放孔， MEMS结构。该方法还包括在MEMS结构之上和释放孔内形成第二牺牲层，以及在第二牺牲层和MEMS结构之上形成第一帽，其中第一帽的腿设置在MEMS结构和释放之间光圈。该方法还包括去除第一牺牲层，通过释放孔去除第二牺牲层并堵塞释放孔。还提供了通过这种方法形成的MEMS器件。

55. 发明申请

US20120043629A1 Surface Mount Silicon Condenser Microphone Package 有权
标题翻译：表面贴装硅电容麦克风封装
公开(公告)号：US20120043629A1
公开(公告)日：2012-02-23
申请号：US13286558
申请日：2011-11-01
申请人： Anthony D. Minervini
发明人： Anthony D. Minervini
IPC分类号： H01L29/84
CPC分类号： H04R1/2892 , B81B3/0021 , B81B7/0038 , B81B7/0058 , B81B7/0061 , B81B7/0064 , B81B7/007 , B81B2201/0257 , B81B2207/092 , B81C1/00158 , B81C1/00301 , B81C3/00 , H01L21/78 , H01L23/10 , H01L23/15 , H01L2924/0002 , H01L2924/1461 , H04R1/04 , H04R1/222 , H04R3/00 , H04R19/005 , H04R19/016 , H04R19/04 , H04R23/00 , H04R31/006 , H04R2201/003 , H04R2225/49 , H04R2410/03 , Y10T29/49005 , Y10T29/4908 , Y10T29/49798 , H01L2924/00
摘要： The present invention relates to a surface mount package for a silicon condenser microphone. The inventive package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate which performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the die and the package, and providing an exterior surface for making electrical connections between package and a user's printed circuit board.
摘要翻译：本发明涉及一种用于硅电容麦克风的表面贴装封装。本发明的封装使用有限数量的部件，其简化制造并降低成本，并且具有执行传统上需要多个部件的功能的基板，包括提供其上机械连接硅冷凝器管芯的内表面，提供内表面用于在管芯和封装之间进行电连接，并提供用于在封装和用户印刷电路板之间进行电连接的外表面。

56. 发明授权

US08049326B2 Environment-resistant module, micropackage and methods of manufacturing same 有权
标题翻译：环保模块，微包装及其制造方法
公开(公告)号：US08049326B2
公开(公告)日：2011-11-01
申请号：US12135532
申请日：2008-06-09
申请人： Khalil Najafi , Sang-Hyun Lee , Sang Woo Lee
发明人： Khalil Najafi , Sang-Hyun Lee , Sang Woo Lee
IPC分类号： H01L21/50 , H01L23/538
CPC分类号： B81B3/0018 , B81B7/0038 , B81B7/0058 , B81B7/0064 , B81C1/00134 , H01L2224/16225 , H01L2924/1461 , H01L2924/00
摘要： An environment-resistant module which provides both thermal and vibration isolation for a packaged micromachined or MEMS device is disclosed. A microplatform and a support structure for the microplatform provide the thermal and vibration isolation. The package is both hermetic and vacuum compatible and provides vertical feedthroughs for signal transfer. A micromachined or MEMS device transfer method is also disclosed that can handle a wide variety of individual micromachined or MEMS dies or wafers, in either a hybrid or integrated fashion. The module simultaneously provides both thermal and vibration isolation for the MEMS device using the microplatform and the support structure which may be fabricated from a thin glass wafer that is patterned to create crab-leg shaped suspension tethers or beams.
摘要翻译：公开了一种为封装的微加工或MEMS器件提供热隔离和隔振的环境保护模块。用于微平台的微平台和支撑结构提供热隔离和隔振。该封装兼具密封性和真空性，并提供信号传输的垂直馈通。还公开了微加工或MEMS器件转移方法，其可以以混合或集成的方式处理各种各样的微机械加工或MEMS管芯或晶片。该模块同时提供使用微平台和支撑结构的MEMS器件的热隔离和隔振，该支撑结构可以由图案化以形成螃蟹腿形悬挂系绳或梁的薄玻璃晶片制造。

57. 发明申请

US20110198970A1 ENCAPSULATED ACTIVE TRANSDUCER AND METHOD OF FABRICATING THE SAME 有权
标题翻译：封装有源传感器及其制造方法
公开(公告)号：US20110198970A1
公开(公告)日：2011-08-18
申请号：US12706752
申请日：2010-02-17
申请人： David MARTIN , Osvaldo BUCCAFUSCA
发明人： David MARTIN , Osvaldo BUCCAFUSCA
IPC分类号： H01L41/053 , H01L41/22
CPC分类号： B81B7/0058 , B81B2201/0257 , B81C2203/0136 , H01L41/0533 , H01L41/0973 , H01L41/23 , H01L41/332 , Y10T29/42
摘要： A micro-electromechanical systems (MEMS) ultrasonic transducer device includes a substrate defining an opening and an active transducer having multiple of active layers stacked over the opening of the substrate. The active transducer is completely encapsulated by multiple passivation layers.
摘要翻译：微机电系统（MEMS）超声波换能器装置包括限定开口的基板和具有堆叠在基板的开口上的多个有源层的有源换能器。主动传感器被多个钝化层完全封装。

