专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

51. 发明授权

US07579686B2 Thermal interface material with hotspot heat remover 有权
标题翻译：热界面材料与热点除热器
公开(公告)号：US07579686B2
公开(公告)日：2009-08-25
申请号：US11618593
申请日：2006-12-29
申请人： Xuejiao Hu , Chia-Pin Chiu
发明人： Xuejiao Hu , Chia-Pin Chiu
IPC分类号： H01L23/10 , H01L23/34
CPC分类号： H01L23/42 , H01L23/367 , H01L23/4275 , H01L2924/0002 , H01L2924/00
摘要： The formation of electronic assemblies including a heat spreader coupled to a die through a thermal interface material is described. In one embodiment, the heat spreader includes a surface having a structure extending a distance outward therefrom. The thermal interface material includes a first region having a first thickness and a second region having a second thickness, the first thickness being smaller than the second thickness. The structure extending a distance outward from the heat spreader is positioned on the first region of the thermal interface material. The total of the first thickness of the thermal interface material and the distance the structure extends outward from the surface of the heat spreader is substantially the same as the second thickness. In one aspect of certain embodiments, the first region of the thermal interface material and the structure on the heat spreader are in alignment with a hot spot on the die. Other embodiments are described and claimed.
摘要翻译：描述了包括通过热界面材料耦合到管芯的散热器的电子组件的形成。在一个实施例中，散热器包括具有向外延伸一定距离的结构的表面。热界面材料包括具有第一厚度的第一区域和具有第二厚度的第二区域，第一厚度小于第二厚度。从散热器向外延伸一定距离的结构位于热界面材料的第一区域上。热界面材料的第一厚度和结构从散热器表面向外延伸的距离的总和基本上与第二厚度相同。在某些实施方案的一个方面，热界面材料的第一区域和散热器上的结构与模具上的热点对准。描述和要求保护其他实施例。

52. 发明授权

US07332423B2 Soldering a die to a substrate 有权
标题翻译：将模具焊接到基板上
公开(公告)号：US07332423B2
公开(公告)日：2008-02-19
申请号：US11170188
申请日：2005-06-29
申请人： Robert Starkston , Sridhar Narasimhan , Chia-Pin Chiu , Suzana Prstic , Patrick N Stover , Hong Xie
发明人： Robert Starkston , Sridhar Narasimhan , Chia-Pin Chiu , Suzana Prstic , Patrick N Stover , Hong Xie
IPC分类号： H01L21/44
CPC分类号： H01L24/81 , H01L21/563 , H01L2224/14051 , H01L2224/73203 , H01L2224/81141 , H01L2224/81193 , H01L2224/81345 , H01L2224/81801 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/303 , H05K3/3436 , H05K3/3457 , H05K2201/094 , H05K2201/09781 , H05K2201/10674 , H05K2203/167 , Y02P70/613
摘要： One example electronic assembly includes a substrate that has a plurality of contacts which become bonded to a plurality of contacts on a die. The electronic assembly further includes a male member that extends from at least one of the substrate and the die and a female member that extends from the other of the substrate and the die. The male member is inserted into the female member to align the die relative to the substrate. The male member and the female member may have any configuration as long as one or more portions of the male member extend partially, or wholly, into the female member. An example method includes aligning a die relative to a substrate by inserting a male member that extends from one of the die and the substrate into a female member that extends from the other of the die and the substrate.
摘要翻译：一个示例性电子组件包括具有多个接触件的基板，该多个触点被结合到模具上的多个触点。电子组件还包括从基板和模具中的至少一个延伸的阳构件和从基板和模具中的另一个延伸的阴构件。将阳构件插入阴构件中以使模具相对于衬底对准。阳构件和阴构件可以具有任何构造，只要阳构件的一个或多个部分部分地或全部地延伸到阴构件中即可。一种示例性方法包括通过将从模具和基板中的一个延伸的阳构件插入从模具和基板中的另一个延伸的凹形构件中来相对于基板对准模具。

