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    • 52. 发明授权
    • Plasma processing apparatus
    • 等离子体处理装置
    • US08398815B2
    • 2013-03-19
    • US12271461
    • 2008-11-14
    • Yohei YamazawaNaohiko Okunishi
    • Yohei YamazawaNaohiko Okunishi
    • C23F1/00C23C16/00H01L21/306
    • H05H1/46H01J37/32091H01J37/32174H01J37/32724
    • A plasma processing apparatus includes a processing chamber, a first radio frequency power supply for outputting a first radio frequency power, the first radio frequency power supply being electrically connected to a first electrode arranged in the processing chamber, a heater power supply for supplying electric power to a heating element provided in the first electrode, first and second power supply lines for electrically interconnecting the heating element and the heater power supply, and a filter circuit provided in the first and second power supply lines for attenuating radio frequency noises coming from the heating element. The filter circuit includes a first and a second air-core coil respectively provided on the first and the second power supply line at an initial stage of the filter circuit when viewed from the heating element, the air-core coils being in a coaxial relationship with each other and having substantially the same winding length.
    • 等离子体处理装置包括处理室,用于输出第一射频功率的第一射频电源,与配置在处理室中的第一电极电连接的第一射频电源,供给电力的加热器电源 提供给设置在第一电极中的加热元件,用于将加热元件和加热器电源电连接的第一和第二电源线,以及设置在第一和第二电源线中的用于衰减来自加热器的射频噪声的滤波器电路 元件。 滤波器电路包括在从加热元件观察时在滤波电路的初始阶段分别设置在第一和第二电源线上的第一和第二空心线圈,空芯线圈与 彼此具有基本相同的卷绕长度。
    • 53. 发明申请
    • PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
    • 等离子体加工设备和等离子体处理方法
    • US20120223060A1
    • 2012-09-06
    • US13410487
    • 2012-03-02
    • Yohei Yamazawa
    • Yohei Yamazawa
    • B23K10/00
    • H05H1/46H05H2001/4667H05H2001/4682
    • In an inductively coupled plasma processing apparatus, an RF antenna 54 provided on a dielectric window 52 is split into an inner coil 58, an intermediate coil 60, and an outer coil 62 in a radial direction. When traveling along each of the coils from a high frequency power supply 72 to a ground potential member via a RF power supply line 68, the RF antenna 54, and an earth line 70, a direction passing through the inner coil 58 and the outer coil 62 is a counterclockwise direction, whereas a direction passing through the intermediate coil 60 is a clockwise direction. Further, a variable intermediate capacitor 86 and a variable outer capacitor 88 are electrically connected in series with the intermediate coil 60 and the outer coil 62, respectively, between the first and second nodes NA and NB.
    • 在电感耦合等离子体处理装置中,设置在电介质窗口52上的RF天线54在径向上分成内线圈58,中间线圈60和外线圈62。 当通过RF电源线68,RF天线54和接地线70沿着每个线圈从高频电源72到达地电位部件行进通过内线圈58和外线圈 62是逆时针方向,而通过中间线圈60的方向是顺时针方向。 此外,可变中间电容器86和可变外部电容器88分别与第一和第二节点NA和NB之间的中间线圈60和外部线圈62串联电连接。
    • 54. 发明申请
    • PLASMA PROCESSING APPARATUS
    • 等离子体加工设备
    • US20120073756A1
    • 2012-03-29
    • US13246049
    • 2011-09-27
    • Yohei Yamazawa
    • Yohei Yamazawa
    • C23F1/08C23C16/505
    • H01J37/321H01J37/3211
    • There is provided an inductively coupled plasma etching apparatus capable of suppressing a wavelength effect within a RF antenna and performing a plasma process uniformly in both a circumferential and a radial direction. In the plasma etching apparatus, a RF antenna 54 is provided on a dielectric window 52 to generate inductively coupled plasma. The RF antenna 54 includes an inner coil 58, an intermediate coil 60 and an outer coil 62 in the radial direction. The inner coil 58 includes a single inner coil segment 59 or more than one inner coil segments 59 connected in series. The intermediate coil 60 includes two intermediate coil segments 61(1) and 61(2) separated in a circumferential direction and electrically connected with each other in parallel. The outer coil 62 includes three outer coil segments 63(1), 63(2) and 63(3) separated in a circumferential direction and electrically connected with each other in parallel.
    • 提供了一种电感耦合等离子体蚀刻装置,其能够抑制RF天线内的波长效应,并且在周向和径向均匀地执行等离子体处理。 在等离子体蚀刻装置中,在电介质窗口52上设置RF天线54,以产生电感耦合等离子体。 RF天线54包括径向的内线圈58,中间线圈60和外线圈62。 内部线圈58包括单个内部线圈段59或多个串联连接的内部线圈段59。 中间线圈60包括沿圆周方向分离并且彼此并联电连接的两个中间线圈段61(1)和61(2)。 外侧线圈62包括在圆周方向上分离并且并联电连接的三个外部线圈段63(1),63(2)和63(3)。
    • 56. 发明授权
    • Method of detecting etching depth
    • 检测蚀刻深度的方法
    • US06448094B2
    • 2002-09-10
    • US09769307
    • 2001-01-26
    • Yohei YamazawaYoshihito Ookawa
    • Yohei YamazawaYoshihito Ookawa
    • H01L2100
    • H01L22/26
    • A method of detecting an etching depth of a target object includes the steps of irradiating an etching layer of the target object that is being etched in an etching section with light having a plurality of components differing from each other in a wavelength, detecting a plurality of interference light components differing from each other in the wavelength and having an intensity periodically changed by the light components reflected from an upper surface of the etching layer and a surface of the etching section, applying a frequency analysis to these interference light components so as to obtain the frequency of each of these interference wave forms in which the intensity forms the amplitude, calculating an etching rate corresponding to each interference wave form by using the frequency of the interference wave form, and obtaining an etching depth from the etching rate.
