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51. 发明授权

US08216934B2 Semiconductor device suitable for a stacked structure 有权
标题翻译：适用于堆叠结构的半导体器件
公开(公告)号：US08216934B2
公开(公告)日：2012-07-10
申请号：US12976089
申请日：2010-12-22
申请人： Eiji Yoshida , Takao Ohno , Yoshito Akutagawa , Koji Sawahata , Masataka Mizukoshi , Takao Nishimura , Akira Takashima , Mitsuhisa Watanabe
发明人： Eiji Yoshida , Takao Ohno , Yoshito Akutagawa , Koji Sawahata , Masataka Mizukoshi , Takao Nishimura , Akira Takashima , Mitsuhisa Watanabe
IPC分类号： H01L21/4763
CPC分类号： H01L21/76898 , H01L23/3128 , H01L23/481 , H01L24/05 , H01L24/13 , H01L24/16 , H01L25/0657 , H01L25/50 , H01L2224/02371 , H01L2224/0401 , H01L2224/05572 , H01L2224/06181 , H01L2224/13008 , H01L2224/13009 , H01L2224/13025 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/45144 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06551 , H01L2225/06555 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2224/05552 , H01L2924/00
摘要： A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed on a principal surface on the outer side. The hole is formed by etching, with the electrode pad serving as an etching stopper layer. An embedded electrode is formed in the hole. This embedded electrode serves to electrically lead the electrode pad to the principal surface on the bottom side of the silicon semiconductor substrate.
摘要翻译：提供一种半导体器件，其形成具有彼此堆叠的半导体器件的三维半导体器件。在该半导体器件中，在具有形成在外侧的主面上的集成电路单元和电极焊盘的硅半导体基板中形成有孔。通过蚀刻形成孔，电极焊盘用作蚀刻停止层。埋入电极形成在孔中。该嵌入电极用于将电极焊盘导电到硅半导体衬底的底侧的主表面。

52. 发明申请

US20120099864A1 CHROMATIC DISPERSION VALUE CALCULATING APPARATUS, OPTICAL SIGNAL RECEIVING APPARATUS, OPTICAL SIGNAL TRANSMITTING APPARATUS, AND CHROMATIC DISPERSION VALUE CALCULATION METHOD 有权
标题翻译：色散值计算装置，光信号接收装置，光信号传输装置和色散值计算方法
公开(公告)号：US20120099864A1
公开(公告)日：2012-04-26
申请号：US13380432
申请日：2010-07-14
申请人： Koichi Ishihara , Takayuki Kobayashi , Riichi Kudo , Yasushi Takatori , Munehiro Matsui , Masato Mizoguchi , Tadao Nakagawa , Etsushi Yamazaki , Akihide Sano , Yutaka Miyamoto , Eiji Yoshida , Shogo Yamanaka
发明人： Koichi Ishihara , Takayuki Kobayashi , Riichi Kudo , Yasushi Takatori , Munehiro Matsui , Masato Mizoguchi , Tadao Nakagawa , Etsushi Yamazaki , Akihide Sano , Yutaka Miyamoto , Eiji Yoshida , Shogo Yamanaka
IPC分类号： H04J14/06 , H04B10/00
CPC分类号： H04B10/0775 , H04B3/06 , H04B10/25133
摘要： In order to compensate for chromatic dispersion caused by optical fiber transmission in a communication system with coherent detection using optical signals, specific frequency band signals are used to enable estimation of a chromatic dispersion value. The chromatic dispersion value calculating apparatus is provided with: a signal distributing circuit which distributes, into a plurality of signal sequences, an electrical digital signal converted from received optical signals of an optical signal transmitted by an optical signal transmitting apparatus, in which a known signal with concentrated frequency components of a plurality of specific frequencies is appended to a signal generated from a transmission data sequence; a plurality of frequency band pass filter circuits, each of which separating only each of a plurality of specific frequency components in which the known signal is included from each of the signal sequences distributed by the signal distributing circuit, and passing each of the specific frequency components therethrough; a plurality of power calculating circuits which are provided so as to correspond respectively to the plurality of frequency band pass filter circuits and which calculate power values of signals output from the corresponding frequency band pass filter circuits; a delay time calculating circuit which detects times at which power has the maximum value or times at which the power exceeds a predetermined threshold value, respectively from signal sequences of the power values output from the plurality of power calculating circuits, and which compares the detected times; and a chromatic dispersion value calculating circuit which calculates a chromatic dispersion value based on a comparison result of the times by the delay time calculating circuit.
摘要翻译：为了补偿在使用光信号的相干检测的通信系统中由光纤传输引起的色散，使用特定的频带信号来使得能够估计色散值。色散值计算装置具有：信号分配电路，其将由光信号发送装置发送的光信号的接收光信号转换成的数字信号分配成多个信号序列，其中已知信号将多个特定频率的集中频率分量附加到从发送数据序列生成的信号上; 多个频带滤波器电路，每个频带通滤波器电路仅分离由信号分配电路分配的每个信号序列中包含已知信号的多个特定频率分量中的每一个，并且使每个特定频率分量通过多个功率计算电路，被设置为分别对应于所述多个频带滤波器电路，并且计算从相应的频带滤波器电路输出的信号的功率值; 延迟时间计算电路，分别从多个功率计算电路输出的功率值的信号序列中分别检测功率达到功率超过预定阈值的最大值或多次的时间，并且将延迟时间计算电路 ; 以及色散值计算电路，其基于延迟时间计算电路的时间的比较结果来计算色散值。