53. 发明授权

US07327028B2 Embedded heat spreader for folded stacked chip-scale package 有权
标题翻译：嵌入式散热器用于折叠堆叠芯片级封装
公开(公告)号：US07327028B2
公开(公告)日：2008-02-05
申请号：US10788071
申请日：2004-02-24
申请人： Chia-Pin Chiu
发明人： Chia-Pin Chiu
IPC分类号： H01L23/34
CPC分类号： H01L25/0652 , H01L23/5387 , H01L2224/48227 , H05K1/0206
摘要： In some embodiments, a T-shaped heat spreader may be provided centrally within a folded stacked chip-scale package. The dice may be situated around the T-shaped heat spreader which may be made of high conductivity material. Heat may be dissipated through the T-shaped spreader 24 and downwardly through thermal vias into a printed circuit board.
摘要翻译：在一些实施例中，T形散热器可以在折叠的堆叠芯片级封装内集中提供。骰子可以位于可由高导电性材料制成的T形散热器周围。热量可以通过T形吊具24散开，并通过热通孔向下散布到印刷电路板中。

54. 发明授权

US07202111B2 Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device 有权
标题翻译：在热源和散热装置之间设置热界面材料的方法和装置
公开(公告)号：US07202111B2
公开(公告)日：2007-04-10
申请号：US10882511
申请日：2004-06-30
申请人： Chia-Pin Chiu
发明人： Chia-Pin Chiu
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/36 , H01L21/563 , H01L23/04 , H01L23/3128 , H01L23/42 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/01079 , H01L2924/1433 , H01L2924/15311 , H01L2924/16151 , H01L2924/16152 , H01L2924/16251 , H01L2924/00
摘要： A microelectronic package and a method of forming the same comprising a microelectronic device attached by an active surface to a substrate. A heat dissipation device having a base portion is positioned over a back surface of the microelectronic device and having at least one lip portion extending from the base portion which is attached to the substrate. An inlet extends through the heat dissipation device base portion and is positioned to be over the microelectronic device back surface. A thermal interface material is dispensed through the inlet and by capillary action is drawn between the microelectronic device back surface and the heat dissipation device base portion.
摘要翻译：一种微电子封装及其形成方法，包括通过有源表面附着到衬底的微电子器件。具有基部的散热装置位于微电子装置的后表面上方，并且具有至少一个从附接到基板的基部延伸的唇部。入口延伸穿过散热装置底座部分并且定位成位于微电子器件背面上方。通过入口分配热界面材料，并且通过在微电子器件背表面和散热装置基部之间的毛细作用被拉伸。

55. 发明申请

US20070001318A1 Soldering a die to a substrate 有权
标题翻译：将模具焊接到基板上
公开(公告)号：US20070001318A1
公开(公告)日：2007-01-04
申请号：US11170188
申请日：2005-06-29
申请人： Robert Starkston , Sridhar Narasimhan , Chia-Pin Chiu , Suzana Prstic , Patrick Stover , Hong Xie
发明人： Robert Starkston , Sridhar Narasimhan , Chia-Pin Chiu , Suzana Prstic , Patrick Stover , Hong Xie
IPC分类号： H01L23/48
CPC分类号： H01L24/81 , H01L21/563 , H01L2224/14051 , H01L2224/73203 , H01L2224/81141 , H01L2224/81193 , H01L2224/81345 , H01L2224/81801 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/303 , H05K3/3436 , H05K3/3457 , H05K2201/094 , H05K2201/09781 , H05K2201/10674 , H05K2203/167 , Y02P70/613
摘要： One example electronic assembly includes a substrate that has a plurality of contacts which become bonded to a plurality of contacts on a die. The electronic assembly further includes a male member that extends from at least one of the substrate and the die and a female member that extends from the other of the substrate and the die. The male member is inserted into the female member to align the die relative to the substrate. The male member and the female member may have any configuration as long as one or more portions of the male member extend partially, or wholly, into the female member. An example method includes aligning a die relative to a substrate by inserting a male member that extends from one of the die and the substrate into a female member that extends from the other of the die and the substrate.
摘要翻译：一个示例性电子组件包括具有多个接触件的基板，该多个触点被结合到模具上的多个触点。电子组件还包括从基板和模具中的至少一个延伸的阳构件和从基板和模具中的另一个延伸的阴构件。将阳构件插入阴构件中以使模具相对于衬底对准。阳构件和阴构件可以具有任何构造，只要阳构件的一个或多个部分部分地或全部地延伸到阴构件中即可。一种示例性方法包括通过将从模具和基板中的一个延伸的阳构件插入从模具和基板中的另一个延伸的凹形构件中来相对于基板对准模具。

