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    • 54. 发明授权
    • Manufacturing method of semiconductor integrated circuit device
    • 半导体集成电路器件的制造方法
    • US06708319B2
    • 2004-03-16
    • US10006243
    • 2001-12-10
    • Hiroyuki AdachiMasayuki Sato
    • Hiroyuki AdachiMasayuki Sato
    • G06F1750
    • G01R31/318505G01R31/318511
    • A manufacturing method of a semiconductor integrated circuit device includes the steps of: providing wiring conductors capable of connecting between chips or devices and variable switching devices capable of connecting between predetermined wiring conductors on a wafer formed of a microcomputer built-in chip having a CPU and a writable memory circuit for storing an operation program or on a testing board provided with a microcomputer built-in device enclosed by a package; writing a testing program including the transmission and reception operation of signals between the devices or chips into the memory circuit re-writable and capable of using as a program storing area for one of the chips or devices; and executing the testing program in the CPU of the chip or device, thereby testing a testing chip, between the device and the testing chip or an input/output circuit of the device.
    • 半导体集成电路器件的制造方法包括以下步骤:提供能够在芯片或器件之间连接的布线导体和能够连接在由具有CPU的微型计算机内置芯片形成的晶片上的预定布线导体之间的可变开关器件;以及 用于存储操作程序的可写存储器电路或设置有由封装件包围的微计算机内置装置的测试板; 将包括在所述设备或芯片之间的信号的发送和接收操作的测试程序写入可重写的存储器电路并且能够用作所述芯片或设备之一的程序存储区域; 并在芯片或设备的CPU中执行测试程序,从而测试设备与测试芯片之间的测试芯片或器件的输入/输出电路。