53. 发明申请

US20110001049A1 METHOD FOR DETECTING RADIATION, DEVICE THEREOF, AND POSITRON EMISSION TOMOGRAPHY SCANNER 有权
标题翻译：用于检测辐射的方法，其装置和位置发射扫描仪
公开(公告)号：US20110001049A1
公开(公告)日：2011-01-06
申请号：US12919358
申请日：2008-04-09
申请人： Kengo Shibuya , Taiga Yamaya , Naoko Inadama , Fumihiko Nishikido , Eiji Yoshida , Hideo Murayama
发明人： Kengo Shibuya , Taiga Yamaya , Naoko Inadama , Fumihiko Nishikido , Eiji Yoshida , Hideo Murayama
IPC分类号： G01T1/20 , G01T1/161
CPC分类号： G01T1/2985 , A61B6/037
摘要： A light receiver for detecting incident time is installed on the side of a radiation source of a scintillator (including a Cherenkov radiation emitter), and information (energy, incident time, an incident position, etc.) on radiation made incident into the scintillator is obtained by the output of the light receiver. It is, thereby, possible to identify an incident position and others of radiation into the scintillator at high accuracy.
摘要翻译：用于检测入射时间的光接收器安装在闪烁体（包括切伦科夫辐射发射器）的辐射源的一侧，并且入射到闪烁体中的辐射的信息（能量，入射时间，入射位置等）是通过光接收器的输出获得。因此，可以以高精度将入射位置和其他辐射识别到闪烁体中。

54. 发明申请

US20100032574A1 RADIATION DETECTING METHOD UTILIZING ENERGY INFORMATION AND POSITIONAL INFORMATION AND EQUIPMENT THEREOF 有权
标题翻译：辐射检测方法利用能源信息及其位置信息及其设备
公开(公告)号：US20100032574A1
公开(公告)日：2010-02-11
申请号：US12450529
申请日：2007-08-30
申请人： Eiji Yoshida , Kengo Shibuya , Taiga Yamaya , Hideo Murayama , Keishi Kitamura
发明人： Eiji Yoshida , Kengo Shibuya , Taiga Yamaya , Hideo Murayama , Keishi Kitamura
IPC分类号： G01T1/20 , G01T1/164
CPC分类号： G01T1/2985 , A61B6/037 , G01T1/1647
摘要： Upon detection of radiation by using a (three-dimensional) detector capable of distinguishing a detection position in a depth direction and energy, an energy window for distinguishing between a signal and noise is changed depending on the detection position in the depth direction, thus making it possible to obtain scattering components inside the detector. Alternatively, a weight is given to a detection event depending on the detection position in the depth direction and energy information to obtain scattering components inside the detector. Thereby, scattering components inside the detector can be obtained to increase the sensitivity of the detector. In this case, different detecting elements can be used depending on the detection position in the depth direction.
摘要翻译：通过使用能够区分深度方向的检测位置和能量的（三维）检测器来检测辐射，根据深度方向上的检测位置来改变用于区分信号和噪声的能量窗口，从而使可能在检测器内部获得散射成分。或者，根据深度方向上的检测位置和能量信息给予检测事件的权重，以获得检测器内部的散射成分。因此，可以获得检测器内部的散射分量，以提高检测器的灵敏度。在这种情况下，根据深度方向的检测位置，可以使用不同的检测元件。