56. 发明申请

US20050245060A1 Package design using thermal linkage from die to printed circuit board 有权
标题翻译：封装设计采用从芯片到印刷电路板的热连接
公开(公告)号：US20050245060A1
公开(公告)日：2005-11-03
申请号：US10836329
申请日：2004-05-03
申请人： Chia-Pin Chiu
发明人： Chia-Pin Chiu
IPC分类号： H01L21/50 , H01L23/367
CPC分类号： H01L23/3677 , H01L24/73 , H01L2224/1403 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06568 , H01L2924/01078 , H01L2924/01087 , H01L2924/10253 , H01L2924/14 , H01L2924/15151 , H01L2924/15159 , H01L2924/15311 , H01L2924/16152 , H01L2924/00 , H01L2924/00012
摘要： A substrate is provided that may include an area designated for mounting of an integrated circuit and one or more areas for retaining a thermal interface material proximate the integrated circuit mounting area. A thermal interface material containment area(s) may be formed by creating a through-hole in the substrate, or a recess in the substrate that opens either to the die placement side or the opposite side of the substrate.
摘要翻译：提供了一种基板，其可以包括指定用于集成电路的安装的区域和用于在靠近集成电路安装区域保持热界面材料的一个或多个区域。热界面材料容纳区域可以通过在基板中形成通孔而形成，或者在基板中的凹槽中形成，该凹槽向基板的模具放置侧或相对侧开口。

57. 发明授权

US06840794B2 Apparatus and methods for cooling a processor socket 失效
标题翻译：用于冷却处理器插座的装置和方法
公开(公告)号：US06840794B2
公开(公告)日：2005-01-11
申请号：US10403648
申请日：2003-03-31
申请人： Chia-Pin Chiu
发明人： Chia-Pin Chiu
IPC分类号： H01L23/467 , H05K7/10 , H05K7/20 , H01R4/60 , H01R13/00
CPC分类号： H01L23/467 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05548 , H01L2224/05569 , H01L2224/0557 , H01L2224/16 , H05K7/1092 , H05K7/20 , H01L2224/05611 , H01L2924/00014 , H01L2224/05644 , H01L2224/05647 , H01L2224/05111 , H01L2224/05144 , H01L2224/05147
摘要： Contact pin temperature of a semiconductor package is reduced by forcing air into a region between a circuit board and a socket body. A sealant around the perimeter of the socket body at least in part seals the socket body with the circuit board, allowing the forced gas to flow through cavities containing the contacts, thereby cooling the contacts and the package pins. The contact-pin temperature may be reduced, allowing power pins to carry more current. Accordingly, microprocessors and processing systems may be operated at higher data rates without reducing reliability or increasing contact-pin oxidation.
摘要翻译：通过迫使空气进入电路板和插座体之间的区域来减小半导体封装的接触针温度。围绕插座主体的周边的密封剂至少部分地将插座主体与电路板密封，从而允许强制气体流过包含触点的空腔，从而冷却触点和封装引脚。触点引脚温度可能会降低，从而允许电源引脚承载更多的电流。因此，微处理器和处理系统可以以更高的数据速率运行，而不降低可靠性或增加接触针氧化。