    • 一种检测目标物体的蚀刻深度的方法包括以下步骤:在具有波长的多个成分彼此不同的光的光的照射部分中照射被蚀刻的目标物体的蚀刻层,检测多个 干涉光分量在波长上彼此不同,并且具有由从蚀刻层的上表面和蚀刻部分的表面反射的光分量周期性地改变的强度,对这些干涉光分量施加频率分析,以获得 通过使用干涉波形的频率计算与每个干涉波形成对应的蚀刻速率,并且从蚀刻速率获得蚀刻深度,这些干涉波形成中的每一个的频率成为强度形成振幅。
    • 57. 发明授权
    • Plasma processing apparatus and plasma processing method
    • 等离子体处理装置和等离子体处理方法
    • US09218943B2
    • 2015-12-22
    • US13246139
    • 2011-09-27
    • Yohei Yamazawa
    • Yohei Yamazawa
    • C23C16/00C23F1/00H01L21/306H01J37/32
    • H01J37/321H01J37/3211H01J37/32174
    • There is provided an inductively coupled plasma processing apparatus capable of reducing a RF power loss within a high frequency power supply unit (particularly, a matching unit) and capable of enhancing a plasma generation efficiency. In this inductively coupled plasma processing apparatus, a multiple number of closed-loop secondary circuits 96, 98 independent from each other are formed between a coaxial antenna group 54 and a transformer 68. Further, by varying electrostatic capacitances of variable capacitors 64 and 66, secondary currents I2A and I2B flowing through an inner antenna 58 and an outer antenna 60, respectively, of the coaxial antenna group 54 are independently controlled. Accordingly, it is possible to readily control a plasma density distribution on a semiconductor wafer W in a diametrical direction.
    • 提供了一种电感耦合等离子体处理装置,其能够降低高频电源单元(特别是匹配单元)内的RF功率损耗,并且能够提高等离子体产生效率。 在该电感耦合等离子体处理装置中,在同轴天线组54和变压器68之间形成多个彼此独立的闭环次级电路96,98。此外,通过改变可变电容器64和66的静电电容, 独立地控制分别流过同轴天线组54的内部天线58和外部天线60的二次电流I2A和I2B。 因此,可以容易地控制半导体晶片W沿直径方向的等离子体密度分布。
    • 58. 发明申请
    • PLASMA PROCESSING APPARATUS
    • 等离子体加工设备
    • US20120247679A1
    • 2012-10-04
    • US13434922
    • 2012-03-30
    • Yohei Yamazawa
    • Yohei Yamazawa
    • B05C9/00H01L21/3065
    • H01J37/3211H01J37/321H01J37/3244H01J37/32715
    • In an inductively coupled plasma processing apparatus, it is possible to control a plasma density distribution while suppressing a wavelength effect within a RF antenna. Provided at a ceiling of a chamber 10 or above a dielectric window 52 is a circular ring-shaped RF antenna 54 for generating inductively coupled plasma within the chamber 10. This RF antenna 54 includes two coil segments 84(1) and 84(2) each having a semicircular arc shape. The coil segments 84(1) and 84(2) are electrically connected to each other in parallel with respect to a high frequency power supply unit 62. On the dielectric window 52, a circular ring-shaped floating coil 60 having a variable capacitor 58 coupled to the RF antenna 54 by an electromagnetic induction is provided. The variable capacitor 58 is varied in a certain range by a capacitance varying unit 82 under the control of a main controller 80.
    • 在电感耦合等离子体处理装置中,可以抑制RF天线内的波长效应,同时控制等离子体密度分布。 在介质窗52的室10的顶部设置有用于在室10内产生电感耦合等离子体的圆形环形RF天线54.该RF天线54包括两个线圈段84(1)和84(2) 每个都具有半圆弧形。 线圈段84(1)和84(2)相对于高频电源单元62并联地电连接。在电介质窗口52上,具有可变电容器58的圆形环形浮动线圈 提供了通过电磁感应耦合到RF天线54。 可变电容器58在主控制器80的控制下由电容变化单元82在一定范围内变化。
    • 60. 发明申请
    • PLASMA PROCESSING APPARATUS AND METHOD
    • 等离子体加工设备和方法
    • US20100252198A1
    • 2010-10-07
    • US12816440
    • 2010-06-16
    • Yohei YamazawaNoriaki Imai
    • Yohei YamazawaNoriaki Imai
    • H01L21/465
    • H01J37/32321H01J37/32091H01J37/32183H01L21/3065
    • In a plasma processing apparatus in which a radio-frequency power from a radio-frequency power source is supplied to an electrode disposed in a process vessel, to thereby generate, in the process vessel, plasma with which a substrate is processed, a chemical component emitting member which is caused to emit a chemical component necessary for processing the substrate into the process vessel by entrance of ions in the plasma generated in the process vessel is provided in the process vessel in an exposed state, and an impedance varying circuit varying impedance on the chemical component emitting member side of the plasma generated in the process vessel to frequency of the radio-frequency power source is connected to the chemical component emitting member.
    • 在等离子体处理装置中,将来自射频电源的射频功率供给到设置在处理容器中的电极,从而在处理容器中产生加工有基板的等离子体,化学成分 通过在处理容器中产生的等离子体中的离子的入射将基板发射到处理容器中所需的化学成分被发射到处理容器中,并且阻抗变化电路在 将处理容器中产生的等离子体的化学成分发射部分侧与射频电源的频率连接到化学成分发射部件。