55. 发明授权

US07571538B2 Vacuum fixing jig for semiconductor device 有权
标题翻译：半导体装置用真空固定夹具
公开(公告)号：US07571538B2
公开(公告)日：2009-08-11
申请号：US11075712
申请日：2005-03-10
申请人： Kazuo Teshirogi , Yuzo Shimobeppu , Kazuhiro Yoshimoto , Mitsuhisa Watanabe , Yoshiaki Shinjo , Eiji Yoshida , Noboru Hayasaka
发明人： Kazuo Teshirogi , Yuzo Shimobeppu , Kazuhiro Yoshimoto , Mitsuhisa Watanabe , Yoshiaki Shinjo , Eiji Yoshida , Noboru Hayasaka
IPC分类号： B23P19/00 , H01L21/10
CPC分类号： H01L21/67092 , B24B37/042 , B32B37/003 , B32B37/1018 , B32B38/0012 , B32B2310/0831 , B32B2457/14 , H01L21/304 , H01L21/67132 , H01L21/6836 , H01L21/6838 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2224/83191 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/01087 , H01L2924/07802 , Y10T29/5313 , Y10T29/53191 , Y10T428/1452 , H01L2924/3512 , H01L2924/00
摘要： The present invention relates to a Jig and method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.
摘要翻译：本发明涉及包括晶片的后研磨步骤，切割步骤，拾取步骤和芯片接合步骤的半导体衬底的夹具和方法; 以及用于这种方法的半导体衬底夹具。本发明的目的是减轻效果并且防止由于在减薄的半导体衬底中的强度不足而引起的损坏。提供了具有外框架21的夹具和布置在外框架21内的橡胶膜22，并且通过在其中供应空气使其形状变形而具有越来越小的体尺寸。随着橡胶膜22的体积增加，晶片固定夹具20使橡胶膜变形，并且允许布置在晶片1和橡胶膜22A之间的带2和6从中心向外逐渐推向晶片1。使用这种晶片固定夹具进行安装步骤，后研磨步骤，带重新施加步骤，拾取步骤和芯片粘合步骤。

56. 发明申请

US20090008798A1 SEMICONDUCTOR DEVICE SUITABLE FOR A STACKED STRUCTURE 有权
标题翻译：适用于堆叠结构的半导体器件
公开(公告)号：US20090008798A1
公开(公告)日：2009-01-08
申请号：US12210645
申请日：2008-09-15
申请人： Eiji Yoshida , Takao Ohno , Yoshito Akutagawa , Koji Sawahata , Masataka Mizukoshi , Takao Nishimura , Akira Takashima , Mitsuhisa Watanabe
发明人： Eiji Yoshida , Takao Ohno , Yoshito Akutagawa , Koji Sawahata , Masataka Mizukoshi , Takao Nishimura , Akira Takashima , Mitsuhisa Watanabe
IPC分类号： H01L23/52
CPC分类号： H01L21/76898 , H01L23/3128 , H01L23/481 , H01L24/05 , H01L24/13 , H01L24/16 , H01L25/0657 , H01L25/50 , H01L2224/02371 , H01L2224/0401 , H01L2224/05572 , H01L2224/06181 , H01L2224/13008 , H01L2224/13009 , H01L2224/13025 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/45144 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06551 , H01L2225/06555 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2224/05552 , H01L2924/00
摘要： A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed on a principal surface on the outer side. The hole is formed by etching, with the electrode pad serving as an etching stopper layer. An embedded electrode is formed in the hole. This embedded electrode serves to electrically lead the electrode pad to the principal surface on the bottom side of the silicon semiconductor substrate.
摘要翻译：提供一种半导体器件，其形成具有彼此堆叠的半导体器件的三维半导体器件。在该半导体器件中，在具有形成在外侧的主面上的集成电路单元和电极焊盘的硅半导体基板中形成有孔。通过蚀刻形成孔，电极焊盘用作蚀刻停止层。埋入电极形成在孔中。该嵌入电极用于将电极焊盘导电到硅半导体衬底的底侧的主表面。

