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    • 51. 发明申请
    • Semiconductor laser apparatus and method of manufacturing the same
    • 半导体激光装置及其制造方法
    • US20050242361A1
    • 2005-11-03
    • US11093024
    • 2005-03-30
    • Yasuyuki BesshoMasayuki HataDaijiro Inoue
    • Yasuyuki BesshoMasayuki HataDaijiro Inoue
    • H01L21/00H01S5/026H01S5/22H01S5/40H01L33/00
    • H01S5/4025H01S5/4087
    • Second and third p-side pad electrodes are formed on an insulating film of a blue-violet semiconductor laser device on both sides of a first p-side pad electrode. The second p-side pad electrode and the third p-side pad electrode are formed separately from each other. Solder films are formed on the upper surfaces of the second and third p-side pad electrodes respectively. A fourth p-side pad electrode of a red semiconductor laser device is bonded onto the second p-side pad electrode with the corresponding solder film sandwiched therebetween. A fifth p-side pad electrode of an infrared semiconductor laser device is bonded onto the third p-side pad electrode with the corresponding solder film sandwiched therebetween. The second and third p-side pad electrodes are formed separately from each other, so that the fourth and fifth p-side pad electrodes are electrically isolated from each other.
    • 第二和第三p侧焊盘电极形成在第一p侧焊盘电极两侧的蓝紫色半导体激光器件的绝缘膜上。 第二p侧焊盘电极和第三p侧焊盘电极彼此分开地形成。 焊接膜分别形成在第二和第三p侧焊盘电极的上表面上。 红色半导体激光器件的第四p侧焊盘电极被粘合到第二p侧焊盘电极上,其中夹有相应的焊料膜。 红外半导体激光器件的第五p侧焊盘电极被粘合到第三p侧焊盘电极上,其中夹有相应的焊料膜。 第二和第三p侧焊盘电极彼此分开地形成,使得第四和第五p侧焊盘电极彼此电隔离。