58. 发明授权

US06794748B1 Substrate-less microelectronic package 有权
标题翻译：无基板微电子封装
公开(公告)号：US06794748B1
公开(公告)日：2004-09-21
申请号：US10421310
申请日：2003-04-22
申请人： Chia-Pin Chiu
发明人： Chia-Pin Chiu
IPC分类号： H01L2334
CPC分类号： H01L21/563 , H01L23/36 , H01L23/427 , H01L24/48 , H01L25/0657 , H01L2224/05001 , H01L2224/05023 , H01L2224/05568 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2225/06517 , H01L2225/06555 , H01L2225/06582 , H01L2225/06586 , H01L2225/06589 , H01L2924/00014 , H01L2924/00015 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399 , H01L2924/00012 , H01L2224/05099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic die assembly including a heat dissipation device serving as a support structure for the assembly is described. A first microelectronic die is attached by a back surface to a first surface of the heat dissipation device. A first plurality of interconnects are disposed on an active surface of the first microelectronic die. A second microelectronic die is attached by a back surface to the first microelectronic die active surface. A second plurality of interconnects are disposed on an active surface of the second microelectronic die. Any appropriate number of microelectronic dice may be stacked in a like fashion.
摘要翻译：描述了一种微电子模具组件，其包括用作组件的支撑结构的散热装置。第一微电子管芯通过后表面附接到散热装置的第一表面。第一多个互连件设置在第一微电子管芯的有源表面上。第二微电子管芯通过后表面附接到第一微电子管芯有源表面。第二多个互连设置在第二微电子管芯的有源表面上。任何适当数量的微电子管芯可以以类似的方式堆叠。

59. 发明授权

US06767765B2 Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device 失效
公开(公告)号：US06767765B2
公开(公告)日：2004-07-27
申请号：US10112834
申请日：2002-03-27
申请人： Chia-Pin Chiu
发明人： Chia-Pin Chiu
IPC分类号： H01L2144
CPC分类号： H01L23/36 , H01L21/563 , H01L23/04 , H01L23/3128 , H01L23/42 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/01079 , H01L2924/1433 , H01L2924/15311 , H01L2924/16151 , H01L2924/16152 , H01L2924/16251 , H01L2924/00
摘要： A microelectronic package and a method of forming the same comprising a microelectronic device attached by an active surface to a substrate. A heat dissipation device having a base portion is positioned over a back surface of the microelectronic device and having at least one lip portion extending from the base portion which is attached to the substrate. An inlet extends through the heat dissipation device base portion and is positioned to be over the microelectronic device back surface. A thermal interface material is dispensed through the inlet and by capillary action is drawn between the microelectronic device back surface and the heat dissipation device base portion.

60. 发明授权

US06626681B2 Integrated socket for microprocessor package and cache memory 有权
标题翻译：用于微处理器封装和高速缓存的集成插座
公开(公告)号：US06626681B2
公开(公告)日：2003-09-30
申请号：US10080867
申请日：2002-02-21
申请人： Chia-Pin Chiu
发明人： Chia-Pin Chiu
IPC分类号： H01R1200
CPC分类号： H05K7/1092 , G06F1/183 , Y10S439/946
摘要： A socket comprises a socket body having a bottom surface at which the socket can be mounted to a motherboard, a top surface, and several side surfaces. The top surface has an array of electrical contacts at which a package containing a microprocessor can be coupled to the socket. One or more of the side surfaces have a slot, which includes an electrical interface at which a circuit card containing cache memory for use by the microprocessor can be removably inserted into the socket body parallel to the motherboard.
摘要翻译：插座包括具有底表面的插座本体，该插座可以在该底表面处安装到主板，顶表面和几个侧表面。顶表面具有电触头阵列，在该触点阵列处，包含微处理器的封装可以耦合到插座。一个或多个侧表面具有槽，其包括电接口，在该电接口处包含用于由微处理器使用的高速缓冲存储器的电路卡可以在该电接口处平行于主板可拆卸地插入到插座主体中。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式