57. 发明授权

US07299601B2 Device for exchanging a bottle closure 有权
标题翻译：用于更换瓶盖的装置
公开(公告)号：US07299601B2
公开(公告)日：2007-11-27
申请号：US11349878
申请日：2006-02-08
申请人： Eiji Yoshida , Keiichi Yahagi , Hiroyuki Matsunaga , Satoshi Otake , Hiroki Matsumoto , Tatsuro Ishimatsu , Yusuke Yoshida , Kagenori Nagao , Satomi Kudo , Eri Kawaguchi , Ikuo Andreas Nakayama , Yuta Ogino , Syotaro Nakajima
发明人： Eiji Yoshida , Keiichi Yahagi , Hiroyuki Matsunaga , Satoshi Otake , Hiroki Matsumoto , Tatsuro Ishimatsu , Yusuke Yoshida , Kagenori Nagao , Satomi Kudo , Eri Kawaguchi , Ikuo Andreas Nakayama , Yuta Ogino , Syotaro Nakajima
IPC分类号： B65B7/28
CPC分类号： B65D39/0052 , B67B1/00 , B67B1/045 , B67B7/04 , B67B7/0411 , B67B7/0441 , B67D2001/0481 , B67D2001/0814
摘要： A stopper change device (10) includes an airtight chamber body (21) detachably mountable on a head of a bottle, a gas supply port (19) for supplying N gas to the chamber body, an air vent valve (57) for discharging air from the chamber body, a first supporting structure (28) movable upward and downward for supporting a corkscrew, and a second supporting structure (34) movable upward and downward for containing a substitute stopper. The first and second supporting structures are mutually position changeable, and one of them is selectively placed above an opening of the bottle. When the first supporting structure (28) is placed above the opening, a bottle stopper can be pulled in N gas atmosphere. On the other hand, when the second supporting structure (34) is placed above the opening, the substitute stopper is mountable on the head of the bottle in N gas atmosphere. By changing the bottle stopper with the substitute stopper using this device, entering of air in the bottle as a cause of deterioration in a quality can be prevented.
摘要翻译：止动器更换装置（10）包括可拆卸地安装在瓶头上的气密室体（21），用于向室主体供给N气体的气体供给口（19），用于排出空气的排气阀从所述腔室主体中可以上下移动以支撑开塞钻的第一支撑结构（28）和用于容纳替代塞子的上下移动的第二支撑结构（34）。第一和第二支撑结构相互位置可变，并且其中一个被选择性地放置在瓶的开口上方。当第一支撑结构（28）放置在开口上方时，可以在N气体气氛中拉动瓶塞。另一方面，当第二支撑结构（34）位于开口上方时，替代塞子可在N气体气氛中安装在瓶头上。通过使用该装置用替代塞子更换瓶塞，可以防止质量下降的原因进入瓶子中的空气。

58. 发明申请

US20070090082A1 Bottle closure device 审中-公开
标题翻译：瓶盖装置
公开(公告)号：US20070090082A1
公开(公告)日：2007-04-26
申请号：US11639014
申请日：2006-12-14
申请人： Eiji Yoshida , Keiichi Yahagi , Hiroyuki Matsunaga , Satoshi Otake , Hiroki Matsumoto , Tatsuro Ishimatsu , Yusuke Yoshida , Kagenori Nagao , Satomi Kudo , Eri Kawaguchi , Ikuo Nakayama , Yuta Ogino , Syotaro Nakajima
发明人： Eiji Yoshida , Keiichi Yahagi , Hiroyuki Matsunaga , Satoshi Otake , Hiroki Matsumoto , Tatsuro Ishimatsu , Yusuke Yoshida , Kagenori Nagao , Satomi Kudo , Eri Kawaguchi , Ikuo Nakayama , Yuta Ogino , Syotaro Nakajima
IPC分类号： B65D51/16 , B65D39/00
CPC分类号： B65D39/0052 , B67B1/00 , B67B1/045 , B67B7/04 , B67B7/0411 , B67B7/0441 , B67D2001/0481 , B67D2001/0814
摘要： A stopper change device (10) includes an airtight chamber body (21) detachably mountable on a head of a bottle, a gas supply port (19) for supplying N gas to the chamber body, an air vent valve (57) for discharging air from the chamber body, a first supporting structure (28) movable upward and downward for supporting a corkscrew, and a second supporting structure (34) movable upward and downward for containing a substitute stopper. The first and second supporting structures are mutually position changeable, and one of them is selectively placed above an opening of the bottle. When the first supporting structure (28) is placed above the opening, a bottle stopper can be pulled in N gas atmosphere. On the other hand, when the second supporting structure (34) is placed above the opening, the substitute stopper is mountable on the head of the bottle in N gas atmosphere. By changing the bottle stopper with the substitute stopper using this device, entering of air in the bottle as a cause of deterioration in a quality can be prevented.
摘要翻译：止动器更换装置（10）包括可拆卸地安装在瓶头上的气密室体（21），用于向室主体供给N气体的气体供给口（19），用于排出空气的排气阀从所述腔室主体中可以上下移动以支撑开塞钻的第一支撑结构（28）和用于容纳替代塞子的上下移动的第二支撑结构（34）。第一和第二支撑结构相互位置可变，并且其中一个被选择性地放置在瓶的开口上方。当第一支撑结构（28）放置在开口上方时，可以在N气体气氛中拉动瓶塞。另一方面，当第二支撑结构（34）位于开口上方时，替代塞子可在N气体气氛中安装在瓶头上。通过使用该装置用替代塞子更换瓶塞，可以防止质量下降的原因进入瓶子中的空气。