58. 发明申请

US20110189844A1 METHOD FOR ENCAPSULATING A MICROCOMPONENT USING A MECHANICALLY REINFORCED CAP 有权
标题翻译：使用机械加固盖封装微型计算机的方法
公开(公告)号：US20110189844A1
公开(公告)日：2011-08-04
申请号：US13019581
申请日：2011-02-02
申请人： Jean-Louis PORNIN , Charlotte Gillot
发明人： Jean-Louis PORNIN , Charlotte Gillot
IPC分类号： H01L21/3213 , H01L21/311
CPC分类号： B81B7/0058 , B81C2203/0136 , B81C2203/0145 , B81C2203/0163
摘要： A method for encapsulating a micro component positioned on and/or in a substrate, including the following steps:depositing at least one sacrificial material covering the micro component,making a cap covering the sacrificial material,removing the sacrificial material via at least one opening formed through the cap, forming a cavity in which the micro component is positioned,depositing, on the cap, at least one layer of plugging material capable of plugging the opening,localized deposition of a portion of mechanically reinforcing material of the cap, covering at least the cap.
摘要翻译：一种用于封装位于和/或衬底中的微组件的方法，包括以下步骤：沉积覆盖微组件的至少一种牺牲材料，制造覆盖牺牲材料的帽，通过形成的至少一个开口去除牺牲材料通过盖形成微组件所在的空腔，在盖上沉积能够堵塞开口的至少一层堵塞材料，至少覆盖一部分机械加强材料的局部沉积这顶帽子。

59. 发明申请

US20110167912A1 PHYSICAL QUANTITY SENSOR 有权
标题翻译：物理量传感器
公开(公告)号：US20110167912A1
公开(公告)日：2011-07-14
申请号：US13004295
申请日：2011-01-11
申请人： Tameharu OHTA , Takeshi SHINODA , Itaru ISHII , Keisuke NAKANO
发明人： Tameharu OHTA , Takeshi SHINODA , Itaru ISHII , Keisuke NAKANO
IPC分类号： G01C19/56
CPC分类号： G01C19/5769 , B81B7/0058 , B81B2201/0242 , G01P1/023 , G01P15/125 , H01L2224/48465
摘要： A physical quantity sensor includes a sensing portion, a casing, a vibration isolating member, an electrically conductive portion, a pad and a bonding wire. The casing encases the sensing portion therein. The vibration isolating member is disposed between the sensing portion and the casing to reduce a relative vibration between the sensing portion and the casing. The bonding wire electrically connects the electrically conductive portion provided on the casing and the pad provided on a surface of the sensing portion. The bonding wire extends from the pad to the electrically conductive portion and includes a bend. The bonding wire is configured to satisfy a relation of 20×d≦h, in which d is an outer diameter of the bonding wire, and h is a dimension of the bonding wire with respect to a direction perpendicular to the surface of the sensing portion.
摘要翻译：物理量传感器包括感测部分，壳体，隔振部件，导电部分，焊盘和接合线。壳体将感测部分包围在其中。防振构件设置在感测部分和壳体之间以减小感测部分和壳体之间的相对振动。接合线将设置在壳体上的导电部分和设置在感测部分的表面上的焊盘电连接。接合线从焊盘延伸到导电部分并且包括弯曲部。接合线被构造成满足20×d＆nlE; h的关系，其中d是接合线的外径，h是接合线相对于垂直于感测部分的表面的方向的尺寸。

60. 发明授权

US07964954B2 Integrated circuit having a semiconductor sensor device with embedded column-like spacers 有权
标题翻译：集成电路具有带嵌入式柱状间隔物的半导体传感器装置
公开(公告)号：US07964954B2
公开(公告)日：2011-06-21
申请号：US11685619
申请日：2007-03-19
申请人： Jean Schmitt
发明人： Jean Schmitt
IPC分类号： H01L23/24
CPC分类号： H01L27/14618 , B81B7/0051 , B81B7/0058 , G01D11/245 , G01L19/141 , H01L27/14683 , H01L2224/32225 , H01L2224/48091 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2924/01068 , H01L2924/1815 , H01L2924/00014
摘要： An integrated circuit having a semiconductor sensor device including a sensor housing partly filled with a rubber-elastic composition is disclosed. One embodiment has a sensor chip with sensor region arranged in the interior of the housing. The sensor housing has an opening to the surroundings which is arranged in such a way that the sensor region faces the opening. The sensor chip is embedded into a rubber-elastic composition on all sides in the interior of the housing. The sensor housing has a sandwich-like framework having three regions arranged one above another, including an intermediate region with the rubber-elastic composition.
摘要翻译：公开了一种具有半导体传感器装置的集成电路，该半导体传感器装置包括部分填充有橡胶弹性组合物的传感器壳体。一个实施例具有传感器芯片，传感器区域布置在壳体的内部。传感器壳体具有通向周围的开口，其以传感器区域朝向开口的方式设置。传感器芯片被嵌入到壳体内部的所有侧面上的橡胶弹性组合物中。传感器壳体具有夹层状框架，该框架具有一个在另一个上方布置的三个区域，包括具有橡胶弹性组合物的中间区域。

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