59. 发明申请

US20050221588A1 Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig 有权
标题翻译：半导体装置的制造方法以及使用基板夹具固定半导体装置的方法
公开(公告)号：US20050221588A1
公开(公告)日：2005-10-06
申请号：US11075721
申请日：2005-03-10
申请人： Kazuo Teshirogi , Yuzo Shimobeppu , Kazuhiro Yoshimoto , Mitsuhisa Watanabe , Yoshiaki Shinjo , Eiji Yoshida , Noboru Hayasaka
发明人： Kazuo Teshirogi , Yuzo Shimobeppu , Kazuhiro Yoshimoto , Mitsuhisa Watanabe , Yoshiaki Shinjo , Eiji Yoshida , Noboru Hayasaka
IPC分类号： H01L21/68 , H01L21/00 , H01L21/301 , H01L21/304 , H01L21/52 , H01L21/58 , H01L21/60 , H01L21/683 , H01L21/687
CPC分类号： H01L21/67092 , B24B37/042 , B32B37/003 , B32B37/1018 , B32B38/0012 , B32B2310/0831 , B32B2457/14 , H01L21/304 , H01L21/67132 , H01L21/6836 , H01L21/6838 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2224/83191 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/01087 , H01L2924/07802 , Y10T29/5313 , Y10T29/53191 , Y10T428/1452 , H01L2924/3512 , H01L2924/00
摘要： The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.
摘要翻译：本发明涉及一种制造半导体衬底的方法，该半导体衬底包括晶片的后研磨步骤，切割步骤，拾取步骤和芯片键合步骤; 以及用于这种方法的半导体衬底夹具。本发明的目的是减轻效果并且防止由于在减薄的半导体衬底中的强度不足而引起的损坏。提供了具有外框架21的夹具和布置在外框架21内的橡胶膜22，并且通过在其中供应空气使其形状变形而具有越来越小的体尺寸。当橡胶膜22的体积增加时，晶片固定夹具20使橡胶膜变形，并且允许布置在晶片1和橡胶膜22A之间的带2和6从中心向外逐渐推向晶片1 。使用这种晶片固定夹具进行安装步骤，后研磨步骤，带重新施加步骤，拾取步骤和芯片粘合步骤。

60. 发明授权

US06824643B2 Method and device of peeling semiconductor device using annular contact members 有权
标题翻译：使用环形接触构件剥离半导体器件的方法和装置
公开(公告)号：US06824643B2
公开(公告)日：2004-11-30
申请号：US10086729
申请日：2002-03-04
申请人： Kazuhiro Yoshimoto , Kazuo Teshirogi , Eiji Yoshida
发明人： Kazuhiro Yoshimoto , Kazuo Teshirogi , Eiji Yoshida
IPC分类号： B32B3500
CPC分类号： H01L21/67132 , H01L2221/68322 , Y10S156/943 , Y10S438/976 , Y10T29/49824 , Y10T156/1179 , Y10T156/19 , Y10T156/1983
摘要： In a semiconductor device manufacturing process, a semiconductor wafer is diced into a plurality of semiconductor chips, which are then peeled, from a dicing tape, using a peeling device. The peeling device includes a plurality of annular contact members arranged one after another from the outside to the inside, and the annular contact members are operated so that the semiconductor chip is successively peeled from the tape from the outer circumferential portion thereof toward the central portion thereof.
摘要翻译：在半导体器件制造工艺中，半导体晶片被切割成多个半导体芯片，然后使用剥离装置从切割带剥离。剥离装置包括从外部向内部依次布置的多个环状接触构件，并且环状接触构件被操作，使得半导体芯片从其外周部分向其中心部分连续地从带剥离。

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